FIG. 1 is a perspective view of a semiconductor device according to a first embodiment of the present invention;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a top view thereof;
FIG. 7 is a bottom view thereof;
FIG. 8 is a cross sectional view thereof taken along line 8-8;
FIG. 9 is a perspective view of a semiconductor device according to a second embodiment of the present invention;
FIG. 10 is a front view thereof;
FIG. 11 is a rear view thereof;
FIG. 12 is a left side view thereof,
FIG. 13 is a right side view thereof;
FIG. 14 is a top view thereof;
FIG. 15 is a bottom view thereof;
FIG. 16 is a cross sectional view thereof taken along line 16-16;
FIG. 17 is a perspective view of a semiconductor device according to a third embodiment of the present invention;
FIG. 18 is a front view thereof;
FIG. 19 is a rear view thereof;
FIG. 20 is a left side view thereof;
FIG. 21 is a right side view thereof;
FIG. 22 is a top view thereof;
FIG. 23 is a bottom view thereof; and,
FIG. 24 is a cross sectional view thereof taken along line 26-26.
The dash-dash broken lines in the drawings are for the purpose of illustrating portions of the article that form no part of the claimed design. The dash-dot broken lines in the drawings are for the purpose of illustrating a boundary and form no part of the claimed design.