| 
 |   The ornamental design for a semiconductor chip, as shown and described.   | |||||||||||||||||
FIG. 1 is a perspective view of a semiconductor chip illustrating my new design;
FIG. 2 is a top view thereof;
FIG. 3 is a front elevational view showing one side of the semiconductor chip;
FIG. 4 is an end view of the semiconductor chip of FIG. 2 showing the left end thereof;
FIG. 5 is an end view of the semiconductor chip of FIG. 2 showing the right end thereof;
FIG. 6 is a side elevational view of the semiconductor chip of FIG. 2 showing a side opposite to that shown in FIG. 3; and,
FIG. 7 is a bottom view thereof.
| Patent | Priority | Assignee | Title | 
| 8975694, | Mar 07 2013 | Vicor Corporation | Low resistance power switching device | 
| 9269661, | Mar 07 2013 | Vicor Corporation | Low resistance power switching device | 
| D503688, | Jul 03 2002 | DYNA Systems GmbH | Electrical logic element with relief symbol | 
| D714745, | Feb 14 2012 | Panasonic Corporation | Semiconductor | 
| D715234, | Apr 18 2013 | SemiLEDS Optoelectronics Co., Ltd. | Flip chip | 
| D721047, | Mar 07 2013 | Vicor Corporation | Semiconductor device | 
| D752000, | Mar 07 2013 | Vicor Corporation | Semiconductor device | 
| D813182, | Aug 02 2016 | PANASONIC SEMICONDUCTOR SOLUTIONS CO , LTD | Semiconductor device | 
| D887998, | Feb 17 2017 | STAT PEEL AG | Chip | 
| D911298, | Feb 17 2017 | STAT PEEL AG | Chip | 
| D934821, | Jul 24 2019 | NUVOTON TECHNOLOGY CORPORATION JAPAN | Semiconductor device | 
| ER1993, | |||
| ER3567, | |||
| ER3700, | 
| Patent | Priority | Assignee | Title | 
| 6013946, | Sep 11 1996 | SAMSUNG ELECTRONICS CO , LTD | Wire bond packages for semiconductor chips and related methods and assemblies | 
| 6201296, | Sep 23 1996 | Siemens Aktiengesellschaft | Semiconductor chip with protection against analyzing | 
| 6211572, | Oct 31 1995 | TESSERA, INC , A CORPORATION OF DELAWARE | Semiconductor chip package with fan-in leads | 
| 6297561, | May 26 1999 | United Microelectronics Corp. | Semiconductor chip | 
| 6300685, | Aug 20 1998 | OKI SEMICONDUCTOR CO , LTD | Semiconductor package | 
| 6303982, | Sep 20 1988 | Hitachi, Ltd. | Semiconductor device | 
| 6307269, | Jul 11 1997 | LONGITUDE SEMICONDUCTOR S A R L | Semiconductor device with chip size package | 
| D365092, | Aug 12 1993 | Siemens Aktiengesellschaft | Chipcard module | 
| D406822, | Mar 06 1997 | Siemens Aktiengesellschaft | Carrier element for a semiconductor chip for integration into a chipcard, or a chipcard module | 
| D421743, | Mar 19 1997 | Sony Corporation | Lens for semiconductor element | 
| D441726, | Jul 14 1999 | Kabushiki Kaisha Toyoda Jidoshokki Seisakusho | Semiconductor element | 
| D441727, | Oct 04 2000 | Sony Corporation | Semiconductor element | 
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| Dec 01 2000 | MATTESON, FREDERICK M | Protek Devices, LP | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 011366/ | 0674 | |
| Dec 15 2000 | Protek Devices, LP | (assignment on the face of the patent) | / | 
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