Patent
   D567244
Priority
Dec 30 2005
Filed
Jun 29 2006
Issued
Apr 22 2008
Expiry
Apr 22 2022
Assg.orig
Entity
unknown
6
5
n/a
The ornamental design for a module for an ic card, as shown and described.

The FIGURE is a top plan view of a module for an IC card showing our new design. The bottom plan view is a mirror image. The module shown is of no substantial thickness.

The broken line depicted around the IC card module merely represents the boundaries of the unclaimed area that the module would be placed within, and forms no part of the claimed design.

Frallicciardi, Paolo, Visconti, Edoardo

Patent Priority Assignee Title
8950681, Nov 07 2011 BlackBerry Limited Universal integrated circuit card apparatus and related methods
D691610, Nov 07 2011 BlackBerry Limited Device smart card
D692005, Nov 07 2011 BlackBerry Limited Device smart card
D702694, Nov 07 2011 BlackBerry Limited Device smart card
D877739, Sep 15 2017 uQontrol, Inc. Smartcard with Q-shaped contact pad
ER2172,
Patent Priority Assignee Title
D358142, Mar 02 1992 Gemplus Card International Connecting terminal for chip cards
D389130, May 29 1996 Kabushiki Kaisha Toshiba IC module
D393458, Jun 19 1995 Gemplus Connecting terminal for chip cards
D405779, Oct 25 1996 Infineon Technologies AG Carrier element for a semiconductor chip for integration into a chipcard
D416246, Aug 19 1998 The Standard Register Company Contact layout for a smart card
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Mar 26 2006FRALLICCIARDI, PAOLOST INCARD S R L ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0183640523 pdf
Jun 29 2006Incard SA(assignment on the face of the patent)
Oct 30 2006ST INCARD S R L Incard SAASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0189790468 pdf
Apr 10 2013STMICROELECTRONICS N V STMICROELECTRONICS INTERNATIONAL N V ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0306690257 pdf
May 21 2013Incard SASTMICROELECTRONICS N V ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0306690192 pdf
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