Patent
   D387747
Priority
May 29 1996
Filed
Nov 27 1996
Issued
Dec 16 1997
Expiry
Dec 16 2011
Assg.orig
Entity
unknown
40
5
n/a
The ornamental design for an ic module, as shown and described.

FIG. 1 is a front, bottom and right side perspective view of an IC module, showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a right side elevational view thereof, the opposite side being a mirror image;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof; and,

FIG. 6 is a rear elevational view thereof.

Ishihara, Tomiaki

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Patent Priority Assignee Title
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JP940809,
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Nov 13 1996ISHIHARA, TOMIAKIKabushiki Kaisha ToshibaASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0083980378 pdf
Nov 27 1996Kabushiki Kaisha Toshiba(assignment on the face of the patent)
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