Patent
   D279670
Priority
Jul 31 1978
Filed
Jul 31 1978
Issued
Jul 16 1985
Expiry
Jul 16 1999

TERM.DISCL.
Assg.orig
Entity
unknown
40
6
n/a
The ornamental design for the component side of a printed circuit board, as shown.

The FIGURE is a plan view of a component side of a printed circuit board showing my new design.

Lukits, John J.

Patent Priority Assignee Title
D406821, Mar 06 1997 Siemens Aktiengesellschaft Carrier element for a semiconductor chip for integration into a chipcard, or a chipcard module
D406822, Mar 06 1997 Siemens Aktiengesellschaft Carrier element for a semiconductor chip for integration into a chipcard, or a chipcard module
D566060, Apr 13 2005 Nitto Denko Corporation Grooves formed around a semiconductor device on a circuit board
D577691, Apr 13 2005 Nitto Denko Corporation Grooves formed around a semiconductor device on a circuit board
D577692, Apr 13 2005 Nitto Denko Corporation Grooves formed around a semiconductor device on a circuit board
D601978, Jan 09 2008 KONICA MINOLTA, INC Printed circuit board
D608824, Jan 09 2008 KONICA MINOLTA, INC Print head for an ink jet printer
D824344, May 26 2017 TINYPCB, INC Modular circuit board
D824345, May 26 2017 TINYPCB, INC Modular circuit board
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D833991, May 30 2017 TINYPCB, INC Modular circuit board
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D833993, May 30 2017 TINYPCB, INC Modular circuit board
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D841605, May 30 2017 TINYPCB, INC Modular circuit board
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D842260, May 30 2017 TINYPCB, INC Modular circuit board
D875057, May 26 2017 TINY PCB, Inc. Modular circuit board
Patent Priority Assignee Title
2228437,
3873880,
3988647, Sep 27 1974 General Electric Company Method for making a circuit board and article made thereby
235264,
DE2552553,
FR1345163,
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