Patent
   D548199
Priority
Aug 26 2005
Filed
Aug 26 2005
Issued
Aug 07 2007
Expiry
Aug 07 2021
Assg.orig
Entity
unknown
8
7
n/a
The ornamental design for a flip chip on glass (FCOG) image sensor, as shown and described.

FIG. 1 is a perspective view of a flip chip on glass (FCOG) image sensor showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a top plain view thereof; and,

FIG. 7 is a bottom plain view thereof.

Chen, Wen Ching

Patent Priority Assignee Title
D570506, Jun 20 2006 Matsushita Electric Industrial Co., Ltd. Lighting apparatus
D573731, Jun 20 2006 Matsushita Electric Industrial Co., Ltd. Lighting apparatus
D585847, Sep 08 2006 CREE LED, INC LED lighting tile
D602885, Apr 04 2008 CAPRES A S Connector for a microchip probe
D658602, Jun 15 2010 Toshiba Lighting & Technology Corporation Light emitting diode module
D785609, Jan 06 2016 Symbol Technologies, LLC WLAN module
D791747, Jan 06 2016 Symbol Technologies, LLC RFID module
D791748, Jan 06 2016 Symbol Technologies, LLC Locationing module
Patent Priority Assignee Title
4940849, Oct 25 1985 Oxley Developments Company Limited Metallizing paste
5098769, Oct 26 1989 Polyplastics Co., Ltd. Two-shot molded article for use in circuit formation
6049122, Oct 16 1997 SHINKO ELECTRIC INDUSTRIES CO , LTD Flip chip mounting substrate with resin filled between substrate and semiconductor chip
20060055016,
20060154405,
D319814, Apr 13 1988 IBIDEN CO , LTD Semi-conductor substrate with conducting pattern
D473198, Oct 26 2001 Kabushiki Kaisha Toshiba Semiconductor device
//
Executed onAssignorAssigneeConveyanceFrameReelDoc
Aug 26 2005Exquisite Optical Technology Co. Ltd.(assignment on the face of the patent)
Aug 26 2005Wen Ching, Chen(assignment on the face of the patent)
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule