Winding a module antenna (MA) for an antenna module (AM) on a tubular support structure (SS) having have a lid structure (LD) or a planar tool (PT) disposed at its free end to constrain the windings. Alternatively, winding wire coils for module antennas (MA) on coil winding forms (CWF, FIG. 26) and transferring them to a module tape (MT). Double-sided and single-sided module tapes (MT) having vias and openings (h) are disclosed. Connection bridges (CBR) formed within, between or surrounding the contact pads (CP) are disclosed. Various configurations for components (CA, CC, EA) of booster antenna (BA) are disclosed. A coupler coil (CC) has an inner winding (iw) and an outer winding (ow). Techniques for embedding wire and for bonding wire are disclosed.
|
3. A method of making an antenna module (AM) interim product comprising:
providing a module tape (MT); and
providing support structure (SS, DS, WC) having a tubular body portion (B) on a surface of the module tape, the tubular body portion having an end on the surface of the module tape and a free end;
characterized by:
disposing a planar element (LD, CP, PT) against the free end of the body portion;
wherein the planar element is in the form of a ring, and further comprising:
with the planar element (LD, CP, PT) in place on the tubular body portion (B), filling an interior area of the body portion (B) with encapsulant (GT).
1. A module tape (MT) for an rfid antenna module (AM) comprising:
a substrate (MT); and
a support structure (SS, DS, WC) disposed on a surface of the substrate and comprising a tubular body portion (B) having two opposite open ends, one of which is disposed against the surface of the substrate, the other of which is a free end;
characterized by:
a planar element (LD, CP, PT) selected from the group consisting of a flange (F), a lid (LD, CP) and a tool (PT) disposed upon the free end of the support structure for constraining winding of the module antenna (MA) on the support structure;
wherein:
the planar element is in the form of a disc or ring having an outer diameter which is greater than an outer diameter of the tubular body portion (B).
2. The module tape of
at least one of the planar element and the tubular body portion comprise ferrite.
4. The method of
the support structure (SS, DS, WC) is formed on the module tape (MT) by an additive process.
|
|||||||||||||||||||||||||||||||
Priority is claimed from the following US provisional and non-provisional applications:
This is a nonprovisional of U.S. 61/875,046 filed 8 Sep. 2013
This is a nonprovisional of U.S. 61/868,089 filed 21 Aug. 2013
This is a nonprovisional of U.S. 61/860,354 filed 31 Jul. 2013
This is a nonprovisional of U.S. 61/841,286 filed 29 Jun. 2013
This is a nonprovisional of U.S. 61/827,754 filed 28 May 2013
This is a continuation-in-part of U.S. Ser. No. 14/020,884 filed 8 Sep. 2013
This is a continuation-in-part of U.S. Ser. No. 13/600,140 filed 30 Aug. 2012 (US 20130075477, 28 Mar. 2013)
This is a continuation-in-part of U.S. Ser. No. 13/931,828 filed 29 Jun. 2013) which is a continuation of U.S. Ser. No. 13/205,600 filed 8 Aug. 2011 (published US 20120038445, 16 Feb. 2012; issued U.S. Pat. No. 8,474,726, 12 Jul. 2013) which claims priority from . . .
This is a continuation-in-part of U.S. Ser. No. 13/744,686 filed 18 Jan. 2013 (published US 20130126622, 22 May 2013) which claims priority from . . .
This is a continuation-in-part of U.S. Ser. No. 13/730,811 filed 28 Dec. 2012, which is a continuation-in-part of U.S. Ser. No. 13/310,718 filed 3 Dec. 2011 (published US 20120074233, 29 Mar. 2012; issued U.S. Pat. No. 8,366,009 5 Feb. 2013) which claims priority from . . .
This is a continuation-in-part of U.S. Ser. No. 14/061,864 filed 24 Oct. 2013 which is a continuation of U.S. Ser. No. 13/027,415 filed 15 Feb. 2011 (US 20120080527, 5 Apr. 2012).
The disclosure relates to “secure documents” such as electronic passports, electronic ID cards and smartcards (or smart cards, data carriers, chip cards, payment cards, and the like) having RFID (radio frequency identification) chips or chip modules (CM) capable of operating in a “contactless” mode (ISO 14443) including dual interface (DI) smartcards and secure documents which can also operate in contact mode (ISO 7816-2) and, more particularly, to antenna modules (AMs) for the secure documents, particularly smartcards. The disclosure also relates to how a module antenna (MA) coils for the antenna modules (AMs) may be wound. The disclosure further relates to techniques for embedding wire in a substrate which may, for example, be a module tape (MT) of an antenna module (AM). The disclosure also relates to controlling bonding of wires, such as ends of module antennas (MAs) to RFID chips (CMs).
Dual interface (DI, or DIF) smartcards (more generally, secure documents) may comprise an antenna module (AM) with a number of (typically 6 or 8) contact pads (CP) connected with an RFID chip (CM) via wire bonds or flip chip assembly, and a booster antenna (BA) in the card body (CB) consisting of a card body antenna (CA) and coupling coil (CC) which inductively couples with the module antenna (MA) of the antenna module (AM).
The antenna module “AM” may generally comprise a “DI” RFID chip (bare, unpackaged silicon die) or chip module (a die with leadframe, carrier or the like)—either of which may be referred to as “CM”—mounted to a module tape “MT”. A module antenna MA may be disposed on the module tape MT for implementing a contactless interface. Contact pads “CP” may be disposed on the module tape MT for implementing the contact interface. The module tape MT may comprise a pattern of interconnects (conductive traces and pads) to which the chip CM and contact pads CP may be connected.
The module antenna MA may be connected, indirectly, via some of the interconnects to the chip CM, or may be directly connected to bond pads BP on the chip CM. The module antenna MA may comprise several turns of wire, such as 112 micron diameter insulated wire. Reference may be made to U.S. Pat. No. 6,378,774 (2002, Toppan), for example FIGS. 12A, B thereof.
It is a general object of the invention to provide improvements in antenna modules (AMs), including but not limited to, how the module antenna (MA) is mounted on the antenna module (AM), improvements in the module antenna (MA) itself, techniques for winding the module antenna (MA), techniques for embedding wire in a substrate such as the module tape (MT) of an antenna module (AM), and techniques for bonding wire such as ends of the module antenna (MA) to terminals of an RFID chip (CM), and the like. These and other objects may be achieved individually or collectively by various embodiments of the invention disclosed herein.
A support structure (SS, DS, WC) may be mounted to or formed upon a module tape (MT), and a module antenna (MA) may be wound on the support structure. A planar element in the form of a flange (F) a lid structure (LD) or a cap (CP), or a tool (PT) may be disposed at the free end of a tubular body portion (B) of the support structure to constrain wire as it is wound on the support structure. The planar element may be in the form of a ring having an opening to allow encapsulant (GT) to be dispensed in the interior of the support structure. The support structure may additionally serve as a dam for containing encapsulant (GT) covering the chip (CM) and its connections. The module antenna (MA), winding core (WC) and chip (CM) may subsequently be overmolded with a mold mass (MM). Wire coils for the module antennas may be wound, using any suitable technique, such as flyer winding or radial winding.
According to some embodiments (examples) of the invention, generally, methods of winding wire coils for module antennas (MA) of antenna modules (AM) may include remotely winding the coils (on coil winding forms (CWF)), and transferring them to the module tape (MT).
Double-sided and single-sided module tapes (MT) having vias and openings are disclosed. Connection bridges (CBRs) formed within, between or surrounding the contact pads (CPs) are disclosed. Techniques for embedding wire and for connecting wire are also disclosed.
According to some embodiments (examples) of the invention, generally, contact pads (CP) and connection bridges (CBR) may be formed from metallization on a surface of a module tape (MT), which may be a single-sided tape. Holes through the module tape (MT) permit components on the other side of the module tape to be wire bonded to the underside of the contact pads and/or connection bridges.
According to some embodiments (examples) of the invention, generally, a smart card (SC) may comprise a metallized layer, a compensating loop, or ferrite in the card body (CB).
According to some embodiments (examples) of the invention, generally, booster antenna (BA) components such as card antenna (CA), coupler coil (CC) and extension antenna (EA) may be laid with senses (clockwise, counter clockwise) which are opposite from one another. When being laid, these components may be laid from an innermost turn to an outermost turn, or vice-versa.
According to some embodiments (examples) of the invention, generally, some techniques are disclosed for winding module antenna (MA) coils, such as winding on coil winding forms (CWF) and transferring the coils to the module tape (MT).
Other embodiments may be disclosed, and may be claimed. Some interim products are disclosed, and may be claimed.
The invention(s) described herein may relate to industrial and commercial industries, such RFID devices and applications, smartcards, electronic passports and the like.
Other objects, features and advantages of the invention(s) disclosed herein may become apparent in light of the following illustrations and descriptions thereof.
Reference will be made in detail to embodiments of the disclosure, non-limiting examples of which may be illustrated in the accompanying drawing figures (FIGS). The figures may generally be in the form of diagrams. Some elements in the figures may be exaggerated or drawn not-to-scale, others may be omitted, for illustrative clarity. Some figures may be in the form of diagrams.
When terms such as “left” and “right”, “top” and “bottom”, “upper” and “lower”, “inner” and “outer”, or similar terms are used in the description, they may be used to guide the reader to orientations of elements in the figures, but should be understood not to limit the apparatus being described to any particular configuration or orientation, unless otherwise specified or evident from context.
Different “versions” or iterations of elements may be referenced by reference numerals having the same numbers (###) followed by a different letter suffix (such as “A”, “B”, “C”, or the like), in which case the similar elements may be inclusively referred to by the numeric portion (###) only of the reference numeral. Similar elements in different drawings may be referred to by similar numbers, differing in their most significant (typically hundreds) digit. Some elements may be referred to with letters (e.g., “BA”, “CA”, “CC”, “EA” and the like), rather than (or in addition to) numerals (e.g., “12”). Any text (legends, notes, reference numerals and the like) appearing on the drawings are incorporated by reference herein.
