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Patent
D756317
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Priority
Aug 26 2014
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Filed
Aug 26 2014
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Issued
May 17 2016
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Expiry
May 17 2030
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Assg.orig
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Entity
unknown
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21
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24
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n/a
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The ornamental design for a layout for contact pads and connection bridges of a transponder chip module, as shown and described.
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FIG. 1 is a perspective view of a layout for contact pads and connection bridges of a transponder chip module showing our new design;
FIG. 2 is a front elevation view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a left side elevation view thereof; and,
FIG. 6 is a right side elevation view thereof.
Portions of the article not shown form no part of the claimed design.
Lotya, Mustafa, Finn, David
| Patent |
Priority |
Assignee |
Title |
| 10014249, |
Feb 02 2016 |
PARLEX PACIFIC LIMITED |
Circuit board and smart card module and smart card utilizing the same |
| 11113593, |
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| 11341385, |
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| 11347993, |
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AmaTech Group Limited; Federal Card Services, LLC |
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| 11645487, |
Aug 14 2019 |
AmaTech Group Limited; Federal Card Services, LLC |
Metal-containing dual interface smartcards |
| D764446, |
Feb 04 2015 |
Airgain Incorporated; AIRGAIN, INC |
Antenna |
| D768117, |
Apr 01 2015 |
Airgain Incorporated; AIRGAIN, INC |
Antenna |
| D822627, |
Jan 31 2017 |
Rohm Co., Ltd. |
Semiconductor device |
| D822628, |
Jan 31 2017 |
Rohm Co., Ltd. |
Semiconductor device |
| D823270, |
Sep 30 2016 |
Rohm Co., Ltd. |
Semiconductor device |
| D868756, |
Nov 10 2016 |
GM Global Technology Operations LLC |
Vehicle antenna |
| D911298, |
Feb 17 2017 |
STAT PEEL AG |
Chip |
| D930000, |
Oct 12 2018 |
HUAWEI TECHNOLOGIES CO , LTD |
Memory card |
| D930001, |
Feb 01 2018 |
Huawei Technologies Co., Ltd.; HUAWEI TECHNOLOGIES CO , LTD |
Card |
| D951956, |
Feb 01 2018 |
HUAWEI TECHNOLOGIES CO , LTD |
Memory card |
| ER1993, |
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| ER3457, |
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| ER3567, |
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| Patent |
Priority |
Assignee |
Title |
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Mar 17 1986 |
Mitsubishi Denki Kabushiki Kaisha |
Thin semiconductor card |
| 8649820, |
Nov 07 2011 |
BlackBerry Limited |
Universal integrated circuit card apparatus and related methods |
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| D327883, |
Feb 09 1990 |
Gemplus Card International |
Connecting terminal for chip cards |
| D328599, |
Apr 10 1990 |
Gemplus Card International |
Connecting terminal for chip cards |
| D342728, |
Feb 02 1989 |
Gemplus Card International |
Connecting terminal for chip cards |
| D344502, |
Feb 02 1989 |
Gemplus Card International |
Connecting terminal for chip cards |
| D353136, |
Mar 12 1992 |
Gemplus Card International |
Connecting terminal for chip cards |
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Jul 11 1991 |
Gemplus Card International |
Connecting terminal for chip cards |
| D358142, |
Mar 02 1992 |
Gemplus Card International |
Connecting terminal for chip cards |
| D393458, |
Jun 19 1995 |
Gemplus |
Connecting terminal for chip cards |
| D406821, |
Mar 06 1997 |
Siemens Aktiengesellschaft |
Carrier element for a semiconductor chip for integration into a chipcard, or a chipcard module |
| D406822, |
Mar 06 1997 |
Siemens Aktiengesellschaft |
Carrier element for a semiconductor chip for integration into a chipcard, or a chipcard module |
| D416246, |
Aug 19 1998 |
The Standard Register Company |
Contact layout for a smart card |
| D492688, |
Dec 09 2002 |
SanDisk Technologies LLC |
Memory card |
| D571810, |
Jun 20 2006 |
Kabushiki Kaisha Toshiba |
Module with built-in integrated circuits for use with IC cards |
| D602885, |
Apr 04 2008 |
CAPRES A S |
Connector for a microchip probe |
| D701864, |
Apr 23 2012 |
BlackBerry Limited |
UICC apparatus |
| D702240, |
Apr 13 2012 |
Malikie Innovations Limited |
UICC apparatus |
| D703208, |
Apr 13 2012 |
Malikie Innovations Limited |
UICC apparatus |
| D720354, |
Nov 22 2011 |
Kabushiki Kaisha Toshiba |
Module with built-in integrated circuits for use with IC card |
| D721047, |
Mar 07 2013 |
Vicor Corporation |
Semiconductor device |
| Date |
Maintenance Fee Events |
n/a
| Date |
Maintenance Schedule |
n/a