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The ornamental design for a semiconductor chip, as shown and described.
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FIG. 1 is a perspective view of a semiconductor chip illustrating my new design;
FIG. 2 is a top view thereof;
FIG. 3 is a front elevational view showing one side of the semiconductor chip;
FIG. 4 is an end view of the semiconductor chip of FIG. 2 showing the left end thereof;
FIG. 5 is an end view of the semiconductor chip of FIG. 2 showing the right end thereof;
FIG. 6 is a side elevational view of the semiconductor chip of FIG. 2 showing a side opposite to that shown in FIG. 3; and,
FIG. 7 is a bottom view thereof.
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Dec 01 2000 | MATTESON, FREDERICK M | Protek Devices, LP | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 011366 | /0674 | |
Dec 15 2000 | Protek Devices, LP | (assignment on the face of the patent) | / |
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