Patent |
Priority |
Assignee |
Title |
3373481, |
|
|
|
3676742, |
|
|
|
3825353, |
|
|
|
3842189, |
|
|
|
4450024, |
Aug 07 1980 |
GAO Gesellschaft fur Automation und Organisation mbH |
Identification card with an IC-module and method for producing it |
4535219, |
Oct 12 1982 |
Xerox Corporation |
Interfacial blister bonding for microinterconnections |
4549247, |
Nov 21 1980 |
GAO GESELLSCHAFT FUR AUTOMATION UND ORGANISATION MBH, GERMANY A CORP OF W GERMANY |
Carrier element for IC-modules |
4591945, |
Apr 30 1981 |
CII-Honeywell Bull; BULL S A |
Device for protecting electronic circuits against electrostatic charges |
4603249, |
Dec 24 1981 |
, |
Identification card having an IC module |
4617605, |
Jul 31 1981 |
GAO Gesellschaft Fur Automation und Organisation |
Carrier element for an IC module |
4621190, |
Jun 09 1983 |
Kabushiki Kaisha Toshiba |
Card with an IC module |
4625102, |
Nov 29 1983 |
Flonic |
Memory card manufacturing method and cards thus obtained |
4639585, |
May 29 1984 |
GAO Gesellschaft fur Automation und Organisation mbH |
Data carrier with an IC module and a method for producing such a data carrier |
4674175, |
Apr 02 1985 |
ETA SA Fabrique d'Ebauches |
Process for manufacturing electronic modules for microcircuit cards |
4755661, |
Jan 10 1986 |
|
Connection of electronic components in a card |
4764803, |
Mar 17 1986 |
Mitsubishi Denki Kabushiki Kaisha |
Thin semiconductor card |
4774633, |
Jun 26 1985 |
CP8 Technologies |
Method for assembling an integrated circuit with raised contacts on a substrate, device thereby produced and an electronic microcircuit card incorporating said device |
4792843, |
Oct 24 1984 |
GAO Gesellschaft fur Automation und Organisation mbH |
Data carrier having an integrated circuit and method for producing same |
4803542, |
Aug 05 1981 |
Gao Gessellschaft fur Automation und Organisation mbH |
Carrier element for an IC-module |
4841134, |
Jul 27 1985 |
Dai Nippon Insatsu Kabushika Kaisha; Dai Nippon Insatsu Kabushiki Kaisha |
IC card |
4860087, |
Mar 26 1986 |
Hitachi, Ltd. |
Semiconductor device and process for producing the same |
4864383, |
Oct 11 1985 |
Eurotechnique |
Method of fabrication of a chip carrier package, a flush-contact chip carrier package and an application to cards containing components |
4897534, |
Nov 20 1986 |
GAO Gesellschaft fur Automation und Organisation mbH |
Data carrier having an integrated circuit and a method for producing the same |
4937653, |
Jul 21 1988 |
American Telephone and Telegraph Company |
Semiconductor integrated circuit chip-to-chip interconnection scheme |
4942495, |
Oct 23 1987 |
Gemplus Card International |
Electrostatic protection device for electronic cards |
4980802, |
May 09 1988 |
CP8 Technologies |
Flexible printed circuit |
4994659, |
Apr 28 1988 |
Citizen Watch Co., Ltd. |
IC card |
5027190, |
Jul 16 1987 |
GAO Gesellschaft fur Automation und Organisation mbH |
Carrier element to be incorporated into an identity card |
5031026, |
Mar 17 1986 |
Mitsubishi Denki Kabushiki Kaisha |
Thin semiconductor card |
5055907, |
Jan 25 1989 |
TESSERA, INC A CORPORATION OF DELAWARE |
Extended integration semiconductor structure with wiring layers |
5055913, |
Nov 20 1986 |
GAO Gesellschaft fur Automation und Organisation mbH |
Terminal arrangement for integrated circuit device |
5057460, |
Nov 29 1988 |
Schlumberger Industries |
Method of making an electronic module, for insertion into an electronic memory-card body |
5067007, |
Jun 13 1988 |
Hitachi, Ltd.; Hitachi VLSI Engineering Corp. |
Semiconductor device having leads for mounting to a surface of a printed circuit board |
5079673, |
Apr 06 1989 |
Mitsubishi Denki Kabushiki Kaisha |
IC card module |
5086216, |
Jun 28 1988 |
Schlumberger Industries |
Memory card with fuses and a system for handling such memory cards |
5091618, |
May 23 1989 |
Hitachi Maxell, Ltd |
IC card reader/writer |
5091769, |
Mar 27 1991 |
INTEGRATED SYSTEM ASSEMBLIES CORPORATION, A CORP OF DE |
Configuration for testing and burn-in of integrated circuit chips |
5122860, |
Aug 26 1987 |
Matsushita Electric Industrial Co., Ltd. |
Integrated circuit device and manufacturing method thereof |
5126548, |
Jul 19 1989 |
Kabushiki Kaisha Toshiba |
IC card with additional terminals and method of controlling the IC card |
5149662, |
Mar 27 1991 |
Integrated System Assemblies Corporation |
Methods for testing and burn-in of integrated circuit chips |
5150193, |
May 27 1987 |
Hitachi, Ltd.; Hitachi Tobu Semiconductor, Ltd. |
Resin-encapsulated semiconductor device having a particular mounting structure |
5173055, |
Aug 08 1991 |
AMP Incorporated |
Area array connector |
5192682, |
May 10 1990 |
Mitsubishi Denki Kabushiki Kaisha |
Manufacturing method for thin semiconductor device assemblies |
5192716, |
Jan 25 1989 |
TESSERA, INC A CORPORATION OF DELAWARE |
Method of making a extended integration semiconductor structure |
5208450, |
Apr 20 1988 |
Matsushita Electric Industrial Co., Ltd. |
IC card and a method for the manufacture of the same |
5241456, |
Jul 02 1990 |
