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Patent
D548199
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Priority
Aug 26 2005
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Filed
Aug 26 2005
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Issued
Aug 07 2007
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Expiry
Aug 07 2021
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Assg.orig
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Entity
unknown
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8
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7
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n/a
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The ornamental design for a flip chip on glass (FCOG) image sensor, as shown and described.
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FIG. 1 is a perspective view of a flip chip on glass (FCOG) image sensor showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a top plain view thereof; and,
FIG. 7 is a bottom plain view thereof.
Chen, Wen Ching
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| D570506, |
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| D573731, |
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Matsushita Electric Industrial Co., Ltd. |
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| D585847, |
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| D602885, |
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| D658602, |
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| D785609, |
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| D791747, |
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| D791748, |
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Symbol Technologies, LLC |
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| Patent |
Priority |
Assignee |
Title |
| 4940849, |
Oct 25 1985 |
Oxley Developments Company Limited |
Metallizing paste |
| 5098769, |
Oct 26 1989 |
Polyplastics Co., Ltd. |
Two-shot molded article for use in circuit formation |
| 6049122, |
Oct 16 1997 |
SHINKO ELECTRIC INDUSTRIES CO , LTD |
Flip chip mounting substrate with resin filled between substrate and semiconductor chip |
| 20060055016, |
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| 20060154405, |
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| D319814, |
Apr 13 1988 |
IBIDEN CO , LTD |
Semi-conductor substrate with conducting pattern |
| D473198, |
Oct 26 2001 |
Kabushiki Kaisha Toshiba |
Semiconductor device |
| Date |
Maintenance Fee Events |
n/a
| Date |
Maintenance Schedule |
n/a