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Patent
   D406822
Priority
Mar 06 1997
Filed
Sep 08 1997
Issued
Mar 16 1999
Expiry
Mar 16 2013
Inventors
Huber, Mic…
Assg.orig
Siemens Ak…
Assg.curr
Siemens Ak…
Entity
unknown
Referenced by
25
References
6
Maint.:
n/a
The ornamental design for a carrier element for a semiconductor chip for integration into a chipcard, or a chipcard module, as shown and described.

The single FIGURE is a top perspective view of a carrier element for a semiconductor chip for integration into a chipcard, or a chipcard module showing our new design. The features on the undisclosed bottom are not claimed.
INVENTORS:

Huber, Michael, Stampka, Peter

THIS PATENT IS REFERENCED BY THESE PATENTS:
Patent Priority Assignee Title
8936199, Apr 13 2012 BlackBerry Limited UICC apparatus and related methods
8950681, Nov 07 2011 BlackBerry Limited Universal integrated circuit card apparatus and related methods
D429704, Mar 10 1999 Printed circuit board for wireless telephones
D442149, Mar 30 2000 Printed circuit board for a wireless telephone
D442150, Jul 24 2000 RF module board of wireless telephone
D442567, May 30 2000 Printed circuit board for a wireless telephone
D456367, Dec 15 2000 Protek Devices, LP Semiconductor chip
D545320, Sep 23 2005 Copying-prevention software chip for embedding in compact disc
D598380, May 09 2008 FUJIFILM Corporation Conductive sheet
D691610, Nov 07 2011 BlackBerry Limited Device smart card
D692005, Nov 07 2011 BlackBerry Limited Device smart card
D701864, Apr 23 2012 BlackBerry Limited UICC apparatus
D702240, Apr 13 2012 Malikie Innovations Limited UICC apparatus
D702694, Nov 07 2011 BlackBerry Limited Device smart card
D703208, Apr 13 2012 Malikie Innovations Limited UICC apparatus
D711842, Aug 04 2011 Swisscom AG Electronic chip card
D715234, Apr 18 2013 SemiLEDS Optoelectronics Co., Ltd. Flip chip
D720354, Nov 22 2011 Kabushiki Kaisha Toshiba Module with built-in integrated circuits for use with IC card
D756317, Aug 26 2014 AmaTech Group Limited Layout for contact pads and connection bridges of a transponder chip module
D776070, Mar 18 2014 Sony Corporation Non-contact type data carrier
D848382, Mar 18 2014 Sony Corporation Non-contact type data carrier
D868756, Nov 10 2016 GM Global Technology Operations LLC Vehicle antenna
D887998, Feb 17 2017 STAT PEEL AG Chip
D911298, Feb 17 2017 STAT PEEL AG Chip
D932450, Mar 08 2014 Sony Corporation Non-contact type data carrier
THIS PATENT REFERENCES THESE PATENTS:
Patent Priority Assignee Title
D279670, Jul 31 1978 Component side of a printed circuit board
D319629, Apr 13 1988 IBIDEN CO , LTD , A JAPANESE CORP Semiconductor substrate with conducting pattern
D327883, Feb 09 1990 Gemplus Card International Connecting terminal for chip cards
D328599, Apr 10 1990 Gemplus Card International Connecting terminal for chip cards
D359476, Aug 06 1993 Sankyo Seiki Mfg. Co., Ltd. Circuit board with mounting flange
D365092, Aug 12 1993 Siemens Aktiengesellschaft Chipcard module
ASSIGNMENT RECORDS    Assignment records on the USPTO
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Sep 08 1997Siemens Aktiengesellschaft(assignment on the face of the patent)
Sep 29 1997HUBER, MICHAELSiemens AktiengesellschaftASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0096150083 pdf
Sep 29 1997STAMPKA, PETERSiemens AktiengesellschaftASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0096150083 pdf
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