Lockheed Martin Corporation |
Compact high density interconnect structure |
5250843, |
Mar 27 1991 |
Integrated System Assemblies Corp. |
Multichip integrated circuit modules |
5255430, |
Oct 08 1992 |
INSIDE CONTACTLESS S A |
Method of assembling a module for a smart card |
5280192, |
Nov 18 1991 |
International Business Machines Corporation |
Three-dimensional memory card structure with internal direct chip attachment |
5296745, |
Mar 23 1990 |
Kabushiki Kaisha Toshiba |
Semiconductor device having a moisture barrier around periphery of device |
5304513, |
Jul 16 1987 |
GAO Gesellschaft fur Automation und Organisation mbH |
Method for manufacturing an encapsulated semiconductor package using an adhesive barrier frame |
5324687, |
Oct 16 1992 |
Lockheed Martin Corporation |
Method for thinning of integrated circuit chips for lightweight packaged electronic systems |
5327834, |
May 28 1992 |
ALLIANT TECHSYSTEMS INC |
Integrated field-effect initiator |
5346576, |
Mar 26 1990 |
Mitsubishi Denki Kabushiki Kaisha |
Method of manufacturing IC card |
5360941, |
Oct 28 1991 |
Cubic Automatic Revenue Collection Group |
Magnetically permeable electrostatic shield |
5371346, |
Jul 31 1992 |
Inventio AG |
Programmable card actuated apparatus for vending newspapers |
5399903, |
Aug 15 1990 |
LSI Corporation |
Semiconductor device having an universal die size inner lead layout |
5434395, |
Mar 05 1990 |
STORCK, JEAN R |
Method and device for effecting a transaction between a first and at least one second data carrier and carrier used for this purpose |
5486687, |
Jan 14 1992 |
Gemplus |
Memory card having a recessed portion with contacts connected to an access card |
5506499, |
Jun 05 1995 |
Faust Communications, LLC |
Multiple probing of an auxilary test pad which allows for reliable bonding to a primary bonding pad |
5514862, |
May 20 1994 |
AT&T IPM Corp |
Portable data carrier |
5523697, |
Sep 03 1993 |
Micron Technology, Inc |
Testing apparatus for engaging electrically conductive test pads on a semiconductor substrate having integrated circuitry for operability testing thereof |
5550402, |
Nov 27 1992 |
ESEC Trading SA |
Electronic module of extra-thin construction |
5550406, |
Jun 04 1992 |
LSI Logic Corporation |
Multi-layer tab tape having distinct signal, power and ground planes and wafer probe card with multi-layer substrate |
5554940, |
Jul 05 1994 |
SHENZHEN XINGUODU TECHNOLOGY CO , LTD |
Bumped semiconductor device and method for probing the same |
5581065, |
Aug 02 1993 |
DAI NIPPON PRINTING CO , LTD |
Sheet-framed IC carrier, method for producing the same, and IC carrier case |
5583733, |
Dec 21 1994 |
Senshin Capital, LLC |
Electrostatic discharge protection device |
5598032, |
Feb 14 1994 |
Gemplus Card International |
Hybrid chip card capable of both contact and contact-free operation and having antenna contacts situated in a cavity for an electronic module |
5599203, |
Oct 31 1995 |
The Whitaker Corporation |
Smart card and smart card connector |
5612532, |
Sep 01 1993 |
Kabushiki Kaisha Toshiba |
Thin IC card and method for producing the same |
5633780, |
Dec 21 1994 |
Intellectual Ventures I LLC |
Electrostatic discharge protection device |
5637858, |
Dec 23 1993 |
Giesecke & Devrient GmbH |
Method for producing identity cards |
5671525, |
Feb 13 1995 |
Gemplus Card International |
Method of manufacturing a hybrid chip card |
5688716, |
May 15 1995 |
TESSERA, INC , A CORP OF DELAWARE |
Fan-out semiconductor chip assembly |
5710421, |
Mar 31 1995 |
Kabushiki Kaisha Tokai-Rika-Denki-Seisakusho |
IC card |
5776796, |
May 19 1994 |
TESSERA, INC , A CORP OF DELAWARE |
Method of encapsulating a semiconductor package |
5796570, |
Sep 19 1996 |
National Semiconductor Corporation |
Electrostatic discharge protection package |
5808758, |
Dec 23 1994 |
Giesecke & Devrient GmbH |
Data carrier with an optically variable element |
5815426, |
Aug 13 1996 |
Winbond Electronics Corporation |
Adapter for interfacing an insertable/removable digital memory apparatus to a host data part |
5834340, |
Jun 01 1993 |
Mitsubishi Denki Kabushiki Kaisha |
Plastic molded semiconductor package and method of manufacturing the same |
5834755, |
Dec 08 1994 |
Giesecke & Devrient GmbH |
Electronic module and a data carrier having an electronic module |
5864463, |
Nov 13 1992 |
Seiko Epson Corporation |
Electronic device having connector with rows of terminals divided by ribs and ground or power terminal adjacent ribs |
5888624, |
Feb 04 1994 |
Giesecke & Devrient GmbH |
Data carrier with an electronic module and a method for producing the same |
5891745, |
Oct 28 1994 |
Honeywell Inc. |
Test and tear-away bond pad design |
5898223, |
Oct 08 1997 |
Bell Semiconductor, LLC |
Chip-on-chip IC packages |
5925445, |
Jul 12 1996 |
NEC Corporation |
Printed wiring board |
5932866, |
May 19 1995 |
Dai Nippon Printing Co., Ltd. |
Optical card with a built-in IC module technical field |
5965866, |
Apr 05 1995 |
ORGA Kartensysteme GmbH |
Pass card having a semiconductor chip module attached by a microencapsulated adhesive |