Although the invention may be illustrated in the context of various exemplary embodiments, it should be understood that it is not intended to limit the invention to these particular embodiments, and individual features of various embodiments may be combined with one another.
FIGS. 21A,B,C,D, E are diagrams showing contact pads C1-C6 of an antenna module (AM), and contact bridges (CBR).
Various embodiments will be described to illustrate teachings of the invention(s), and should be construed as illustrative rather than limiting. It should be understood that it is not intended to limit the invention(s) to these particular embodiments. It should be understood that some individual features of various embodiments may be combined in different ways than shown, with one another. Reference herein to “one embodiment”, “an embodiment”, or similar formulations, may mean that a particular feature, structure, operation, or characteristic described in connection with the embodiment may be included in at least one embodiment of the present invention.
The embodiments and aspects thereof may be described and illustrated in conjunction with systems, devices and methods which are meant to be exemplary and illustrative, not limiting in scope. Specific configurations and details may be set forth in order to provide an understanding of the invention(s). However, it should be apparent to one skilled in the art that the invention(s) may be practiced without some of the specific details being presented herein. Furthermore, some well-known steps or components may be described only generally, or even omitted, for the sake of illustrative clarity.
Headings (typically underlined) may be provided as an aid to the reader, and should not be construed as limiting. Any dimensions and materials or processes set forth herein should be considered to be approximate and exemplary, unless otherwise indicated.
Reference may be made to disclosures of prior patents, publications and applications. Some text and drawings from those sources may be presented herein, but may be modified, edited or commented to blend more smoothly with the disclosure of the present application.
In the main hereinafter, RFID cards, electronic tags and secure documents in the form of pure contactless cards, dual interface cards, phone tags, electronic passports, national identity cards and electronic driver licenses may be discussed as exemplary of various features and embodiments of the invention(s) disclosed herein. As will be evident, many features and embodiments may be applicable to (readily incorporated in) other forms of smartcards, such as EMV payment cards, metal composite cards, metal hybrid cards, metal foil cards, access control cards and secure credential documents. As used herein, any one of the terms “transponder”, “tag”, “smartcard”, “data carrier” and the like, may be interpreted to refer to any other of the devices similar thereto which operate under ISO 14443 or similar RFID standard. The following standards are incorporated in their entirety by reference herein:
A typical data carrier described herein may comprise
When “chip module” is referred to herein, it should be taken to include “chip”, and vice versa, unless explicitly otherwise stated. Chip or chip module may be referred to as “CM”. Throughout the various embodiments disclosed herein, unless specifically noted otherwise (in other words, unless excluded), the element referred to as “CM” will most appropriately be a bare integrated circuit (IC) die (or RFID chip), rather than a chip module (a die with a carrier). In contrast therewith, some figures present examples that are specifically “chip modules” having IC chips (such as a “CM”) mounted and connected to substrates. A “chip module” (die and carrier) with a module antenna (MA) mounted and connected thereto may be referred to as an antenna module (AM).
The module antenna (MA) may comprise a coil of wire, conductive traces etched or printed on a module tape (MT) or antenna substrate (AS) for the antenna module (AM), or may be incorporated directly on the chip itself.
The descriptions that follow are mostly in the context of dual interface (DI, DIF) smartcards, and relate mostly to the contactless operation thereof. Many of the teachings set forth herein may be applicable to electronic passports and the like having only a contactless mode of operation (single interface). Generally, any dimensions set forth herein are approximate, and any materials set forth herein are intended to be exemplary, not limiting.
RFID Cards, Generally
For the purpose of discussion, an RFID (radio frequency identification) card, which may be referred variously as an integrated circuit card (IC card or “chip card”) or secure document, generally comprises an RFID chip (CM) implanted in or disposed on a substrate and a card antenna (CA) disposed in or on a substrate, may operate on the principle of inductive coupling with no physical electrical connections between the chip module (CM) and the card antenna (CA), and may form the basis of a secure document such as an electronic passport, national identity card, contactless smartcard, contact/contactless smartcard, chip card, electronic EMV (Europay, MasterCard and Visa) payment card, electronic driver's license, electronic health card or electronic tag, which may also be referred to as a data carrier with contactless functionality.
An RFID silicon die packaged in a suitable housing may be referred to as a chip module (CM). The chip module in its broadest sense also encompasses an integrated circuit (IC), a bare silicon die, a stud-bumped chip, a straight wall bumped chip or a coil on chip device.
The chip module (CM) may be a lead-frame-type chip module, an epoxy-glass type chip module or a flexible PET chip module. The RFID silicon or organic die may be mounted to the chip carrier tape or module tape (MT) forming the chip module (CM) by means of die & wire bonding or flip chip assembly. The chip carrier tape can be metallized on one side (contact side) or on both sides with through-hole plating to facilitate the interconnection with the antenna. The chip carrier tape may also incorporate a chemically etched antenna, printed antenna or nanostructured antenna.
The substrate, which may be referred to as an “inlay substrate” (such as for an electronic passport) or “card body” (such as for a smartcard) may comprise one or more layers of material such as Polyvinyl Chloride (PVC), Polycarbonate (PC), Polyethylene (PE), Poly(ethylene terephthalate) (PET), Polyetherurethane, PET-G (Polyethylene Terephalate Glycol-modified), Polyester Copolymer film, Teslin™, paper, synthetic paper and the like.
The combination of RFID chip (CM) and card antenna (CA) may operate solely in a contactless (non-contact) mode (such as ISO 14443), or may be a dual interface (DI, DIF) chip module (CM) which may additionally be operative to function in a contact mode (such as ISO 7816-2) and a contactless mode. The RFID chip (CM) may harvest energy from an RF signal supplied by an external RFID reader device with which it communicates.
The chip module (CM) may also be referred to as an antenna module (AM) incorporating a chip carrier tape or module tape (MT), an RFID die mounted to the module tape (MT) by means of die & wire bonding or flip chip assembly, and a module antenna (MA). In most cases, the RFID die is referred to as the chip or chip module forming part of the antenna module.
The antenna module (AM) may be quite small (having a punching size of 10.8 mm×8.2 mm for a 6 contact pad module from NXP or 11.0 mm×8.3 mm for a 6 contact pad module from Infineon, or 13.0 mm×11.8 mm for a 8 contact pad module from Infineon), in contrast with the card antenna (CA) (such as approximately 50 mm×80 mm).
The module antenna (MA) of the antenna module (AM) is inductively coupled rather than electrically connected to the card antenna (CA). In such case, the card antenna (CA) may be referred to as a booster antenna (BA). The booster antenna (BA) may comprise a portion disposed around the periphery of the card body (CB), and another portion which may comprise a coupler coil (CC) disposed at an interior area of the card body (CB) for inductively coupling with the module antenna (MA). The terms card antenna (CA) and booster antenna (BA) may be used interchangeably herein.
The module antenna MA may be a wire-wound coil, or an etched spiral pattern of conductive traces. For an etched pattern, the RFID chip CM is typically disposed in the center of the spiral antenna pattern, making that space unavailable for turns of the antenna. A significant amount of space around the chip CM is unavailable for the etched antenna. The antenna module AM may have 8 or 6 contact pads. Some dimensions (all approximate) for the module may be,
Because of the restrictions on the size of the smartcard module (e.g. approximately 13×12 mm, or 11×9 mm), the number of turns forming the antenna is limited to the space surrounding the central position of the silicon die which is attached and bonded to the module substrate. This substrate is generally made of epoxy glass with a contact metallization layer on the face-up side and a bonding metallization layer on the face-down side of the module. The chemically etched antenna is usually formed on the face-down side.
Reference is made to ISO 7816, incorporated by reference herein. To provide some context, the overall dimensions of the card body, as defined by ISO 7816 are:
U.S. Ser. No. 14/020,884 filed 8 Sep. 2013, describes some embodiments of smartcards, more particularly some embodiments of booster antennas BAs, techniques for embedding wire in a controlled manner in a substrate, and techniques for controlling wire bonding.
An embedding head (or tool) for embedding the wire for the booster antenna BA and its various components in a substrate may comprise an ultrasonic transducer (or sonotrode) vibrating a capillary tube through which the wire being embedded extends (or is fed) onto the surface of the substrate. By imparting an ultrasonic vibration of the tool while applying a downward force (urging the tool downward, with a force), the wire may be caused to become embedded, at least partially, into the surface of the card body CB substrate. Reference may be made to U.S. Pat. No. 6,698,089 (2004; Finn et al) and U.S. Pat. No. 6,233,818 (2001; Finn et al), incorporated by reference herein, which disclose embedding wire in a substrate using a sonotrode. See, for example, FIGS. 1 and 3 of U.S. Pat. No. 6,698,089.
Controlling Force and Ultrasonic Power During Wire Embedding
The booster antenna (BA) (and any of its components CA, OW, IW, CC, AE) may comprise several turns of wire embedded very close to one another. When embedding the several turns of a booster antenna (BA), notably the peripheral card antenna (CA) portion thereof, it may be appreciated that the first turn of wire may be embedded in the “native” substrate of the card body (CB), and may interfere (resisting or blocking, in a manner of speaking) with the embedding of subsequent turns of the booster antenna (BA).
C1
VDD
C2
RST_N
C3
CLK
C4
not used
C5
VSS
C6
not used
C7
IO 1
C8
not used
An 8-pad layout may measure approximately 12 mm×13 mm.
A 6-pad layout may measure approximately 9 mm×12 mm.
