Patent
   D571810
Priority
Jun 20 2006
Filed
Nov 15 2006
Issued
Jun 24 2008
Expiry
Jun 24 2022
Assg.orig
Entity
unknown
36
17
n/a
We claim the ornamental design for a module with built-in integrated circuits for use with IC cards, as shown and described.

FIG. 1 is a perspective view of a module with built-in integrated circuits for use with IC cards showing my new design,

FIG. 2 is a front elevational view thereof,

FIG. 3 is a rear elevational view thereof,

FIG. 4 is a left side elevational view thereof,

FIG. 5 is a right side elevational view thereof,

FIG. 6 is a top plan view thereof,

FIG. 7 is a bottom plan view thereof; and,

FIG. 8 is a reduced reference view showing the article in use thereof.

The portions shown in broken lines are for illustrative purposes only and form no part of the claimed design.

Ikeda, Hidetaka

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Oct 19 2006IKEDA, HIDETAKAKabushiki Kaisha ToshibaASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0185780186 pdf
Nov 15 2006Kabushiki Kaisha Toshiba(assignment on the face of the patent)
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