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The ornamental design for an ic card type circuit module, as shown and described.
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FIG. 1 is a front elevation view of the IC card type circuit module showing our new design;
FIG. 2 is a left side elevation view thereof;
FIG. 3 is a bottom plan view thereof;
FIG. 4 is a right side elevation view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a rear elevation view thereof;
FIG. 7 is a top perspective view thereof; and,
FIG. 8 is a bottom perspective view thereof.
Huang, Chien-Ping, Huang, Chih-Ming, Chuang, Jui-Yu, Chan, Lien-Chi, Hsiao, Cheng-Hsu
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jul 27 2004 | Siliconware Precision Industries Co., Ltd. | (assignment on the face of the patent) | / | |||
Oct 01 2004 | HUANG, CHIH-MING | SILICONWARE PRECISION INDUSTRIES CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015966 | /0508 | |
Oct 01 2004 | HUANG, CHIEN-PING | SILICONWARE PRECISION INDUSTRIES CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015966 | /0508 | |
Oct 01 2004 | CHUANG, JUI-YU | SILICONWARE PRECISION INDUSTRIES CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015966 | /0508 | |
Oct 01 2004 | CHAN, LEIN-CHI | SILICONWARE PRECISION INDUSTRIES CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015966 | /0508 | |
Oct 01 2004 | HSIAO, CHENG-HSU | SILICONWARE PRECISION INDUSTRIES CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015966 | /0508 |
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