The module antennas MAs described herein may be formed in various ways, such as but not limited to:
An embedding head (or tool) for embedding the wire for the booster antenna BA and its various components in the substrate may comprise an ultrasonic transducer (or sonotrode) vibrating a capillary tube through which the wire being embedded extends (or is fed) onto the surface of the substrate. By imparting an ultrasonic vibration of the tool while applying a downward force (urging the tool downward, with a force), the wire may be caused to embed itself, at least partially, into the surface of the card body CB substrate. Reference may be made to U.S. Pat. No. 6,698,089 (2004; Finn et al) and U.S. Pat. No. 6,233,818 (2001; Finn et al), incorporated by reference herein, which disclose embedding wire in a substrate using a sonotrode. See, for example, FIGS. 1 and 3 of the '089 patent.
The booster antenna (BA) (and any of its components CA, OW, IW, CC, AE) may comprise several turns of wire embedded very close to one another. When embedding the several turns of a booster antenna (BA), notably the peripheral card antenna (CA) portion thereof, it may be appreciated that the first turn of wire may be embedded in the “native” substrate of the card body (CB), and may interfere (resisting or blocking, in a manner of speaking) with the embedding of subsequent turns of the booster antenna (BA).
A Booster Antenna configuration
U.S. Pat. No. 8,130,166 (2012; Assa Abloy) discloses a coupling device formed by a continuous conductive path having a central section (12) and two extremity sections (11, 11′), the central section (12) forming at least a small spiral for inductive coupling with the transponder device, the extremities sections (11, 11′) forming each one large spiral for inductive coupling with the reader device. The inner end of the outer extremity section (11) and the outer end of the inner extremity section (11′) are connected with the coupler coil (12). The outer end (13) of the outer extremity section (11) and the inner end (13′) of the inner extremity section (11′) are left unconnected (loose).
The booster antenna BA comprises an outer winding OW and an inner winding IW, both extending substantially around the periphery of the card body CB. Each of the inner and outer windings has an inner end IE and an outer end OE. The outer end OE (b) of the outer winding OW is connected with the inner end IE (e) of the inner winding IW, via a coupler coil CC. The inner end IE (a) of the outer winding OW and the outer end OE (f) of the inner winding IW may be left unconnected, as “free ends”. The overall booster antenna BA comprising outer winding OW, coupler coil CC and inner winding IE is an open circuit, and may be referred to as a “quasi-dipole”—the outer winding OW constituting one pole of the dipole, the inner winding IW constituting the other pole of the dipole—center fed by the coupler coil CC.
The booster antenna BA may be formed using insulated, discrete copper wire disposed (such as ultrasonically bonded) around (inside of) the perimeter (periphery) of a card body CB (or inlay substrate, or data carrier substrate, such as formed of thermoplastic). The booster antenna BA comprises an outer winding OW (or coil, D) and an inner winding IW (or coil, D), and further comprises a coupler coil CC, all of which, although “ends” of these various coil elements are described, may be formed from one continuous length of wire (such as 80 μm self-bonding wire) which may be laid upon or embedded in the card body CB. More particularly,
The outer winding OW, coupler coil CC and inner winding IW may be formed as one continuous structure, using conventional wire embedding techniques. It should be understood that references to the coupler coil CC being connected to ends of the outer winding (OW) and inner winding (IW) should not be construed to imply that coupler coil CC is a separate entity having ends. Rather, in the context of forming one continuous structure of outer winding OW, coupler coil CC and inner winding IW, “ends” may be interpreted to mean positions corresponding to what otherwise would be actual ends—the term “connected to” being interpreted as “contiguous with” in this context.
The dimensions of the card body CB may be approximately 54 mm×86 mm. The outer dimension of the outer winding OW of the booster antenna BA may be approximately 80 mm×50 mm. The wire for forming the booster antenna BA may having a diameter (d) of approximately 100 μm (including, but not limited to 80 mm, 112 μm, 125 μm.
The inner winding IW may be disposed within the outer winding OW, as illustrated, on a given surface of the card body CB (or layer of a multi-layer inlay substrate). Alternatively, these two windings of the booster antenna BA may be disposed on opposite surfaces of the card body CB, substantially aligned with one another (in which case they would be “top” and “bottom” windings rather than “outer” and “inner” windings. The two windings of the booster antenna BA may be coupled in close proximity so that voltages induced in them may have opposite phase from one another. The coupler coil CC may be on the same surface of the card body CB as the outer and inner windings.
The turns of the outer winding OW and inner winding IW of the booster antenna BA may be at a pitch of 0.2 mm (200 μm), resulting in a space of approximately one wire diameter between adjacent turns of the outer winding OW or inner winding IW. The pitch of the turns of the coupler coil CC may be substantially the same as or less than (stated otherwise, not greater than) the pitch of turns of at least one of the outer winding OW and inner winding IW—for example 0.15 mm (150 μm), resulting in space smaller than one wire diameter between adjacent turns of the coupler coil (CC). Self-bonding copper wire may be used for the booster antenna BA. The pitch of both the outer/inner windings OW/IW and the coupler coil CC may both be approximately 2× (twice) the diameter of the wire (or width of the conductive traces or tracks), resulting in a spacing between adjacent turns of the spiral(s) on the order of 1 wire diameter (or trace width). The pitches of the outer winding OW and the inner winding IW may be substantially the same as one another, or they may be different than each other.
More turns of wire for the coupler coil CC can be accommodated in a given area—for example, by laying two “courses” of wire, one atop the other (with an insulating film therebetween, if necessary), in a laser-ablated trench defining the area for the turns of the coupler coil CC.
Reference is made to
Some Coupler Coil (CC) Configurations
The booster antenna BA comprises a card antenna CA component, a coupler coil CC component and an extension antenna EA component. These components may be formed (embedded in the card body CB as one continuous embedded coil. The coupler coil CC is in the form of an open loop (“horseshoe”), rather than a loop.
Note that both of the outer winding OW and inner winding IW may be enlarged to form the coupler coil CC and substantially fully encircle the antenna module AM in what may be referred to as the “coupling area” of the card body CB. The free ends (a, 0 of the card antenna CA are shown at the right edge of the card body CB.
In this example, the extension antenna EA has one end extending from an end of the coupler coil CC, and another end extending from an end of the card antenna CA, and exhibits a cross-over. The extension antenna EA (or extension coil, or extension loop) is disposed so as to have a portion adjacent two sides (or approximately 180°) of the coupler coil CC. The extension antenna EA component is shown as an “extension” of the inner winding IW, comprising some turns of wire in a spiral pattern disposed near the antenna module AM in the left hand side of the top (as viewed) portion of the card body CB. The extension antenna EA may be disposed outside of, but near the coupling area (144) of the card body CB.
In this example, the coupler coil CC component of the booster antenna BA does not need to be a “true” coil, it does not need to have a cross-over. Rather, it may be a horseshoe-shaped “open” loop which substantially fully, but less than 360°, encircles the coupling area (labeled “AM”) for inductive coupling with the module antenna MA of the antenna module AM.
In this example, the card antenna CA is a true coil, in the form of a spiral extending around the peripheral area (142) of the card body CB, and exhibits a cross-over.
The extension antenna (or extension coil) EA has two ends—one end is connected to the coupler coil CC, the other end is connected to the card antenna CA. The extension antenna EA may be formed as a spiral of wire embedded in the card body CB, contiguous with one or more of the card antenna CA and coupler coil CC, and is a true coil which exhibits a cross-over, and contributes to the inductive coupling of the booster antenna BA. The extension antenna EA is shown as being disposed only in the upper half of the card body CB, but it may extend to the lower half of the card body CB.
Some Configurations of Booster Antenna (BA) Components
The booster antenna BA may comprise various antenna components, such as (but not limited to):
The components CA, CC, EA of the booster antenna BA may be interconnected, as shown. The components of the booster antenna may comprise wire which is laid in a continuous path, from a starting point “a” to a finishing point “f” (or vice-versa). In some of the examples, the “sense” or laying direction (either clockwise CW, or counter clockwise CCW) of the various components may be the same, or different than (e.g., opposite from) the sense of other components. Some of the components may be “true coils” which may form a complete loop having a crossover “x” and contributing to the inductive coupling of the booster antenna BA. The overall booster antenna BA may have two or more crossovers “x”. The various components may each be shown with only a few turns, for illustrative simplicity, and are generally laid in a flat rectangular spiral pattern having a number (generally two or more) “turns”. One of the turns, or a portion thereof, may be an “innermost” turn of the booster antenna component. Another of the turns, or a portion thereof, may be an “outermost” turn of the booster antenna component.
Some characteristics and advantages of the various configurations shown in
The following table presents the “laying” senses of the various components CA (OW, IW), CC, EA of the booster antenna BA. (The OW and IW may have the same sense as one another.)
OW of CA
CC
EA
IW of CA
FIG. 1H
CW
CCW
CW
CW
FIG. 1I
CW
CCW
CCW
CW
FIG. 1J
CW
CCW
CW
CW
FIG. 1K
CW
CCW
CCW
CW
FIG. 1L
CW
(IP) CCW
CW
CW
(OP) CW
FIG. 1M
CW
(IP) CCW
CCW
CW
(OP) CCW
Although not specifically directed to the antenna module AM, the configurations of and improvements to booster antennas disclosed herein may provide for improved coupling of the booster antenna BA with the antenna module AM, and consequent improvements in “read distance” and “activation distance”.
According to some embodiments (examples) of the invention, a booster antenna (BA) may comprise a card antenna (CA) component disposed around a periphery of a card body (CB) and comprising an inner winding (IW) and an outer winding (OW); a coupler coil (CC) component disposed at a location for an antenna module (AM) on the card body (CB); and an extension antenna (EA) component; and may be characterized in that: at least one of the components is laid having a sense which is opposite one or more of the other components. At least some of the components may have innermost and outermost turns; at least one of the components is laid from an innermost turn to an outermost turn; and at least another of the components is laid from an outermost turn to an innermost turn.