5969951, |
Mar 13 1997 |
ORGA Kartensysteme GmbH |
Method for manufacturing a chip card and chip card manufactured in accordance with said method |
5975420, |
Apr 13 1995 |
Dai Nippon Printing Co., Ltd. |
Apparatus and method of manufacturing an integrated circuit (IC) card with a protective IC module |
5995006, |
Sep 05 1995 |
Intermec IP CORP |
Radio frequency tag |
6006987, |
Dec 20 1996 |
Tyco Electronics Logistics AG |
Removable card carrier assembly |
6025997, |
May 04 1998 |
Siemens Aktiengesellschaft |
Chip module for semiconductor chips having arbitrary footprints |
6027028, |
Jul 26 1996 |
KONINKLIJKE KPN N V |
Connector formed as a sleeve pushed over a standard chip card |
6036099, |
Oct 07 1996 |
LEIGHTON, KEITH; LEIGHTON, LOIS; JANUZZI, ROLAND A ; JANUZZI, CONSTANCE J; NIEDZWIECKI, CARL J; NIEDZWIECKI, CATHERINE M ; KING, BRIAN P |
Hot lamination process for the manufacture of a combination contact/contactless smart card and product resulting therefrom |
6046071, |
Jun 01 1993 |
Renesas Electronics Corporation |
Plastic molded semiconductor package and method of manufacturing the same |
6054774, |
Mar 22 1994 |
Kabushiki Kaisha Toshiba |
Thin type semiconductor package |
6065681, |
Jan 29 1997 |
ORGA Kartensysteme GmbH |
Method of producing data carriers |
6072698, |
Sep 27 1995 |
Infineon Technologies AG |
Chip module with heat insulation for incorporation into a chip card |
6076737, |
Apr 13 1995 |
Dai Nippon Printing Co., Ltd. |
Apparatus and method of manufacturing an integrated circuit (IC) card with a protective IC module |
6081182, |
Nov 22 1996 |
MATSUSHITA ELECTRIC INDUSTRIAL CO , LTD |
Temperature sensor element and temperature sensor including the same |
6095423, |
Aug 14 1996 |
Siemens Aktiengesellschaft |
Method of producing a smart card module, a smart card module produced by the method, and a combination smart card containing the smart card module |
6109530, |
Jul 08 1998 |
Motorola, Inc; General Instrument Corporation |
Integrated circuit carrier package with battery coin cell |
6141210, |
Jul 23 1993 |
Kabushiki Kaisha Toshiba |
External storage device |
6142381, |
Mar 15 1996 |
SMARTRAC IP B V |
Contact or contactless chip card with brace |
6145035, |
Feb 25 1999 |
Dallas Semiconductor Corporation |
Card cradle system and method |
6147860, |
Jul 23 1993 |
Kabushiki Kaisha Toshiba |
External storage device |
6161761, |
Jul 09 1998 |
QUARTERHILL INC ; WI-LAN INC |
Card assembly having a loop antenna formed of a bare conductor and method for manufacturing the card assembly |
6175287, |
May 28 1997 |
Raytheon Company |
Direct backside interconnect for multiple chip assemblies |
6184477, |
Dec 02 1998 |
Kyocera Corporation |
Multi-layer circuit substrate having orthogonal grid ground and power planes |
6191951, |
Mar 03 1997 |
Siemens Aktiengesellschaft |
Smart card module and smart card including a smart card module |
6197688, |
Feb 12 1998 |
Freescale Semiconductor, Inc |
Interconnect structure in a semiconductor device and method of formation |
6202931, |
Jun 07 1996 |
Schlumberger Systemes |
Memory card and method for producing same |
6223989, |
Aug 05 1996 |
GEMALTO SA |
Method for making smart cards, and resulting cards |
6265765, |
Jul 07 1994 |
Tessera, Inc. |
Fan-out semiconductor chip assembly |
6276609, |
Jul 07 1998 |
NXP B V |
Data carrier provided data processing means and current peak pattern suppression means |
6288904, |
Sep 30 1996 |
Siemens Aktiengesellschaft |
Chip module, in particular for implantation in a smart card body |
6293470, |
Apr 29 1997 |
SWEDISH ADVANCED TECHNOLOGY SYSTEMS, AB |
Smartcard and method for its manufacture |
6313524, |
Sep 23 1996 |
Siemens Aktiengesellschaft |
Chip module with a plurality of flat contact elements mountable on either an external printed circuit board or an external circuit board substrate |
6320751, |
Jun 23 1997 |
Dai Nippon Printing Co., Ltd. |
Sheet-framed IC carrier and method for producing the same |
6326683, |
May 17 1996 |
Siemens Aktiengesellschaft |
Carrier element for a semiconductor chip |
6343364, |
Jul 13 2000 |
SCHLUMBERGER MAICO, INC |
Method and device for local clock generation using universal serial bus downstream received signals DP and DM |
6351405, |
Sep 16 1999 |
Samsung Electronics Co., Ltd. |
Pad for integrated circuit device which allows for multiple probing and reliable bonding and integrated circuit device including the pad |
6369407, |
Feb 09 1999 |
ACHLYS TECHNOLOGIES INC |
Semiconductor device |
6370029, |
Jan 15 1997 |
CITICORP CREDIT SERVICES, INC USA |
Method and system for creating and using an electrostatic discharge (ESD) protected logotype contact module with a smart card |
6378774, |
Nov 14 1997 |
Toppan Printing Co., Ltd. |
IC module and smart card |
6398114, |
Aug 02 1993 |
Dai Nippon Printing Co., Ltd. |
Sheet-framed IC carrier, method for producing the same, and IC carrier case |
6402032, |
Dec 03 1998 |
Integrated Technology Express Inc. |
Integrated smart card reader and computer input/output IC system |
