The ornamental design for a spokedsolderpad, as shown and described.
FIG. 1 is a top plan view of a solder pad with three or more solderable lobes, each solderable lobe symmetrically extending along a radial axis.
FIG. 2 is a top plan view of a solder pad with illustrative solder prefill on the solder pad as shown in FIG. 1.
FIG. 3 is a top plan view of a solder pad with illustrative solder prefill wetting along each radial axis when soldered; and,
FIG. 4 is a top plan view of a solder pad with illustrative integrated circuit elements in unused adjacent space.
Broken line illustrations of environmental structure in the drawings, including dashed line radial axes and integrated circuit package and/or circuit board outlines in FIGS. 1-3, and integrated circuit elements in FIG. 4, are provided for illustrative purposes only and form no part of the claimed design.