Embedding and Bonding
A method is disclosed in U.S. Ser. No. 14/020,884 for controlling at least one of the downward force which is exerted by an embedding tool and a power of ultrasonic vibration while embedding the wire in the surface of a substrate. Various benefits may be obtained, such as improved embedding of the wire, more consistent embedding of the wire, and reduced pitch (closer spacing) of turns of the wire in a booster antenna BA component (for example) which may allow for more turns of wire (hence, more inductance) in a given space. (such as, but not limited to the peripheral area 146 of the card body CB).
The means for urging the device for embedding downward may comprise a linear actuator comprising a movable part with at least one coil and a fixed part having magnets. The downward force imparted to the capillary may be proportional to current flowing through the coil(s) of the movable part. For the purposes of this invention the downward motion of the device will be along an axis defined as the “z-axis”, set perpendicular to the plane of the card body (CB). The plane of the card body (CB) will be denoted the “x-y plane” with the device moving across the x-y plane along an “x-axis” and a “y-axis” set perpendicular each other.
The embedding device may be based on a controlled sonotrode. The device has a moving stage control system allowing downward force control.
An additional actuator (not shown), such as a pneumatic piston may be provided to apply an upward force to the capillary when current flow to the coil(s) is turned off, such as at the commencement and termination of the embedding operation.
According to an aspect of the invention, a force profile may be established so that the force of embedding can be controlled based on position, for example (but not limited to) applying a first force (f1) at the beginning of embedding, a second force (f2) during embedding a first turn of a booster antenna BA, a third force (f3) during embedding subsequent turns of the booster antenna BA, etc. An exemplary force profile is presented in
During embedding of the wire, either or both of the ultrasonic power provided by the sonotrode and the downward force exerted by the capillary may be controlled, and varied at different positions along the path of embedding the wire, to facilitate embedding. For example, power or force may be changed at turns (for example at the corner of the card body CB when embedding a rectangular spiral shaped card antenna CA). Better control over embedding may be achieved. Closer spacing of turns of a given booster antenna BA coil component (IW, OW, CC, AE) may be achieved.
The downward force being applied, via the capillary, during embedding, may be increased or reduced, as desired, at any given location (position) on the substrate (card body CB) during embedding of wire, such as for the booster antenna (BA), including the peripheral card antenna (CA) portion thereof and the inner coupler coil (CC) thereof.
Typical forces may be in the range of a few hundred grams (a few Newtons). Given a typical sonotrode diameter of approximately 4 mm this gives typical pressures or the order of a few hundred kPa. The downward force being applied, via the capillary, during embedding, may be reduced to zero where the wire has to “jump over” previously-embedded wires. During embedding, control may be switched between downward force and vertical position of the capillary. The invention enables a high degree of control over the embedding process. During embedding, at any point in the X-Y plane of the card body (CB), several parameters can be controlled and varied. These include: the speed of movement over the entire device in the x-y plane, the power fed to the sonotrode, the height of the sonotrode above the sample (for example when performing a jump), the downward force exerted by the sonotrode during embedding. Of course, when making a cross-over, force may be reduced to nearly zero, and the ultrasonic power may (or may not) be turned off.
Controlling Bonding of a Wire
It may be necessary to bond the wire to bond pads on the card body, or on the RFID chip. For example, when bonding a wire of an antenna coil to a module tape MT for an antenna module AM, or wire bonding the RFID chip to the module tape MT.
Bonding of a wire to bond pads of a chip module CM or to contact pads of interconnects on the module tape MT may be realized using a thermode, which essentially welds the wire to the pad. The integrity of the bonds is of course important, and can be monitored with an optical inspection system. During bonding, the wire is deformed, and may exhibit a diameter which is (for example) approximately 30% smaller than its pre-bond diameter. A typical wire being bonded may have an initial diameter of 112 μm. Wires having smaller (or larger) diameters may be wire bonded. Wire having insulating (or other non-conductive) coatings may also be wire bonded.
The position of the thermode may be measured, with micrometer precision, to achieve a deformation of the wire in a range of values centered around a target value representative of (for example) a 30% reduction in the diameter of the wire. The position of the thermode may be monitored to ensure that wires which are bonded are in this range, and when they are not, the thermode may be cleaned, or the process re-calibrated to ensure successful subsequent bonds.
According to some embodiments (examples) of the invention, a method of embedding a wire in a surface of a substrate may comprise: with an embedding tool, feeding wire onto the surface of the substrate while applying a given downward force and while imparting an ultrasonic vibration to the embedding tool; and controlling at least one of the downward force which is exerted by the embedding tool and a power of the ultrasonic vibration while embedding the wire in the surface of the substrate. The embedding tool may comprise a linear actuator for urging at least a portion of the embedding tool downward. The method may further comprise establishing a force profile and applying different forces at different positions, during the embedding process, in a controlled manner. The method may further comprise while controlling the force, controlling a power of the ultrasonic vibration imparted to the embedding tool. Different downward forces may be applied by the embedding tool at different positions being embedded. Different downward forces may be applied depending upon which of a plurality of turns is being embedded.
According to some embodiments (examples) of the invention, a method of bonding wires to pads may comprise using a thermode; and may be characterized by: precisely measuring deformation of the wire as it is being bonded. It may be determined that bonding is complete when a wire is deformed to have a diameter approximately 30% smaller than its pre-bond diameter.
Support Structures (SS, DS, WC) for Winding the Module Antenna (MA)
According to some embodiments of the invention, a support structure SS (or dam structure DS, or winding core WC) may be mounted to the module tape MT, and may serve as a winding core WC upon which the module antenna MA may be wound. The winding core WC may be mounted to the same side of the module tape MT as the chip CM, and may surround the chip CM, so that the winding core WC may also act as a dam for containing encapsulant GT covering the chip CM. The chip may CM may be wire bonded or flip chip mounted to the module tape MT, and the encapsulant will also protect these connections. The module antenna MA may be wound on the winding core WC, after it is mounted to the module tape MT, either before of after encapsulating the chip, using any suitable coil winding technique.
U.S. Pat. No. 6,378,774 (2002; Toppan), which may be referred to as “Toppan '774”, incorporated by reference herein, discloses a smartcard comprising an IC module and an antenna for non-contact transmission. The IC module has both a contact-type function and a non-contact-type function.
The IC module has a first coupler coil (8), the antenna has a second coupler coil (3). The first and second coupler coils are disposed to be closely coupled to each other, and are coupled in a non-contact state by transformer coupling.
Toppan '774 discloses various ways of forming the first coupler coil (8).
U.S. Ser. No. 13/594,895 filed 27 Aug. 2012 (US 20130062419 published 14 Mar. 2013) discloses various techniques for winding a module antenna MA around a support structure disposed on the module tape MT around the chip CM. The support structure may serve both as a winding core WC upon which the module antenna MA may be wound, and as a dam structure DS for containing encapsulating material (glob-top) GT applied onto the chip CM and its connections.
The dam DS 320, which may be referred to as a “winding core” (WC) or a “support structure” (SS) or simply as a “ring”, has an elongate tubular body portion B and two opposite open ends 320a and 320b, and may be cylindrical (as illustrated) or substantially rectangular in cross-section (or any other suitable shape). One end 320b of the body portion B is mounted to the module tape MT, using a suitable adhesive, the other end 320a is a free end (un-mounted).
The dam DS may be formed of a plastic material such as Mylar, having a thickness ‘t’ of approximately 200 μm. The inner diameter (ID) of the dam DS may be approximately 7 mm, the outer diameter (OD) of the dam DS may be approximately 8 mm.
Although shown as round (cylindrical), the cross-section of the dam DS may be substantially rectangular, or other suitable shape (for winding an module antenna MA thereupon), in which case “ID” would be inner dimension, and “OD” would be outer dimension of the body portion B.
A module antenna MA 330 having several layers and turns of self-bonding wire may be wound on the dam DS. The dam DS should have a height ‘h’ which is at least as high as the resulting module antenna MA, such as approximately 350 μm. The dam DS may be impregnated with ferrite to increase the inductance of the module antenna MA. A fixture (not shown) may be used to support the DS during winding the module antenna MA. The resulting interim product comprising a module antenna MA and dam DS mounted to a module tape MT, may be considered to be a subassembly for an antenna module AM. The two ends a, b of the module antenna MA are shown, extending outwardly, to bond pads BP 306 on the surface of the module tape MT.
An RFID chip CM 310 may be subsequently be mounted to surface of the module tape MT, within the interior of the dam DS and wire-bonded from its terminals CT to bond pads BP on the underside of the module tape MT. Then, glob-top potting compound GT (not shown) may be applied within the interior of the dam DS to protect the chip CM and wire bonds, resulting in a substantially complete antenna module AM 300. The RFID chip CM and module antenna MA may be overmolded by a mold mass MM (not shown, see
Printing the Dam Structure (DS)
The dam structure DS is an example of a support structure SS upon which the module antenna MA may be wound. (Other support structures are disclosed herein, for example the winding cores WC of
The dam structure DS, and other support structures (SS, WC) described herein may be formed, such as on the on the module tape (MT) or on a sacrificial substrate, by dispensing a thixotropic fluid using an auger screw pump and curing with UV light, substrate heating or using a variable frequency microwave curing method. The height, width and perimeter of the dam may be defined by the footprint of the wire bonded die or flip chip and the geometry of the module antenna (MA). The dam structure (DS) can be a variety of shapes, typically forming a closed loop, such as round, oval or rectangular. Alternatively the dam structure (DS) can be made by rapid prototyping and additive manufacturing technologies (e.g. 3D printing). These processes are all “additive”, in that the support structure (SS, DS, WC) is built up on the surface of the module tape (MT). The dam structure (DS) may be formed directly on the module tape (MT) or formed independently and then placed on and attached to the module tape (MT) by means of an adhesive.