6410355, |
Jun 11 1998 |
SanDisk Technologies LLC |
Semiconductor package using terminals formed on a conductive layer of a circuit board |
6429112, |
Jul 07 1994 |
TESSERA, INC , A CORPORATION OF THE STATE OF DELAWARE |
Multi-layer substrates and fabrication processes |
6433285, |
Mar 30 2000 |
TESSERA ADVANCED TECHNOLOGIES, INC |
Printed wiring board, IC card module using the same, and method for producing IC card module |
6439464, |
Oct 11 2000 |
SCHLUMBERGER MALCO, INC |
Dual mode smart card and associated methods |
6448638, |
Jan 22 1998 |
GEMALTO SA |
Integrated circuit contact card, comprising a detachable minicard |
6454164, |
Aug 09 1995 |
Hitachi, Ltd. |
Pocket-size information transfer apparatus having dual IC card insertion slots and IC card using the same |
6460773, |
Sep 13 2000 |
Fujitsu Semiconductor Limited |
Combination card having an IC chip module |
6462273, |
Mar 16 2001 |
Round Rock Research, LLC |
Semiconductor card and method of fabrication |
6483038, |
May 23 2000 |
SAMSUNG ELECTRONICS CO , LTD |
Memory card |
6490667, |
Sep 18 2000 |
Kabushiki Kaisha Toshiba |
Portable electronic medium |
6514367, |
Oct 17 1995 |
LEIGHTON, KEITH; LEIGHTON, LOIS; JANUZZI, ROLAND A ; JANUZZI, CONSTANCE J; NIEDZWIECKI, CARL J; NIEDZWIECKI, CATHERINE M ; KING, BRIAN P |
Hot lamination process for the manufacture of a combination contact/contactless smart card |
6542444, |
Mar 29 1999 |
OMD INTERNATIONAL AG |
Carrier card capable of storing information data in CD or DVD formats |
6543690, |
Dec 04 2000 |
SCHLUMBERGER MALCO, INCORPORATED |
Method and apparatus for communicating with a host |
6568600, |
Jan 19 1999 |
CP8 Technologies |
Chip card equipped with a loop antenna, and associated micromodule |
6572015, |
Jul 02 2001 |
Bellsouth Intellectual Property Corporation |
Smart card authorization system, apparatus and method |
6581122, |
Mar 26 1998 |
GEMPLUS S C A |
Smart card which operates with the USB protocol |
6581840, |
Jun 23 1997 |
Dai Nippon Printing Co., Ltd. |
Sheet-framed IC carrier and method for producing the same |
6585165, |
Jun 29 1999 |
Sony Chemicals Corp. |
IC card having a mica capacitor |
6592042, |
Feb 13 1998 |
GEMALTO SA |
Method for making a card with integrated circuit |
6601770, |
May 19 1997 |
Rohm Co., Ltd. |
Response device in contact/contactless IC card communication system |
6612498, |
Mar 11 1999 |
CALLAHAN CELLULAR L L C |
Method and means for using additional cards in a mobile station |
6618258, |
May 10 2001 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L P |
Portable memory card system |
6628240, |
Nov 08 2000 |
TANDIS, INC |
Method and apparatus for rapid staking of antennae in smart card manufacture |
6632997, |
Jun 13 2001 |
AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD |
Personalized circuit module package and method for packaging circuit modules |
6634561, |
Jun 24 1999 |
SanDisk Technologies LLC |
Memory card electrical contact structure |
6634565, |
Nov 06 2001 |
RDSK, INC |
Smart card having additional connector pads |
6641049, |
Aug 31 2000 |
QUADNOVATION, INC |
Integrated circuit card with multiple integral electronic modules |
6642611, |
Mar 26 1998 |
Kabushiki Kaisha Toshiba |
Storage apparatus, card type storage apparatus, and electronic apparatus |
6659355, |
Aug 19 1999 |
ORGA Kartensysteme GmbH |
Method for producing a multi-layer chip card |
6659356, |
May 16 2001 |
Matsushita Electric Industrial Co., Ltd. |
Hybrid IC card |
6669487, |
Apr 28 2000 |
Renesas Electronics Corporation |
IC card |
6694399, |
Sep 14 2000 |
STMicroelectronics, Inc; SCHLUMBERGER MALCO, INC |
Method and device for universal serial bus smart card traffic signaling |
6712279, |
Jul 31 2001 |
Quotainne Enterprises LLC |
Data carrier comprising an array of contacts |
6717801, |
Sep 29 2000 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L P |
Standardized RF module insert for a portable electronic processing device |
6776347, |
Aug 02 1993 |
Dai Nippon Printing Co., Ltd. |
Sheet-framed IC carrier, method for producing the same, and IC carrier case |
6778407, |
Feb 02 2000 |
Infineon Technologies AG |
Portable data carrier |
6793144, |
Jan 10 2003 |
Atmel Corporation |
Means for communicating with USB smart cards using full-speed or high-speed transfers |
6803114, |
Jul 01 1999 |
Axalto SA |
Manufacturing process for laminated cards with intermediate PETG layer |
6803666, |
Mar 27 2001 |
Kabushiki Kaisha Toshiba |
Semiconductor chip mounting substrate and semiconductor device using the same |
6817533, |
Jan 15 2003 |
POWER DIGITAL CARD CO , LTD ; CHEN, CHIEN-YUAN |
Digital card-structure |
6817534, |
Nov 06 2001 |
RDSK, INC |
Smart card having additional connector pads |
6851618, |
Sep 14 2001 |
ASK S.A. |
Contactless or hybrid contact-contactless smart card with reinforced connection of the electronic module |
6856235, |
Apr 18 1996 |
Tessera, Inc. |
Methods for manufacturing resistors using a sacrificial layer |
6865086, |
Jul 09 2002 |
U S BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT |
