Patent
   D933618
Priority
Oct 31 2018
Filed
Jun 26 2019
Issued
Oct 19 2021
Expiry
Oct 19 2036
Assg.orig
Entity
unknown
3
29
n/a
The ornamental design for a semiconductor module, as shown and described.

FIG. 1 is a front view of a semiconductor module showing our new design;

FIG. 2 is a rear view of the semiconductor module thereof;

FIG. 3 is a left view of the semiconductor module thereof;

FIG. 4 is a right view of the semiconductor module thereof;

FIG. 5 is a top side view of the semiconductor module thereof; and,

FIG. 6 is a bottom side view of the semiconductor module thereof.

The thinner lines other than a thicker line in the front view, the rear view, the left side view the right side view, the top view, and the bottom view represents a shape of a three-dimensional shape.

Shirata, Osamu, Hidaka, Yusuke

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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jun 26 2019Asahi Kasei Microdevices Corporation(assignment on the face of the patent)
Jul 30 2019HIDAKA, YUSUKEAsahi Kasei Microdevices CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0501350215 pdf
Aug 05 2019SHIRATA, OSAMUAsahi Kasei Microdevices CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0501350215 pdf
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