FIG. 1 is a front elevation view of a connector for a microchip probe, in accordance with a first embodiment of my new design;
FIG. 2 is a rear elevation view of the connector of FIG. 1;
FIG. 3 is a left side elevational view of the connector of FIG. 1;
FIG. 4 is a right side elevational view of the connector of FIG. 1;
FIG. 5 is a top plan view of the connector of FIG. 1;
FIG. 6 is a bottom plan view of the connector of FIG. 1;
FIG. 7 is a front elevation view of a connector for a microchip probe, in accordance with a second embodiment of my new design;
FIG. 8 is a rear elevation view of the connector of FIG. 7;
FIG. 9 is a left side elevational view of the connector of FIG. 7;
FIG. 10 is a right side elevational view of the connector of FIG. 7;
FIG. 11 is a top plan view of the connector of FIG. 7; and,
FIG. 12 is a bottom plan view of the connector of FIG. 7.
| Patent |
Priority |
Assignee |
Title |
| 4871317, |
Dec 02 1987 |
Thor Technology Corporation |
Surface mounted component adaptor for interconnecting of surface mounted circuit components |
| 6418030, |
Sep 14 1993 |
Kabushiki Kaisha Toshiba |
Multi-chip module |
| 7253363, |
Jan 25 2000 |
Renesas Electronics Corporation |
Circuit board |
| 7520054, |
Feb 22 2002 |
ROSENBERGER HOCHFREQUENZTECHNIK GMBH & CO KG |
Process of manufacturing high frequency device packages |
| 20070205017, |
|
|
|
| 20090011621, |
|
|
|
| D255351, |
Jun 28 1978 |
Midgard Electronic Company, Inc. |
Circuit board |
| D289036, |
Feb 21 1984 |
Pace Incorporated |
Ornamental design for a frame of edge connectors utilized to replace damaged connectors on printed circuit boards |
| D358142, |
Mar 02 1992 |
Gemplus Card International |
Connecting terminal for chip cards |
| D457146, |
Nov 29 2000 |
Kabushiki Kaisha Kaisha Toshiba |
Substrate for a semiconductor element |
| D548199, |
Aug 26 2005 |
Exquisite Optical Technology Co. Ltd.; Wen Ching, Chen |
Flip chip on glass (FCOG) image sensor |