Apparatus and method to secure an adaptor to a reduced-sized memory card |
6870733, |
Sep 29 2000 |
Hewlett-Packard Development Company, L.P. |
Standardized RF module insert for a portable electronic processing device |
6896189, |
May 03 2000 |
GEMALTO SA |
Card comprising electrical contacts |
6910635, |
Oct 08 2002 |
AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD |
Die down multi-media card and method of making same |
6922780, |
Aug 08 2000 |
The DIRECTV Group, Inc. |
Dual chip smart card and method for using same |
6970359, |
Jul 09 2002 |
U S BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT |
Reduced-sized memory card package, length-extending adaptor and method of forming adaptor |
6978940, |
Nov 06 2001 |
Quadnovation, Inc. |
Contactless SIM card carrier with detachable antenna and carrier therefor |
6994263, |
Jun 28 2002 |
MATSUSHITA ELECTRIC INDUSTRIAL CO , LTD |
IC card |
7019981, |
Aug 10 2001 |
Infineon Technologies AG |
Making contact with semiconductor chips in chip cards |
7028910, |
Feb 02 2001 |
GEMALTO SA |
Portable object with chip and antenna |
7030316, |
Jan 30 2004 |
Piranha Plastics |
Insert molding electronic devices |
7051429, |
Apr 11 2003 |
Eastman Kodak Company |
Method for forming a medium having data storage and communication capabilities |
7059534, |
Jul 02 2002 |
DAI NIPPON PRINTING CO , LTD 50% |
IC card |
7063538, |
Nov 12 2004 |
Power Digital Card Co., Ltd. |
Memory card structure |
7064423, |
Jul 10 2003 |
Sharp Kabushiki Kaisha |
IC module and IC card |
7083107, |
Sep 30 2002 |
Matsushita Electric Industrial Co., Ltd. |
Memory card |
7088006, |
Jan 28 2004 |
Infineon Technologies AG |
Integrated circuit arrangement |
7094106, |
Mar 10 2003 |
PANASONIC ELECTRIC WORKS CO , LTD |
Adaptor for memory card |
7094633, |
Jun 23 2003 |
SanDisk Technologies LLC |
Method for efficiently producing removable peripheral cards |
7102891, |
Jul 23 2003 |
AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD |
Circuit module having interconnects for connecting functioning and non-functioning add ons and method therefor |
7121473, |
Jan 30 2003 |
Polaris Innovations Limited |
Security memory card and production method |
7135782, |
Dec 03 2001 |
Sharp Kabushiki Kaisha |
Semiconductor module and production method therefor and module for IC cards and the like |
7137563, |
Apr 10 2003 |
Sony Corporation |
Method for making IC card |
7166914, |
Jul 07 1994 |
Tessera, Inc. |
Semiconductor package with heat sink |
7176060, |
Sep 10 2003 |
Renesas Electronics Corporation |
Integrated circuit card and a method of manufacturing the same |
7179129, |
Jul 12 2006 |
|
2-in-1 SD type memory card adapter |
7180176, |
Aug 23 2001 |
DOWA METALTECH CO , LTD |
Radiation plate and power semiconductor module IC package |
7193161, |
Feb 15 2006 |
SanDisk Technologies LLC |
SiP module with a single sided lid |
7226318, |
Jul 19 2006 |
|
Card adapter structure |
7233499, |
Jul 28 2004 |
C-One Technology Corporation |
Extended memory card |
7234644, |
Jan 25 2000 |
Renesas Electronics Corporation; NEC Electronics Corporation |
IC card |
7239973, |
Jul 19 2002 |
INTERDIGITAL MADISON PATENT HOLDINGS |
Method and test adapter for testing an appliance having a smart card reader |
7242079, |
Oct 15 2002 |
GEMALTO SA |
Method of manufacturing a data carrier |
7252242, |
Feb 04 2005 |
|
Method for providing additional service based on dual UICC |
7291903, |
Apr 26 2004 |
Renesas Electronics Corporation; NEC Electronics Corporation |
Memory card |
7296754, |
May 11 2004 |
Renesas Electronics Corporation; NEC Electronics Corporation |
IC card module |
7336498, |
Jul 17 2003 |
SanDisk Technologies LLC |
Memory card with push-push connector |
7352588, |
Mar 11 2005 |
Renesas Electronics Corporation; NEC Electronics Corporation |
Semiconductor device and a method for manufacturing the same |
7359204, |
Feb 15 2006 |
AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD |
Multiple cover memory card |
7364092, |
Jul 18 2005 |
ICASHE, INC |
Electronic stripe cards |
7369982, |
Jun 04 2003 |
Axalto |
Multi-mode smart card emulator and related methods |
7388455, |
Oct 30 2003 |
AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE LIMITED |
Film acoustically-coupled transformer with increased common mode rejection |
7418272, |
Aug 12 2002 |
INFO TRUST, INC |
Battery pack having a dual-type smart card interface |
7425464, |
Mar 10 2006 |
SHENZHEN XINGUODU TECHNOLOGY CO , LTD |
Semiconductor device packaging |
7433196, |
Apr 14 2004 |
SUPER TALENT TECHNOLOGY, CORP |
Card-type electronic apparatus assembly using ultrasonic joining |
7458519, |
Jul 26 2005 |
Sony Corporation; Renesas Technology Corp |
Card tray |
7475818, |
Oct 31 2005 |
Malikie Innovations Limited |
Combined battery and smart card |
7485562, |
Aug 27 2002 |
U S BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT |
Method of making multichip wafer level packages and computing systems incorporating same |
7486520, |
May 25 2007 |
Kingston Technology Corporation, Inc. |
Modular flash memory card expansion system |