The dam structure (DS) may be formed to a height of approximately 250 μm by repeated deposition of a high viscosity epoxy via a nozzle, needle or other liquid placement system. The dam structure (DS) may be subsequently cured thermally or by UV light exposure. The glob top (GT) filling compound or similar may be used to fill in the dam either partially, up to the dam level or slightly above the dam level. The lid (LD) of thickness approximately 75 μm may then be attached to the dam structure (DS) and or glob top (GT) to facilitate the coil winding process. A flange (F) section of the lid (LD) protrudes over the dam structure (DS) to hold the windings of the antenna in place during coil winding. The antenna wire may be a self-bonding insulated copper wire or alloy wire which adhesively bonds to the layers of the coil by the application of hot air. The lid (LD) with protruding flange (F) can be left in place after coil winding or removed yielding an overall antenna module (AM) height in the range approximately 450 μm-540 μm.
The Antenna Module
The winding core WC comprises a main body portion B 422, and a flange portion F 424 extending radially (to the left or right, as viewed) outward from the top (as viewed) free end of the body portion B. (This is in contrast with the dam DS 3220 in which both ends are essentially the same as one another.)
The flange F serves to stiffen the body portion B, and also to constrain (contain) the windings of the module antenna MA as it is being wound. By way of analogy, when installed on the module tape MT, the flange F serves as one flange of a “bobbin”, the surface of the module tape MT serves as the second flange of the “bobbin”. The module antenna MA will be wound in a coil winding area between the two “bobbin” flanges.
The winding core WC 420 may have the following dimensions (approximate):
The coil winding area between the flange F and the surface of the module tape MT may accommodate (contain) approximately 20 turns of 112 μm diameter self-bonding wire for the module antenna MA. Wire having other diameters, greater or less than 112 μm may be used for the module antenna MA.
A process for forming a module antenna MA 430 on the winding core WC, further forming an antenna module AM is described with respect to
Contact pads CPs for a contact interface (with an external reader) are shown in on the face-up (bottom, as viewed) surface of the module tape MT, for a dual interface (DI) antenna module AM. However, is should be understood that the invention can be practiced in the context of an antenna module AM that operates solely in contactless mode, without such contact pads CP.
The coils (turns) of wire may not be so neatly arranged, as illustrated. Nevertheless, the coils (turns) of wire are constrained within the coil winding area by the flange F and the surface of the module tape MT, as shown. The module antenna MA may comprise a total of 20 turns (coils) of wire in the coil winding area, and two ends (a, b) extending over respective bond pads BP on the surface of the module tape MT.
Self-bonding (insulated) wire may be used to wind the coil of the module antenna MA. The thickness of the insulating layer on the wire may be increased (thicker) or decreased (thinner) to influence and control the capacitance of the coil. In addition, the material of the wire (it may be an alloy) may be selected to control its resistance.
The process of forming a module antenna MA for an antenna module AM described above may be contrasted with Toppan '774 which shows (
As an “interim product”, a module tape MT (either single-sided or double-sided) may be supplied with a dam structure DS or winding core WC already affixed thereto, without the chip CM, and may (or may not) have a module antenna MA disposed or wound on the dam structure DS or winding core WC. Later, the chip CM may be installed on the module tape MT, connected (wire bonded or flip chip mounted) with the contact pads CP and module antenna MA, and encapsulated (and overmolded). The dam structure DS may constrain encapsulant to an area within the dam structure DS.
According to some embodiments (examples) of the invention, a module tape (MT) for a smartcard (SC) may comprise a dam structure (DS) for supporting a module antenna (MA) and constraining encapsulant to an area within the dam structure (DS). This (module tape plus dam structure) may be considered to be an “interim product”. A module antenna (MA) may be included in the interim product. A chip CM may later be installed, connected and encapsulated.
Antenna Modules Formed on 35 mm Chip Carrier Tape
The module antenna MA may be connected, by its two ends, to pads on the module tape MT which are external to (outside of, rather than inside of) the dam structure DS or winding core WC. Having the pads disposed outside of (external to) the winding core WC (or dam structure (DS) may facilitate some of the coil winding techniques disclosed herein. Nevertheless, other advantages (such as encapsulating the bonds) may accrue to having the pads disposed inside of (internal to) the winding core WC (or dam structure DS), and to this end a dam structure DS having at least one slot S so that the wire ends of the module antenna can be routed through the dam structure DS and connected to the module tape MT (or directly to the chip CM) within the interior area surround by the dam structure DS (and protected by encapsulant GT). Other means for connecting the module antenna MA to the RFID chip CM are disclosed herein, such as “connection bridges” which are discussed hereinbelow.
Wire Bonding and Flip Chip Connecting the Chip (CM, IC)
U.S. Ser. No. 13/756,631 filed 1 Feb. 2013 (now US 20130140370 published 6 Jun. 2013) discloses antenna modules (AM) with both wire-bonded and flip-chip mounted chips (CM, IC).
As noted by Infineon, flip chip technology refers to a process of interconnecting semiconductor chips with carriers. The technology makes it possible to increase the packing density of elements on a carrier and allows for a more direct and more stable electrical interconnection compared to wire bond technology. Unlike wire bond technology, which has been almost exclusively used in smartcard modules up to now, the flip chip process involves flipping the chip, i.e. its electrical interconnections (pads) are turned toward the carrier side. In addition, there is no need for encapsulation (glob top). The electrical interconnection is made using conductive materials, so-called bumps, located between the chip contacts and carrier. The system is held together mechanically by means of an adhesive between the chip and carrier. As a result of the development of new materials for flip chip technology and optimization of the production process, it is now possible to use flip chip technology in the area of smartcards.
Some Problems being Addressed
A smartcard, chip card, or integrated circuit card (ICC) is any pocket-sized card with embedded integrated circuits. Smartcards are made of plastic, generally polyvinyl chloride, but sometimes polyethylene terephthalate based polyesters, acrylonitrile butadiene styrene or polycarbonate.
Contact smartcards have a contact area of approximately 1 square centimeter (0.16 sq in), comprising several gold-plated contact pads. These pads provide electrical connectivity when inserted into a reader, which is used as a communications medium between the smartcard and a host (e.g., a computer, a point of sale terminal) or a mobile telephone. Contactless smartcards, communicate with the external reader through RF induction technology, and require only proximity to an antenna to communicate. Dual-interface cards implement contactless and contact interfaces on a single card with some shared storage and processing. In the main, hereinafter, dual interface (DI, or DEF) cards are discussed. Reference is made to U.S. Pat. No. 6,378,774 (2002, Toppan) for an example of a DIF chip solution, and to US 2010/0176205 (2010, SPS) for an example of a two chip solution wherein one chip performs the contact function and the other chip performs the contactless function, both of which are incorporated by reference herein.
In the language of this patent application, the combination of an RFID chip (CM) on one side of a carrier substrate (MT) with contact pads (CP) on the other side of the substrate (MT), with the addition of an antenna (MA) disposed on the chip side of the substrate (MT) and connected with the RFID chip (CM) is termed “antenna module” (“AM”).
The plastic card (card body CB) in which the chip module (such as Infineon) or antenna module (AM) is embedded is fairly flexible, and the larger the chip, the higher the probability that normal use could damage it. Cards are often carried in wallets or pockets, a harsh environment for a chip. It is therefore generally desirable that the chip modules (ISO-7816 only) or antenna modules (with the addition of ISO-14443) be as small as possible.
Etched Module Antenna
It is readily apparent that an area of approximately 1.6 mm×3 mm may be “lost” around the perimeter of a 6-contact pad chip (or antenna) module, as contrasted with a comparable 8-pad contact pattern antenna module (AM), which results in the loss of at least approximately (1.6 mm/0.175 mm) 9 turns of antenna (etched). The chip (IC, CM) may measure 2 mm×2 mm, or 4 mm2, and this area is unavailable for the antenna, leaving (all dimensions are approximate). Generally, an area immediately surrounding the IC chip may also be unavailable for the antenna, for example, 3 mm×3 mm (including the IC chip), or 10 mm2. It can thus be seen that a 6-pad contact pattern may have approximately 30-50% less space available for the antenna than an 8-pad contact pattern module. And, an etched antenna is usually 2-dimensional, in one layer only. In contrast with an etched antenna, a wire wound antenna may make much better use of the space available.
Another limitation in creating an inductive antenna through chemical etching is the minimum pitch (or spacing) between tracks, which is economically attainable using a lithographic process. The optimal pitch (or spacing) between (adjacent) tracks of an etched antenna on super 35 mm tape is approximately 100 μm. (As used herein, the term “pitch” may refer to the spacing between adjacent conductive tracks, rather than its conventional meaning the center-to-center dimension between track centerlines or the number of tracks per unit length.)
Some exemplary and/or approximate dimensions, materials and specifications may be:
A 6-pin (six contact pad) dual interface (DI, DIF) module offers many advantages over an 8-pin (8 contact pad) module. Because of its reduced size in comparison to the 8 pin DIF module, there are cost savings in terms of the amount of gold which is required on the surface of each contact pad (copper, nickel gold), the milling time to produce a cavity in a card body is reduced because of the smaller space required to accommodate and protect the die, and the gold wires (Ø24-32 μm) for wire bonding are no longer possible. Because of its smaller footprint, there is more space on the card body after insertion of the module for printing of brand logos and the embossing of character lines. Also, by virtue of being smaller than an 8-pad module, a 6-pad module can better survive card body flexing.
