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The ornamental design for an ic module, as shown and described. |
FIG. 1 is a front, bottom and right side perspective view of an IC module, showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a right side elevational view thereof, the opposite side being a mirror image;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof; and,
FIG. 6 is a rear elevational view thereof.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Nov 13 1996 | ISHIHARA, TOMIAKI | Kabushiki Kaisha Toshiba | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 008398 | 0380 | |
Nov 27 1996 | Kabushiki Kaisha Toshiba | (assignment on the face of the patent) |
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