7494058, |
Jul 01 2004 |
Liberty Peak Ventures, LLC |
Smartcard transaction method and system using voiceprint recognition |
7511365, |
Apr 21 2005 |
Industrial Technology Research Institute |
Thermal enhanced low profile package structure |
7552876, |
Jan 25 2000 |
Renesas Electronics Corporation; NEC Electronics Corporation |
IC card |
7559469, |
May 24 2002 |
NTT DoCoMo, Inc |
Chip card of reduced size with backward compatibility and adapter for a reduced size chip card |
7560806, |
Mar 29 2006 |
Sony Corporation |
Memory card |
7597266, |
Mar 28 2003 |
ASK S A |
Method for making a smart card antenna on a thermoplastic support and resulting smartcard |
7606042, |
Sep 03 2004 |
TAMIRAS PER PTE LTD , LLC |
High capacity thin module system and method |
7607583, |
Jul 10 2001 |
Liberty Peak Ventures, LLC |
Clear contactless card |
7615855, |
Oct 08 2002 |
Renesas Electronics Corporation; NEC Electronics Corporation |
IC card and method of manufacturing the same |
7616452, |
Sep 03 2004 |
TAMIRAS PER PTE LTD , LLC |
Flex circuit constructions for high capacity circuit module systems and methods |
7619901, |
Jun 25 2007 |
EPIC Technologies, Inc. |
Integrated structures and fabrication methods thereof implementing a cell phone or other electronic system |
7630209, |
Jul 14 2005 |
Samsung Electronics Co., Ltd. |
Universal PCB and smart card using the same |
7655501, |
Dec 13 2006 |
Taiwan Semiconductor Manufacturing Company, Ltd |
Wafer level package with good CTE performance |
7662667, |
Dec 20 2007 |
CHIPMOS TECHNOLOGIES INC; ChipMOS Technologies (Bermuda) Ltd |
Die rearrangement package structure using layout process to form a compliant configuration |
7663564, |
Oct 08 1997 |
GEMALTO, S A |
Method for making smart cards capable of operating with and without contact |
7667318, |
Dec 03 2003 |
Taiwan Semiconductor Manufacturing Company, Ltd |
Fan out type wafer level package structure and method of the same |
7669773, |
May 11 2004 |
Renesas Electronics Corporation; NEC Electronics Corporation |
IC card module |
7675151, |
Jun 01 2005 |
Rockwell Collins, Inc |
Silicon-based packaging for electronic devices |
7686228, |
Dec 20 2001 |
GEMALTO SA |
Smart card with extended surface module |
7719846, |
Dec 30 2005 |
STMICROELECTRONICS N V |
Plated module for an IC card |
7760513, |
Sep 03 2004 |
TAMIRAS PER PTE LTD , LLC |
Modified core for circuit module system and method |
7763976, |
Sep 30 2008 |
SHENZHEN XINGUODU TECHNOLOGY CO , LTD |
Integrated circuit module with integrated passive device |
7768796, |
Sep 03 2004 |
TAMIRAS PER PTE LTD , LLC |
Die module system |
7807502, |
May 17 2007 |
U S BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT |
Method for fabricating semiconductor packages with discrete components |
7810718, |
May 12 2005 |
Cubic Corporation |
Variable thickness data card body |
7812434, |
Jan 03 2007 |
Taiwan Semiconductor Manufacturing Company, Ltd |
Wafer level package with die receiving through-hole and method of the same |
7847380, |
Sep 20 2007 |
Samsung Electronics Co., Ltd. |
Tape substrate and semiconductor module for smart card, method of fabricating the same, and smart card |
7855895, |
Jul 14 2005 |
Samsung Electronics Co., Ltd. |
Universal PCB and smart card using the same |
7862381, |
Sep 26 2008 |
SanDisk Technologies LLC |
Connector block feature |
7874491, |
Apr 07 2006 |
Infineon Technologies AG |
Carrier arrangement with overvoltage protection |
7909251, |
Feb 04 2006 |
Samsung Electronics Co., Ltd. |
Memory card pack |
7909611, |
Sep 26 2008 |
SanDisk Technologies LLC |
Method for preventing damage to a memory card |
7914296, |
Jan 05 2010 |
Exatron, Inc. |
Interconnecting assembly with conductive lever portions on a support film |
7922097, |
Sep 07 2007 |
Panasonic Corporation |
SIM card IC module and SIM card |
7946876, |
Dec 25 2009 |
Chi Mei Communication Systems, Inc. |
Smart card holder for portable electronic device |
7958622, |
Oct 08 1997 |
GEMALTO, S A |
Method for making smart cards |
7961101, |
Aug 08 2008 |
ICASHE, INC |
Small RFID card with integrated inductive element |
7975915, |
Nov 02 2004 |
GEMALTO SA |
Personalized USB-key type electronic device and method for making same |
7980477, |
May 17 2007 |
Feinics Amatech Teoranta |
Dual interface inlays |
8002196, |
Oct 30 2007 |
NATIONZ TECHNOLOGIES INC. |
Radio frequency IC card device with very high frequency |
8003513, |
Sep 27 2002 |
Medtronic MiniMed, Inc. |
Multilayer circuit devices and manufacturing methods using electroplated sacrificial structures |
8016191, |
Jul 01 2004 |
Liberty Peak Ventures, LLC |
Smartcard transaction system and method |
8030746, |
Feb 08 2008 |
Infineon Technologies AG |
Integrated circuit package |
8061623, |
Feb 09 2006 |
|
Plastic card provided with electrical contacts |
8061625, |
Oct 30 2007 |
NATIONZ TECHNOLOGIES INC. |
Radio frequency IC card device with very high frequency |
8072331, |
Aug 08 2008 |
ICASHE, INC |
Mobile payment device |
8079528, |
Jan 10 2007 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
