Patent
   D864884
Priority
Oct 23 2017
Filed
Apr 05 2018
Issued
Oct 29 2019
Expiry
Oct 29 2034
Assg.orig
Entity
unknown
23
14
n/a
The ornamental design for a semiconductor device, as shown and described.

FIG. 1 is a front, bottom and right side perspective view of a semiconductor device showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a top view thereof;

FIG. 5 is a bottom view thereof;

FIG. 6 is a left side view thereof; and,

FIG. 7 is a right side view thereof.

The broken lines illustrate portions of the semiconductor device that form no part of the claimed designs.

Yamashita, Akihiko, Ando, Masayuki, Yoneyama, Rei, Tsukamoto, Hideki, Aoki, Nobuchika

Patent Priority Assignee Title
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D969763, May 29 2019 DIODES INCORPORATED Leadframe
D969764, May 29 2019 Diodes Incorported Leadframe
D974311, Jul 31 2020 Rohm Co., Ltd. Semiconductor module
D975666, Jul 31 2020 Rohm Co., Ltd. Semiconductor module
D976852, Apr 24 2020 Industrial Technology Research Institute Power module
D980811, May 29 2019 DIODES INCORPORATED Leadframe
D983759, May 31 2019 Fuji Electric Co., Ltd. Semiconductor module
D985518, May 29 2019 DIODES INCORPORATED Leadframe
Patent Priority Assignee Title
7425757, Dec 22 2003 FUJI ELECTRIC CO , LTD Semiconductor power module
20100149774,
D288557, Sep 10 1984 Semiconductor Components Industries, LLC Semiconductor housing
D441726, Jul 14 1999 Kabushiki Kaisha Toyoda Jidoshokki Seisakusho Semiconductor element
D556686, Apr 27 2006 Hitachi, LTD Power module for power inverter
D589012, Mar 17 2008 Fuji Electric Device Technology Co., Ltd. Semiconductor device
D704671, Jan 24 2013 Fuji Electric Co., Ltd. Semiconductor device
D705184, Jul 11 2013 Fuji Electric Co., Ltd. Semiconductor module
D712853, Dec 21 2012 Fuji Electric Co., Ltd.; FUJI ELECTRIC CO , LTD Semiconductor module
D719537, May 08 2013 Mitsubishi Electric Corporation Semiconductor device
D721048, Jun 17 2013 FUJI ELECTRIC CO , LTD Semiconductor module
D759604, Jun 17 2015 Mitsubishi Electric Corporation Semiconductor device
D773413, Feb 04 2015 Mitsubishi Electric Corporation Semiconductor device
D805485, Aug 21 2013 Mitsubishi Electric Corporation Semiconductor device
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Mar 26 2018YONEYAMA, REIMitsubishi Electric CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0454510035 pdf
Mar 26 2018AOKI, NOBUCHIKAMitsubishi Electric CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0454510035 pdf
Mar 26 2018YAMASHITA, AKIHIKOMitsubishi Electric CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0454510035 pdf
Mar 27 2018TSUKAMOTO, HIDEKIMitsubishi Electric CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0454510035 pdf
Mar 27 2018ANDO, MASAYUKIMitsubishi Electric CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0454510035 pdf
Apr 05 2018Mitsubishi Electric Corporation(assignment on the face of the patent)
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