However, due to the small footprint (11.0 mm×8.4 mm, for the contact pads) of a 6-pin (pad) DIF module, it is virtually impossible to produce a functional etched antenna on the bond side (chip side) of the module. As discussed above the circumference space (area) between the chip and the perimeter of the chip module is insufficient to contain the etched antenna tracks for inductive coupling. Additionally, because of its small footprint, it is not possible to wire bond the silicon die (chip CM) to the chip module (carrier tape MT) as the spacing between the silicon die and perimeter is insufficient to perform a ball and wedge bond.
Rather than wire-bonding the chip CM to the vias, the chip CM may be flip-chip (ball) bonded to selected traces in the bottom metal layer MB which are associated with those vias. Underfiller may be provided under (on top, as viewed) of the chip CM to support it on and secure it to the module tape MT. Although flip-chip bonding may free up some space for the module antenna MA, wire wound antennas may make better use of the available space than etched antennas.
A structure such as a dam structure DS or winding core WC (which may be a ring which is oval, round or rectangular) may be used to contain the flow of the glob top after wire bonding, while at the same time the ring may be used as a supporting frame for a coil wound around the dam structure DS or winding core.
The ring frame (winding core WC) may advantageously be used to flatten & stiffen the chip carrier tape to protect the flip chip bonds from flexing during normal use and when the card is inserted into a card terminal. Additionally, the ring frame (winding core WC) may advantageously be used firstly to keep the contact pad surfaces substantially homogenous and substantially completely flat. The flatness may determine the longevity of the card, especially when inserted regularly into a card terminal. The winding core (WC) may stiffen, stabilize and planarize the module tape (MT), particularly in the area of the chip (CM) to enhance reliability.
Because of the reduced footprint of a 6-pad module, the only reliable method to produce an inductive coupling module may be to use a wire wound coil (with several layers) mounted to a chip carrier tape having a die mounted to its surface by means of flip chip bonding. The wire wound coil, serving as the module antenna MA, may be wound on a winding core WC that is already mounted to the substrate tape MT, as described above with respect to
An Example of a Flip-Chip Mounted RFID Chip CM
A wire module antenna MA may be wound on the winding core WC, in the manner described herein, either before or after mounting the chip CM, with the winding core WC already in place on the chip side of the substrate MT. (The module antenna MA is shown here having 3 layers, 6 turns each, neatly stacked, for illustrative purposes only. The wires need not be so neatly stacked, and there may be other than 18 turns.) Alternatively, a wire module antenna MA may first be wound on the winding core WC, or a modified version thereof, and subsequently attached to the chip side of the substrate MT. Subsequently, the ends (a, b) of the module antenna MA may be bonded to bond pads BP on the chip side of the substrate MT, if they were not previously connected.
In the
The opposite surface of the substrate MT may be provided with contact pads for ISO-7816, such as six contact pads. When module tape or substrate is referred to, this typically means an epoxy glass tape, copper clad on both sides (double-sided).
The winding core WC may have the following dimensions (approximate):
In contrast with the winding core WC of
As set forth above, the coil winding area between the flange F and the surface of the module tape MT may accommodate (contain) approximately 20 turns of 112 μm diameter self-bonding wire for the module antenna MA. Wire having other diameters, greater or less than 112 μm may be used for the module antenna MA.
After the antenna MA and chip CM are mounted and connected, the interior area of the winding core WC may be filled with glob-top potting compound GT, or the like, to protect the chip CM. If heat is applied to cure the glob-top GT, the heat may also cause sticking together of the self-bonding wire forming the turns (coils) of the module antenna MA.
Thereafter, a mold mass MM may be formed (by overmolding) over the module antenna MA, the ends (a, b) of the module antenna MA, the winding core WC, and the glob-top GT (including over the chip CM). The mold mass MM may extend over the outer edge (lip) of the flange F, slightly into the coil winding area (except where there is wire), which may helping retain the mold mass MM in place.
Traditional flip-chip mounting involves providing a chip with re-flowable bumps such as solder balls, flipping the chip onto a substrate having pads, and re-flowing the solder balls, using heat, to effect the electrical (and mechanical) connection between the chip and the substrate. The Infineon FCOS chip module mentioned above utilizes an adhesive technology (such as DELO-MONOPDX or DELO-MONOPDX AC) to effect the connections between the chip and the substrate.
The brochure “Adhesives for flip chip bonding”, by DELO, incorporated by reference herein, which discloses pressing of bumps and electrically conductive particles in the adhesive being clamped between bumps and substrate metallization. Process steps may include (i) adhesive application, (ii) placement of the flip-chip, (iii) curing by thermode with pressure and temperature, and optionally (iv) final curing in tunnel oven. Gold-plated nickel particles or silver particles are used as filler for the adhesive (DELO-MONOPDX AC) in order to achieve the electrical conductivity. These solid particles are used for contacting flip-chips with flexible and rigid substrates. When pressing the particles, the oxide layers on the surfaces of metallic circuit paths are ruptured. (Remaining adhesive which is not pressed may remain non-conductive.) With this, low contact resistances can also be achieved on copper and aluminum circuit paths. When manufacturing smartcard modules, flip-chips are an economic alternative to the chip-on-board technology. DELO-MONOPDX or DELO-MONOPDX AC are used on standard substrates like FR4 or PET for contacting flip chips.
In an exemplary manufacturing process, substrate tape may be purchased from one vendor (such as Interplex), bumped chips may be purchased from another vendor (such as NXP), and the chips are joined and connected with the substrate using a selectively-conductive adhesive containing suitable electrically conductive particles (such as copper, nickel, gold, and the like). As used herein, a “selectively conductive adhesive” is an adhesive, such as DELO-MONOPDX or DELO-MONOPDX AC, that becomes conductive only at areas where pressure is applied. Conductive areas of the adhesive are shown as shaded, in
To enhance the electrical connections between the bumps 912 and the pads 922, as a precursor to performing flip-chipping, a conductive material may be applied to the bumps 912 of the chip and/or to the pads 922 of the substrate. A quantity 914 of conductive material is shown on the bumps 912, a quantity of conductive material 924 is shown on the pads 922. An exemplary conductive material is silver nanowires, such as 90 μm long, which will form a network (mesh) on the bump and/or pad surface(s) to improve mechanical and electrical connection between the bumps and the pads. Silver nanowire material is available from Seashell Technology (http://www.seashelltech.com/nanoRods.shtml), incorporated by reference herein, and may be applied to one or both of the bumps and the pads by spraying, inkjet application, aerosol application, and the like.
As an alternative to adhesive bonding, conventional flip-chip bonding, involving re-flowing solder bumps, may be used to mount and connect the chip (CM, IC) to the substrate (MT).
Antenna Substrate (AS)
In
An opening OP in the antenna substrate AS, which may be only slightly larger than the chip CM, may be provided through the antenna substrate AS for accommodating the chip CM (the chip CM may protrude through the opening OP) when the antenna substrate AS is joined (and connected) to the module substrate MT. In
As best viewed in
By avoiding the problem of leaving the area around the chip CM free for interconnects, this area can be used for additional turns (or tracks) of the antenna MA. Some of these additional tracks are shown in dashed lines in
The antenna substrate AS may be opaque, or dark in color to conceal the underling module substrate MT, chip CM and antenna MA. This may be an important security feature if the module substrate MT is transparent (such as parlex).
The antenna MA may be formed of wire, embedded in the antenna substrate AS, such as shown in U.S. Pat. No. 6,233,818. Alternatively, the antenna MA may be chemically etched from a metal layer (foil) on the antenna substrate AS.
Alternatively, the antenna MA may be laser etched, which may allow for finer pitch, and more tracks. For example, the antenna may be laser etched (isolation technique) into a copper cladded “seed” layer (face-down side of the pre-preg) having a thickness of 17 μm, using a UV or Green nanosecond or picosecond laser with a distance between tracks dimensionally equal to the width of the laser beam, approximately 25 μm. After the laser etching of the copper seed layer, the antenna substrate AS may further be processed by one or more of sand blasting to remove residual laser ablated particles and to prepare for plating adhesion; depositing carbon to support the through-hole plating of the vertical interconnects; dry film application and photo-masking process; electroless deposition copper (Cu˜6 μm) to increase the thickness of the tracks; electroplating of nickel and nickel phosphorous (Ni/NiP˜9 μm) or nickel (Ni˜9 μm) and palladium/gold or gold (Pd/Au or Au-0.1 μm/0.03 μm or 0.2 μm) to prevent oxidization.
U.S. Pat. No. 7,229,022 and US 2008/0314990, disclose an array of antennae installed on a separate substrate to the substrate hosting the RFID chips with an identical format. The antenna substrate is then placed over the substrate with the array of RFID chips and the termination areas of each antenna are manually connected to each chip on the respective transponder site.
Reference is made to US 20120080527 which discloses forming antenna structures having several conductor turns (wire, foil, conductive material) on an antenna substrate (carrier layer or film or web), removing the antenna structures individually from the antenna substrate using pick & place gantry or by means of die punching, laser cutting or laminating, and transferring the antenna structure with it's end portions (termination ends) in a fixed position for mounting onto or into selected transponder sites on an inlay substrate, and connecting the aligned termination ends of the antenna structure to an RFID (radio frequency identification) chip or chip module disposed on or in the inlay substrate. A contact transfer process is capable of transferring several antenna structures simultaneously to several transponder sites. As disclosed therein, a method of forming a transponder site comprising an inlay substrate, an RFID chip module and an antenna structure connected to the chip module may comprise:
The techniques disclosed herein for transferring antenna structures to an inlay substrate may be utilized to transfer antenna structures to a module tape (MT) for an antenna module.
a Winding Core (WC) without any Flanges
U.S. 61/860,354 filed 31 Jul. 2013, discloses an antenna module AM may comprise a module tape MT, a chip module CM surrounded by a dam structure DS mounted to one side of the module tape MT. The dam structure DS may be generally in the form of a cylinder, and may be filled with glob top GT potting compound (or the like) to protect the chip module CM and wire bonds connecting the chip module to the module tape MT. Some connections may be made through the module tape MT to the underside of contact pads CP on the other side of the module tape MT.
