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The ornamental design for an ic module, as shown and described. |
FIG. 1 is a perspective view of the front, bottom and right side elevational view of an IC module, showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a left side elevational view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a top plan view thereof, the bottom plan view is identical; and,
FIG. 6 is a rear elevational view thereof.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Mar 01 1995 | OHMORI, JUN | Kabushiki Kaisha Toshiba | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 007392 | /0181 | |
Mar 01 1995 | IWASAKI, HIROSHI | Kabushiki Kaisha Toshiba | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 007392 | /0181 | |
Mar 16 1995 | Kabushiki Kaisha Toshiba | (assignment on the face of the patent) | / |
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