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The ornamental design for a carrier element for a semiconductor chip for integration into a chipcard, or a chipcard module, as shown and described. |
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The single FIGURE is a top perspective view of a carrier element for a semiconductor chip for integration into a chipcard, or a chipcard module showing our new design.
The features on the undisclosed bottom are not claimed.
Fischer, Jurgen, Fries, Manfred, Mundigl, Josef, Hauser, Christian, Puschner, Frank
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| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Sep 08 1997 | Siemens Aktiengesellschaft | (assignment on the face of the patent) | / | |||
| Sep 29 1997 | FISCHER, JUERGEN | Siemens Aktiengesellschaft | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 009615 | /0087 | |
| Sep 29 1997 | FRIES, MANFRED | Siemens Aktiengesellschaft | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 009615 | /0087 | |
| Sep 29 1997 | MUNDIGL, JOSEF | Siemens Aktiengesellschaft | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 009615 | /0087 |
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