Input/output pads placement for a smart card chip |
8085547, |
Apr 29 2007 |
POLIGHT TECHNOLOGIES LTD |
Electronic elements carrier |
8107246, |
May 11 2005 |
GEMALTO SA |
Adhesive format adapter for a storage device and method for the production thereof |
8110434, |
Mar 31 2006 |
Kioxia Corporation |
Semiconductor device and memory card using the same |
8110916, |
Jun 19 2009 |
Advanced Semiconductor Engineering, Inc. |
Chip package structure and manufacturing methods thereof |
8127997, |
May 13 2003 |
NAGRAVISION S A |
Method for mounting an electronic component on a substrate |
8136732, |
Feb 22 2005 |
ICASHE, INC |
Electronic transaction card with contactless interface |
8143713, |
Apr 28 2009 |
Samsung Electronics Co., Ltd. |
Chip-on-board package |
8167659, |
Sep 26 2008 |
SanDisk Technologies LLC |
Connector block feature |
8174105, |
May 17 2007 |
U S BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT |
Stacked semiconductor package having discrete components |
8181880, |
Jun 16 2004 |
Korea Minting & Security Printing Corporation |
Combi-card and method for making the same |
8191788, |
Sep 07 1999 |
Liberty Peak Ventures, LLC |
Transaction card |
8231061, |
Feb 24 2009 |
ICASHE, INC |
Contactless device with miniaturized antenna |
8333004, |
Nov 08 2007 |
LINXENS HOLDING S A S |
Electronic interface apparatus and method and system for manufacturing same |
8342416, |
Jan 09 2009 |
Murata Manufacturing Co., Ltd. |
Wireless IC device, wireless IC module and method of manufacturing wireless IC module |
8422238, |
Apr 13 2009 |
PHYTREX TECHNOLOGY CORPORATION |
Signal conversion device |
8507377, |
Mar 15 2002 |
Fujitsu Semiconductor Limited |
Semiconductor device, method of manufacturing the same, and phase shift mask |
8573494, |
Feb 22 2005 |
ICASHE, INC |
Apparatus for secure financial transactions |
20010005291, |
|
|
|
20010011685, |
|
|
|
20010012682, |
|
|
|
20020049887, |
|
|
|
20020069392, |
|
|
|
20020110955, |
|
|
|
20020186542, |
|
|
|
20030016116, |
|
|
|
20030016507, |
|
|
|
20030024995, |
|
|
|
20030024996, |
|
|
|
20030085287, |
|
|
|
20030102544, |
|
|
|
20030103301, |
|
|
|
20030116634, |
|
|
|
20030168515, |
|
|
|
20030226901, |
|
|
|
20040031857, |
|
|
|
20040037145, |
|
|
|
20040061234, |
|
|
|
20040089717, |
|
|
|
20040113265, |
|
|
|
20040117317, |
|
|
|
20040194861, |
|
|
|
20040238857, |
|
|
|
20040245347, |
|
|
|
20040259423, |
|
|
|
20050007744, |
|
|
|
20050011671, |
|
|
|
20050037540, |
|
|
|
20050082636, |
|
|
|
20050099269, |
|
|
|
20050105360, |
|
|
|
20050111280, |
|
|
|
20050148217, |
|
|
|
20050156310, |
|
|
|
20050197169, |
|
|
|
20050202667, |
|
|
|
20050212690, |
|
|
|
20050231921, |
|
|
|
20050252978, |
|
|
|
20050253239, |
|
|
|
20050281010, |
|
|
|
20060131429, |
|
|
|
20060139901, |
|
|
|
20060142063, |
|
|
|
20060175417, |
|
|
|
20060175418, |
|
|
|
20060194479, |
|
|
|
20060202034, |
|
|
|
20060205280, |
|
|
|
20060288145, |
|
|
|
20060288146, |
|
|
|
20070013396, |
|
|
|
20070023532, |
|
|
|
20070025092, |
|
|
|
20070026740, |
|
|
|
20070095910, |
|
|
|
20070108298, |
|
|
|
20070108521, |
|
|
|
20070125866, |
|
|
|
20070126099, |
|
|
|
20070138301, |
|
|
|
20070145133, |
|
|
|
20070152072, |
|
|
|
20070153487, |
|
|
|
20070213096, |
|
|
|
20070228536, |
|
|
|
20080054493, |
|
|
|
20080076474, |
|
|
|
20080088038, |
|
|
|
20080099559, |
|
|
|
20080099932, |
|
|
|
20080102895, |
|
|
|
20080144650, |
|
|
|
20080146280, |
|
|
|
20080153205, |
|
|
|
20080164324, |
|
|
|
20080182120, |
|
|
|
20080257967, |
|
|
|
20080263363, |
|
|
|
20080277484, |
|
|
|
20080290160, |
|
|
|
20080299860, |
|
|
|
20080308641, |
|
|
|
20090032593, |
|
|
|
20090040116, |
|
|
|
20090061933, |
|
|
|
20090065591, |
|
|
|
20090065592, |
|
|
|
20090069052, |
|
|
|
20090079053, |
|
|
|
20090108063, |
|
|
|
20090111522, |
|
|
|
20090121020, |
|
|
|
20090127345, |
|
|
|
20090140443, |
|
|
|
20090160071, |
|
|
|
20090166895, |
|
|
|
20090169013, |
|
|
|
20090172279, |
|
|
|
20090173793, |
|
|
|
20090210569, |
|
|
|
20090216681, |
|
|
|
20090224888, |
|
|
|
20090235037, |
|
|
|
20090245029, |
|
|
|
20090250523, |
|
|
|
20100025480, |
|
|
|
20100033307, |
|
|
|
20100033310, |
|
|
|
20100049878, |
|
|
|
20100072284, |
|
|
|
20100072618, |
|
|
|
20100084759, |
|
|
|
20100140814, |
|
|
|
20100176207, |
|
|
|
20100200661, |
|
|
|
20100203870, |
|
|
|
20100262840, |
|
|
|
20100293784, |
|
|
|
20100312698, |
|
|
|
20110115060, |
|
|
|
20110125967, |
|
|
|
20110157838, |
|
|
|
20110171996, |
|
|
|
20110182037, |
|
|
|
20110194265, |
|
|
|
20110233545, |
|
|
|
20110253795, |
|
|
|
20110298585, |
|
|
|
20110304060, |
|
|
|
20120104634, |
|
|
|
20120161337, |
|
|
|
20120256324, |
|
|
|
20120289196, |
|
|
|
D261760, |
Dec 22 1978 |
Pitney Bowes Inc. |
Electronic postal rate memory |
D327883, |
Feb 09 1990 |
Gemplus Card International |
Connecting terminal for chip cards |
D328599, |
Apr 10 1990 |
Gemplus Card International |
Connecting terminal for chip cards |
D331922, |
Feb 02 1989 |
Gemplus Card International |
Connecting terminal for chip cards |
D335663, |
Feb 02 1989 |
