Cover for a semiconductor carrier

The ornamental design for a cover for a semiconductor carrier, as shown and described.

FIG. 1 is a top perspective view of a cover for a semiconductor carrier of our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a top view thereof;

FIG. 5 is a bottom view thereof;

FIG. 6 is a right-end view thereof; and,

FIG. 7 is a left-end view thereof.

The broken line showing of the environment is for illustrative purpose only and forms no part of the claimed design.

Patent

Priority

Assignee

Title

Patent	Priority	Assignee	Title
5451165,	Jul 27 1994	Minnesota Mining and Manufacturing Company	Temporary package for bare die test and burn-in
5519332,	Jun 04 1991	Micron Technology, Inc.	Carrier for testing an unpackaged semiconductor die
5541525,	Jun 04 1991	Micron Technology, Inc.	Carrier for testing an unpackaged semiconductor die
20010043074,
20040016993,
D359028,	Sep 02 1993	SGS-Thomson Microelectronics, Inc	Socketed integrated circuit package
D401567,	Apr 25 1997	Micron Technology, Inc.	Temporary package for semiconductor dice

Executed on	Assignor	Assignee	Conveyance	Frame	Reel	Doc
Jun 10 2005		Yamaichi Electronics Co., Ltd	(assignment on the face of the patent)

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