Patent
   D456367
Priority
Dec 15 2000
Filed
Dec 15 2000
Issued
Apr 30 2002
Expiry
Apr 30 2016
Assg.orig
Entity
unknown
11
12
n/a
The ornamental design for a semiconductor chip, as shown and described.

FIG. 1 is a perspective view of a semiconductor chip illustrating my new design;

FIG. 2 is a top view thereof;

FIG. 3 is a front elevational view showing one side of the semiconductor chip;

FIG. 4 is an end view of the semiconductor chip of FIG. 2 showing the left end thereof;

FIG. 5 is an end view of the semiconductor chip of FIG. 2 showing the right end thereof;

FIG. 6 is a side elevational view of the semiconductor chip of FIG. 2 showing a side opposite to that shown in FIG. 3; and,

FIG. 7 is a bottom view thereof.

Matteson, Frederick M.

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Patent Priority Assignee Title
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Dec 01 2000MATTESON, FREDERICK M Protek Devices, LPASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0113660674 pdf
Dec 15 2000Protek Devices, LP(assignment on the face of the patent)
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