Gemplus Card International |
Connecting terminal for chip cards |
D342728, |
Feb 02 1989 |
Gemplus Card International |
Connecting terminal for chip cards |
D344502, |
Feb 02 1989 |
Gemplus Card International |
Connecting terminal for chip cards |
D353135, |
Nov 27 1991 |
Gemplus Card International |
Connecting terminal for chip cards |
D353136, |
Mar 12 1992 |
Gemplus Card International |
Connecting terminal for chip cards |
D357242, |
Nov 04 1991 |
Gemplus Card International |
Connecting terminal for chip cards |
D357909, |
Jul 11 1991 |
Gemplus Card International |
Connecting terminal for chip cards |
D358142, |
Mar 02 1992 |
Gemplus Card International |
Connecting terminal for chip cards |
D365092, |
Aug 12 1993 |
Siemens Aktiengesellschaft |
Chipcard module |
D369157, |
Mar 16 1995 |
Kabushiki Kaisha Toshiba |
IC card |
D375303, |
Nov 30 1994 |
SOLAIC (societe anonyme) |
Smart card with plural external contact regions |
D379006, |
May 30 1995 |
SOLAIC (societe anonyme) |
Smart card with m-shaped isolation region |
D384971, |
Aug 28 1996 |
CITICORP DEVELOPMENT CENTER, INC |
Smart card with chip bearing a source identifier |
D387746, |
May 29 1996 |
Kabushiki Kaisha Toshiba |
IC module |
D387747, |
May 29 1996 |
Kabushiki Kaisha Toshiba |
IC module |
D388066, |
May 29 1996 |
Kabushiki Kaisha Toshiba |
IC module |
D389130, |
May 29 1996 |
Kabushiki Kaisha Toshiba |
IC module |
D393458, |
Jun 19 1995 |
Gemplus |
Connecting terminal for chip cards |
D405779, |
Oct 25 1996 |
Infineon Technologies AG |
Carrier element for a semiconductor chip for integration into a chipcard |
D412164, |
Jun 19 1995 |
Gemplus |
Connecting terminal for chip cards |
D416246, |
Aug 19 1998 |
The Standard Register Company |
Contact layout for a smart card |
D424043, |
Apr 13 1998 |
Nihon Denshizairyo Kabushiki Kaisha |
Ring for probe card |
D424539, |
Apr 13 1998 |
Nihon Denshizairyo Kabushiki Kaisha |
Ring for probe card |
D425519, |
Jun 19 1995 |
Gemplus |
Connecting terminal for chip cards |
D443298, |
Sep 01 1999 |
AMERICAN EXPRESS TRAVEL RELATED SERVICES COMPANY, INC |
Card with an ornamental rectangle, machine readable stripe and IC chip |
D452243, |
Jun 07 2000 |
SanDisk Technologies LLC |
Integrated circuit memory card |
D452864, |
Jun 12 2000 |
SanDisk Technologies LLC |
Electronic memory card |
D452865, |
Apr 01 1998 |
SanDisk Technologies LLC |
Removable memory card for use with portable electronic devices |
D453934, |
Apr 01 1998 |
SanDisk Technologies LLC |
Removable memory card for use with portable electronic devices |
D456414, |
Jun 19 1995 |
Gemplus |
Connecting terminal for chip cards |
D487747, |
Jan 08 2003 |
C-One Technology Corporation; Pretec Electronics Corporation |
Removable electronic card |
D488818, |
Jun 27 2001 |
FLUIDIGM CORPORATION - A DELAWARE CORPORATION |
Fluidic rotary mixer square icon for a display screen |
D492688, |
Dec 09 2002 |
SanDisk Technologies LLC |
Memory card |
D493798, |
Oct 13 2003 |
C-One Technology Corporation |
Memory card |
D516076, |
Sep 09 2004 |
Samsung Electronics Co., Ltd. |
Electrical flash memory card |
D517559, |
Dec 30 2004 |
C-One Technology Corporation |
Mixed interface integrated circuit card |
D523435, |
Jul 17 2003 |
SD-3C, LLC |
Memory card |
D525248, |
Jul 17 2003 |
SD-3C, LLC |
Memory card |
D525623, |
Jul 17 2003 |
SD-3C, LLC |
Memory card |
D525978, |
Jul 17 2003 |
SD-3C, LLC |
Memory card |
D529031, |
Jul 27 2004 |
SILICONWARE PRECISION INDUSTRIES CO , LTD |
IC card type circuit module |
D533556, |
Oct 15 2002 |
SD-3C, LLC |
IC memory card |
D534537, |
Jan 06 2004 |
WILDSEED LTD |
Connecting terminal for chip cards |
D537081, |
Jul 17 2003 |
SD-3C, LLC |
Memory card |
D538286, |
Jul 17 2003 |
SD-3C, LLC |
Memory card |
D552098, |
May 24 2005 |
Renesas Electronics Corporation |
Memory card |
D552099, |
May 24 2005 |
Renesas Electronics Corporation |
Memory card |
D556764, |
May 24 2005 |
Renesas Electronics Corporation |
Memory card |
D571810, |
Jun 20 2006 |
Kabushiki Kaisha Toshiba |
Module with built-in integrated circuits for use with IC cards |
D573154, |
Jun 30 2005 |
Microsoft Corporation |
Icon for a portion of a display screen |
D574384, |
Apr 27 2006 |
PARI Pharma GmbH |
Chip card |
D574835, |
Oct 06 2006 |
Taisys Technologies Co., Ltd. |
Miniaturized card |
D581932, |
May 24 2005 |
Renesas Electronics Corporation |
Memory card |
D628202, |
Oct 20 2009 |
SanDisk Technologies LLC |
MicroSD memory card with different color surfaces |
D638431, |
Oct 20 2009 |
SanDisk Technologies LLC |
MicroSD memory card with a semi-transparent color surface |
D643040, |
Oct 26 2010 |
Hon Hai Precision Ind. Co., Ltd. |
Electrical card |
D669478, |
Jan 13 2012 |
BlackBerry Limited |
Device smart card |
D669479, |
Jan 13 2012 |
BlackBerry Limited |
Device smart card |
D681640, |
Dec 03 2010 |
Sony Computer Entertainment Inc |
Storage medium |
D686214, |
Jul 28 2011 |
ORANGEHOOK, INC ; SPRING GROVE FINANCE, S A |
Smartcard with iChip contact pad |
RE35119, |
Jan 14 1992 |
AT&T Corp. |
Textured metallic compression bonding |