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The ornamental design for a circuit board with mounting flange, as shown and described. |
FIG. 1 is a is a top view of a circuit board with mounting flange showing our new design;
FIG. 2 is a side view thereof;
FIG. 3 is a side view there of taken orthogonal to FIG. 4;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a is a top view of a circuit board with mounting flange showing a second embodiment of our new design;
FIG. 6 is a side view thereof;
FIG. 7 is a side view thereof taken orthogonal to FIG. 8; and,
FIG. 8 is a bottom plan view thereof.
The broken line showing is included for the purpose of illustrating environmental structure only and forms no part of the claimed design.
Sakashita, Hiroshi, Fukuda, Yukio, Yamashita, Jun
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Dec 25 1993 | SAKASHITA, HIROSHI | SANKYO SEIKI MFG CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 006837 | /0686 | |
Dec 25 1993 | FUKUDA, YUKIO | SANKYO SEIKI MFG CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 006837 | /0686 | |
Dec 25 1993 | YAMASHITA, JUN | SANKYO SEIKI MFG CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 006837 | /0686 | |
Jan 03 1994 | Sankyo Seiki Mfg. Co., Ltd. | (assignment on the face of the patent) | / |
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