A planar element, which may be referred to herein as a “lid” (LD) or a “cover plate” (CP), which is separate from the winding core (SS, DS, WC) itself, may be disposed on the free end of the winding core WC to serve as a flange for constraining wire being wound in situ (with the core WC mounted on the module tape MT).
In this, and other examples of support structures (SS), including dam structures (DS) and winding cores (WC), a tubular body portion (B) of the support structure (SS) may have a substantially uniform cross-section over its entire length, between its two ends—one of which ends is secured to or extends from a surface of the module tape (MT), the other of which ends is a “free end”.
The lid LD may be mounted with adhesive to the dam structure (DS) and left in place after the module antenna MA is wound on the dam structure DS. The lid LD may be removed after the module antenna MA is wound on the dam structure DS, in which case it may be beneficial to first heat the module antenna MA so that its windings (of insulated wire) stick together. In the latter case (removing the flange F), the lid LD may simply be a flat rigid surface, such as metal.
The planar element (LD, CP) may comprise ferrite, such as a plastic material impregnated or coated with ferrite particles. The tubular body portion, or core (B) may also comprise ferrite, such as a plastic material impregnated or coated (on its inner or outer surfaces, or both) with ferrite particles.
The chip (CM) may have a thickness of approximately 75 μm, and may be bonded with an approximately 18 μm thick adhesive layer to the module tape MT having a thickness approximately 195 μm. The module tape MT may be a glass-epoxy or polyimide super 35 mm tape having nickel or gold passivated, pre-patterned connection pads (contact pads CP and bond pads BP) on both faces with or without connective tracks such as vias. Gold wire bonds of height approximately 160 μm electrically connect metallized contact pads on the chip module (CM) to bond pads on the module tape (MT).
The flange (F) formed by the lid or cover plate (LD) may extend beyond the periphery of the dam outer wall. The flange (F) assists coil winding to form the module antenna (MA), by constraining the winding of the coil to the body (B) of the dam structure (SS, DS, WC), and may or may not be required after coil winding is complete.
In FIGS. 11A,B,C the module antenna MA is shown as being a coil of wire having 4 (four) layers having 6 (six) turns each, or a total of 18 turns. And the turns are shown as being neatly stacked one upon the other. It should be understood that the module antenna MA may have other than 3 layers of 6 turns, such as (but not limited to) 4 layers of 8 turns, and the turns may be not so neatly stacked upon each other.
It is generally desirable to fill up the space between the lid LD (or the tool T) and the module tape MT with as many turns of wire as practical. Since currents in the module antenna are very low, wire having a diameter of as little as 50 μm may be used to form the module antenna MA.
In FIGS. 11A,B,C the chip CM is shown “generically”, without limiting how it is connected (wire bonded) or flip-chip mounted to the module tape MT. Also, the contact pads (CP) on the opposite side (from the chip CM and module antenna MA) are omitted, for illustrative clarity.
Reference is made to U.S. 61/868,089 filed 21 Aug. 2013, particularly to FIG. 100 thereof, which also shows an antenna module with a lid (LD, disc or ring), which shows 3 layers having 6 turns each. (The module antenna MA has 18 turns of wire.
The RFID chip CM can be wire bonded to the module tape MT after the dam DS has been mounted to the module tape MT, including after the module antenna MA has been wound around the dam structure DS. Also, the module antenna MA can be wound around the dam structure after the chip CM is installed and connected (e.g., wire-bonded), including after encapsulation.
According to some embodiments (examples) of the invention, a substantially flat “lid” (LD), cap or cover plate (CP) which may be in the form of a disc or ring, having an outer diameter (OD) greater than that the outer diameter (or comparable cross-dimension) of the tubular body portion (B) of the dam structure (SS, DS, WC) may be disposed atop the tubular body portion (B) of the dam structure (SS, DS, WC) to serve as a flange (F) for constraining turns of wire when winding the module antenna (MA) around the tubular body portion (B) of the dam structure (SS, DS, WC). The flange (F), lid (LD) or cover plate (CP) may be in the form of a planar structure (element), of plastic material, having a thickness of approximately 75 μm.
The planar element (LD, CP) may be mounted with adhesive to the dam structure (DS) and left in place after the module antenna (MA) is wound on the dam structure (DS). The flange (F) may be removed after the module antenna (MA) is wound on the dam structure (DS), in which case it may be beneficial to first heat the module antenna (MA) so that its windings (of self bonding insulated wire) stick together. In the latter case (removing the flange F), the flange (F) may simply be a flat rigid surface, such as metal. Alcohol or a suitable solvent can be used to soften a thermoplastic adhesive coating on the wire, followed by an oven bake to promote inter-wire adhesion and solidify the air core coil. Another alternative is to draw the coil through a wet adhesive or to apply wet adhesive to the wire using a dispensing apparatus within or adjacent the coil winding nozzle (CWN). The wet adhesive can be dried at ambient temperature, oven dried or dried under a flow of hot air.
According to some embodiments (examples) of the invention, a module tape (MT) for an antenna module (AM) may comprise: a substrate (MT); and a support structure (SS, DS, WC) disposed on a surface of the substrate and comprising a tubular body portion (B) having two opposite open ends, one of which is disposed against the surface of the substrate, the other of which is a free end; characterized by: a planar element (F, LD, CP, PT) selected from the group consisting of a flange (F), a lid (LD, CP) and tool (PT) disposed upon the free end of the support structure, such as for constraining winding of the module antenna (MA) on the support structure. The support structure may function as winding core for a module antenna (MA), constraining wire wound around the tubular body portion (B) and may function as a dam for containing glob-top (GT) covering a chip (CM) disposed within the support structure The tubular body portion may have a substantially uniform cross-section over its entire length, between its two ends.
According to some embodiments (examples) of the invention, an antenna module (AM) interim product may comprise: a module tape (MT); and a support structure (SS, DS, WC) disposed on a surface of the substrate and comprising a tubular body portion (B) having two opposite open ends, one of which is disposed against the surface of the substrate, the other of which is a free end. A module antenna (MA) may be wound around the tubular body portion (B), using any suitable technique. An RFID chip (CM) may later be mounted on and connected to the module tape (MT), in the interior of the body portion (B).
According to some embodiments (examples) of the invention, a method of making a module antenna (MA) may comprise: providing a module tape (MT); and providing support structure (SS, DS, WC) having a tubular body portion (B) on a surface of the module tape, the tubular body portion having an end on the surface of the module tape and a free end; and may be characterized by: disposing a planar element (LD, CP, PT) against the free end of the body portion; and winding a module antenna (MA) around the body portion (B) between the surface of the module tape (MT) and the planar element. The planar element (LD, CP) may be left in place or may be removed upon completion of winding the module antenna MA. The planar element (LD, CP, PT) may be in the form of a ring, and with the planar element (LD, CP, PT) in place on the tubular body portion (B), an interior area of the body portion (B) may be filled with encapsulant (GT). The support structure (SS, DS, WC) may be formed on the module tape (MT) by an additive process.
It should be understood that a module tape MT with a support structure SS, or dam structure DS, or winding core WC, without the chip CM, may constitute an interim product, which may be shipped.
It should be understood that a module tape MT with a support structure SS, or dam structure DS, or winding core WC, with the module antenna MA, and without the chip CM, may constitute an interim product, which may be shipped. Later the chip CM may be installed and connected, and encapsulated.
It should be understood that a module tape MT with a support structure SS, or dam structure DS, or winding core WC, with the lid CP, without the module antenna MA, and without the chip CM, may constitute an interim product, which may be shipped. Later the module antenna MA may be wound on the support structure, and also the chip CM may be installed and connected, and encapsulated.
It should be understood that the techniques disclosed in
Multiple Antenna Structures (AS) in the Antenna Module (AM)
In the embodiments described hereinabove, there may be only one antenna structure functioning as the module antenna MA for the antenna module AM. There will now be described some embodiments of module antennas MAs comprising multiple (two or more) antenna structures. It should be understood that the antenna structures may comprise wires wound around a winding core, or traces on a module tape or an antenna substrate, said traces being formed by additive (printing) or subtractive (etching) processes, or combinations of wires and traces.
FIGS. 14A,14B illustrate an embodiment of an antenna module (AM) 1400 for a transponder comprising
The chip (CM) 1408 and antenna A 1410 may be disposed in or on a layer 1422 of a multi-layer antenna substrate 1400. The chip module 1408 may be disposed in a recess (pocket) 1406 extending partially through the layer 1422 (as illustrated), or may be disposed in a recess (opening) extending completely through the layer 1422, with the chip module 1408 being supported by an underlying layer 1424.
The antenna module (AM) 1420 is illustrated in
Other variations for the antenna module (AM) 1420 may include, but are not limited to . . . .
The stub B 1412 may be formed as a flat coil of wire having a number (such as 12) of turns and two ends—an outer end 3 of an outer turn and an inner end 4 of an inner turn—in a layer 1424 overlying the layer 1422. The stub B may have an overall length of approximately 400 mm, and may be aligned with (directly over) the antenna A.
The stub C 1414 may be formed as a flat coil of wire having a number (such as 12) of turns and two ends—an outer end 5 of an outer turn and an inner end 6 of an inner turn—in a layer 1426 underlying the layer 1422. The stub C may have an overall length of approximately 400 mm, and may be aligned with (directly under) the antenna A. The stub C may be aligned with (directly under) the stub B. The stubs B and C may be formed by etching, printing, or other processes, instead of (other than) using embedded wire.
