FIG. 1 is a perspective view of an embodiment of an asymmetrical arrangement of contact pads and connection bridges of a transponder chip module.
FIG. 2 is a front elevation view thereof.
FIG. 3 is a rear elevation view thereof.
FIG. 4 is a top plan view thereof.
FIG. 5 is a bottom plan view thereof.
FIG. 6 is a left side elevation view thereof; and,
FIG. 7 is a right side elevation view thereof.
The dot-dash-dot lines in the drawings are included for the purpose of illustrating portions of the asymmetrical arrangement of contact pads and connection bridges of the transponder chip module that form no part of the claimed design.
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