FIG. 1 is a top perspective view of a flip chip showing my new design;
FIG. 2 is a front view thereof;
FIG. 3 is a back view thereof;
FIG. 4 is a left view thereof;
FIG. 5 is a right view thereof;
FIG. 6 is a top view thereof;
FIG. 7 is a bottom view thereof; and,
FIG. 8 is a bottom perspective view thereof.
Patent |
Priority |
Assignee |
Title |
5844307, |
Jul 31 1995 |
NEC Corporation |
Plastic molded IC package with leads having small flatness fluctuation |
5905639, |
Sep 29 1997 |
Raytheon Company |
Three-dimensional component stacking using high density multichip interconnect decals and three-bond daisy-chained wedge bonds |
6211572, |
Oct 31 1995 |
TESSERA, INC , A CORPORATION OF DELAWARE |
Semiconductor chip package with fan-in leads |
6381143, |
Dec 17 1999 |
Kabushiki Kaisha Toshiba |
Card-typed electronic apparatus having a flat card case housing a plurality of electronic parts |
6410355, |
Jun 11 1998 |
SanDisk Technologies LLC |
Semiconductor package using terminals formed on a conductive layer of a circuit board |
20020131251, |
|
|
|
D345963, |
Oct 30 1991 |
Sanyo Electric Co., Ltd. |
Hybrid integrated circuit |
D365092, |
Aug 12 1993 |
Siemens Aktiengesellschaft |
Chipcard module |
D379350, |
Aug 10 1993 |
International Business Machines Corporation |
Expanded jacketted circuit card |
D406821, |
Mar 06 1997 |
Siemens Aktiengesellschaft |
Carrier element for a semiconductor chip for integration into a chipcard, or a chipcard module |
D406822, |
Mar 06 1997 |
Siemens Aktiengesellschaft |
Carrier element for a semiconductor chip for integration into a chipcard, or a chipcard module |
D416236, |
Sep 02 1998 |
SII CRYSTAL TECHNOLOGY INC |
Integrated circuit package |
D453746, |
Jul 26 2001 |
Taiyo Yuden Co., Ltd. |
Hybrid integrated circuit device |
D456367, |
Dec 15 2000 |
Protek Devices, LP |
Semiconductor chip |
D456787, |
Dec 08 2000 |
Taiyo Yuden Co., Ltd. |
Hybrid integrated circuit device |
D460456, |
Mar 16 2001 |
SD-3C, LLC |
IC memory card |
D465463, |
Jun 15 2001 |
Taiyo Yuden Co., Ltd. |
Hybrid integrated circuit device |
D466873, |
Oct 31 2001 |
Siliconix Incorporated |
Semiconductor chip package |
D472528, |
Oct 31 2001 |
Siliconix Incorporated |
Semiconductor chip package |
D492314, |
Oct 21 2003 |
Siliconware Precision Industries Co., Ltd. |
IC card type circuit module |
D503691, |
Mar 28 2001 |
International Rectifier Corporation |
Conductive clip for a semiconductor package |
D504874, |
Aug 11 2004 |
DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT |
Semiconductor device package |
D510728, |
Aug 11 2004 |
DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT |
Semiconductor device package |
D522979, |
May 27 2005 |
Danville Automation Holdings LLC |
Funnel plate |
D529031, |
Jul 27 2004 |
SILICONWARE PRECISION INDUSTRIES CO , LTD |
IC card type circuit module |
D673921, |
Apr 21 2011 |
Kioxia Corporation |
Portion of a substrate for an electronic circuit |
D673922, |
Apr 21 2011 |
Kioxia Corporation |
Portion of a substrate for an electronic circuit |
D674364, |
Jul 08 2011 |
NIHON DEMPA KOGYO CO , LTD |
Crystal unit |
D689834, |
Oct 28 2011 |
Semileds Opto Electronics Co., Ltd. |
LED chip |
D691101, |
Nov 08 2011 |
Seiko Epson Corporation |
Circuit board for an ink cartridge |
D706733, |
Sep 16 2013 |
AIO CORE CO , LTD |
Signal conversion device |