Patent
   D345963
Priority
Oct 30 1991
Filed
Apr 29 1992
Issued
Apr 12 1994
Expiry
Apr 12 2008
Assg.orig
Entity
unknown
3
3
n/a
The ornamental design for a hybrid integrated circuit, as shown.

FIG. 1 is a top, front and right side perspective view of our new design for a hybrid integrated circuit;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a right side elevational view thereof; and,

FIG. 7 is a left side elevational view thereof.

Kobayashi, Kenichi, Ueno, Masakazu, Kanaya, Masahito

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Patent Priority Assignee Title
4727410, Nov 23 1983 POLESE COMPANY, INC High density integrated circuit package
4942380, Jan 23 1989 Motorola, Inc. Housing assembly having flexible shield and insulator
5032953, Aug 15 1990 PULSE ELECTRONICS, INC Surface mounted single in-line electronic component package with mounting projections and chamfered viewing edge
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Apr 23 1992KANAYA, MASAHITOSANYO ELECTRIC CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST 0061110778 pdf
Apr 23 1992UENO, MASAKAZUSANYO ELECTRIC CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST 0061110778 pdf
Apr 23 1992KOBAYASHI, KENICHISANYO ELECTRIC CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST 0061110778 pdf
Apr 29 1992Sanyo Electric Co., Ltd.(assignment on the face of the patent)
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