Patent
   D715234
Priority
Apr 18 2013
Filed
Sep 12 2013
Issued
Oct 14 2014
Expiry
Oct 14 2028
Assg.orig
Entity
unknown
4
31
n/a
The ornamental design for a flip chip, as shown and described.

FIG. 1 is a top perspective view of a flip chip showing my new design;

FIG. 2 is a front view thereof;

FIG. 3 is a back view thereof;

FIG. 4 is a left view thereof;

FIG. 5 is a right view thereof;

FIG. 6 is a top view thereof;

FIG. 7 is a bottom view thereof; and,

FIG. 8 is a bottom perspective view thereof.

Chu, Chen-Fu, Cheng, Hao-Chun, Chan, Hsun-Cheng

Patent Priority Assignee Title
9497570, Feb 06 2014 NIMBELINK CORP Embedded wireless modem
D731491, Feb 07 2014 NIMBELINK CORP Embedded cellular modem
D887998, Feb 17 2017 STAT PEEL AG Chip
D911298, Feb 17 2017 STAT PEEL AG Chip
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Aug 27 2013CHAN, HSUN-CHENGSEMILEDS OPTOELECTRONICS CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0311940498 pdf
Aug 27 2013CHU, CHEN-FUSEMILEDS OPTOELECTRONICS CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0311940498 pdf
Aug 29 2013CHENG, HAO-CHUNSEMILEDS OPTOELECTRONICS CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0311940498 pdf
Sep 12 2013SemiLEDS Optoelectronics Co., Ltd.(assignment on the face of the patent)
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