In the schematic view of
Dashed lines ( - - - ) indicate that the inner end 4 of the stub B 1412 may be connected to the outer end 1 of the antenna A 1410, such as at the terminal 1408b, and the outer end 5 of the stub C may be is connected to the inner end 2 of the antenna A, such as at the terminal 1408b. The outer end 3 of the stub B and the inner end 6 of the stub C may be left unconnected (remain open).
Alternatively, the vertical arrows (↓,↑) indicate that the outer end 3 of the stub B may be connected to the outer end 1 of the antenna A (such as at terminal 1408b), and the inner end of stub C may be connected with the inner end of the antenna A.
Note that in either case, “opposite” (inner versus outer) ends of the stubs B, C are connected to the two ends 1, 2 of the antenna A—in other words, the inner end 4 of B and the outer end 5 of C. As used herein, “connected in an opposite sense” means that the inner end of one of the two stubs (B or C) is connected with one end of the antenna (A), and the outer end of the other of the two stubs (C or B) is connected with the other end of the antenna (A). It is generally not desirable that the “same” (such as both inner) ends of the stubs are connected with the ends of the antenna A. The connections (interconnects) discussed herein can be made in any conventional manner, such as by vias through layers, traces on layers, bonding, soldering, crimping, welding, etc.
Locating the stubs B and C over each other in close proximity with the antenna A between them forms additional resonant circuits between the A and the stubs B, C realized by the stray capacitance between the antenna structures A, B, C. The interaction between the coupled stubs B and C exposed to the same electromagnetic field from the antenna A may advantageously reduce the self-resonance (or self-resonant) frequency of the antenna A. Stub B is close to antenna A and stub C is close to antenna A, ergo stub B is close to stub C.
In electronics, capacitors and inductors have parasitic inductance and capacitance, respectively. For a capacitor, the inductance is primarily due to the physical dimensions including the leads. Since a capacitor and inductor in series creates an oscillating circuit, all capacitors and inductors will oscillate when stimulated with a step impulse. The frequency of this oscillation is the self-resonant frequency (SRF).
The dimensions of the antenna module (AM) may be approximately 15 mm×15 mm. Due to the relatively small available area, an inductive wire loop of the size of the antenna module may have a self-resonance frequency of approximately 75 MHz. The over-layered close coupled antenna structures (stubs B and C) may function as a wire formed capacitor—with open wire ends (3 and 6)—that may reduce the resonance frequency of the formed transponder to a more desirable value of approximately 13˜17 MHz, thereby increasing the voltage and transferred power to the chip module.
In combination with a commercially-available chip module (such as NXP SmartMx or Infineon SLE66, or other) which may be specified with an input capacitance of approximately 10˜30 pF the assembled transponder can be matched to a resonance frequency of 13˜17 MHz. See, for example, the following, incorporated by reference herein:
This principle of over-layered close-coupled wire (or other conductive trace) antenna structures (stubs B and C) facilitates reducing the space consumption of the antenna A to a minimum, by moving the additional wire turns of structures (stubs) B, C to separate planes. This principle may be more efficient than connecting a number of inductive wire antennas (with all wire ends connected) in series or in parallel. Capacitive extensions for the antenna A could be formed by creating more conventional conductive surfaces (plates) to offset the resonant frequency. An advantage of using wire is ease of creation using wire embedding technology, and better utilization of space. (The antenna module may have very limited space restrictions.)
Various alternatives to the “solution” discussed above may include, but are not limited to
According to some embodiments (examples) of the invention, an antenna module for a transponder may comprise: a chip module; a first antenna structure which is an antenna having two ends connected with the chip module; a second antenna structure having an outer end and an inner end, one of which is connected with the first antenna structure, the other of which is left unconnected; and a third antenna structure having an outer end and an inner end, one of which is connected with the first antenna structure, the other of which is left unconnected. The inner end of one of the two stubs may be connected with one end of the antenna, and the outer end of the other of the two stubs is connected with the other end of the antenna. The first, second and third antenna structures may be formed in a flat coil pattern having a number of turns, and are substantially identical with one another. The first, second and third antenna structures may be disposed substantially directly over one another. The first, second and third antenna structures are formed by embedding wire. The first, second and third antenna structures are formed other than by embedding wire. The antenna module may be incorporated into a secure document.
The embodiment shown and described with respect to
The wire may generally be wound around the body portion B of the winding core WC one turn atop the other, expanding radially outward as the winding area between the carrier tape MT and the flange F becomes filled with wire—resulting, for example, in three (3) layers of wire, each layer having six (6) turns.
The coil C1 may be the first coil wound on the winding core WC, and may comprise 9 turns of wire and two ends 1a, 1b. The coil C2 may be the second coil wound on the winding core WC, and may comprise 9 turns of wire and two ends 2a, 2b.
A first end 2a of the second coil C2 may be connected with a first end 1a of the first coil C1 at a first bond pad BP-a. A second end 2b of the second coil C2 may be connected with a second end 1b of the first coil C1 at a second bond pad BP-b.
The module antenna MA having two coils C1, C2 may couple better with a booster antenna BA on the card body, or directly with an external contactless reader, when contrasted with a comparable (substantially the same size, same total number of turns, etc.) module antenna MA having but a single coil, resulting in a greater read-write distance and energy harvesting, and potentially rendering the booster antenna BA superfluous. This may be attributable to the RF signal being radiated (or received) by the two coils reinforcing one another, or a higher quality factor (Q), or another characteristic of the two coil versus one coil approach including, perhaps, capacitance formed by the parallel connected ends of the two coils.
It is generally not necessary that the turns of the coils (C1, C2) be so neatly stacked as shown. Generally, it is sufficient to fill the entire winding area between the flange F and the carrier tape MT with turns of the module antenna MA, whether one coil or two coils. It should also be understood, particularly with reference to the two coil embodiment(s) that
Additionally, it is not necessary that the two coils C1 and C2 of the module antenna MA be arranged as an inner coil and an outer coil. Rather . . .
Additionally, the following variations may be implemented . . . .
In the case of a wire-wound module antenna MA, the module antenna MA which encircles the chip CM may serve as a dam for glob-top which is applied to protect the chip CM and its connections to the module tape MT.
Rather than (or in some cases, in addition to) using glob-top, protection may be achieved by transfer molding a mold mass (MM), which covers/protects the module antenna MA as well as the chip CM and its connections. The chip CM may be mounted to the module tape MT before, or after mounting the module antenna MA to the module tape (and before transfer molding). This has applicability to module antennas that are formed by etching a conductive layer, as well as to wire-wound module antennas.
An antenna module (AM) for a smartcard (SC) may comprise: a module tape (MT); a chip (CM) disposed on a surface of the module tape (MT); and a module antenna (MA) disposed on the surface of the module tape (MT), and connected with the chip (CM); characterized by: the module antenna comprises a first coil (C1) and a second coil (C2). The first and second coils may be connected in parallel with one another. The second coil (C2) may be wound around the first coil (C1). The second coil (C2) may have substantially the same number of turns as the first coil (C1). The first and second coils may be wound in the same direction as one another. An antenna module (AM) may be made by affixing a tubular support structure (DS, WC) on a surface of a module tape (MT); and winding a wire for a module antenna (MA) around the tubular support structure (DS, WC); characterized in that the module antenna comprises two coils (C1, C2). The module antenna (MA) may be wound using any suitable winding technique.
Multiple Dam Structures and Module Antennas
More than one dam structure can be deposited or written onto the module tape (MT). This would facilitate the winding of more than one coil to make up the antenna module (AM), improving the electromagnetic coupling to the booster antenna in the card body. Additionally, the size of the dam structure (DS) can be tuned to facilitate die or chip module (CM) placement and the wire bonding process after dam structure (DS) formation. This would enable an alternative process flow whereby the dam structure (DS) and/or module antenna (MA) coil winding can be completed prior to die or chip module (CM) placement, bonding and connecting. The use of multiple dam structures (DS) can also facilitate the enclosing of the module antenna (MA) within the cavity formed by two or more dam structures (DSs). The use of a filler or flange within the cavity between two or more dam structures (DSs) and covering over the module antenna (MA) may also be considered. The use of multiple dam structures (DSs) can thus enhance the mechanical stability of the module antenna (MA) and improving the reliability and longevity of the antenna module (AM) device. The concept of multiple dam structures (DS) and dam structures of varying size can be applied to other antenna module systems including, for example, 8-contact modules. Two dam structures (DS-1, DS2) may be disposed, one inside of the other, such as concentric. Or, two or more dam structures may be disposed, each in a unique location on the module tape MT.
Etched Antenna Structure on a Separate Layer
An opening OP in the antenna substrate AS, which may be only slightly larger than the chip CM, may be provided through the antenna substrate AS for accommodating the chip CM (the chip CM may protrude through the opening OP) when the antenna substrate AS is joined (and connected) to the module substrate MT. In
As best viewed in
By avoiding the problem of leaving the area around the chip CM free for interconnects, this area can be used for additional turns (or tracks) of the antenna MA. Some of these additional tracks are shown in dashed lines in
The antenna substrate AS may be opaque, or dark in color to conceal the underling module substrate MT, chip CM and antenna MA. This may be an important security feature if the module substrate MT is transparent (such as Parlex SMART TAPE® based on Polyethylene terephthalate (PET), Polyethylenimine (PEI) or Polyimide (PI)).
The antenna MA may be formed of wire, embedded in the antenna substrate AS, such as shown in U.S. Pat. No. 6,233,818. Alternatively, the antenna MA may be chemically etched from a metal layer (foil) on the antenna substrate AS.
Alternatively, the antenna MA may be laser etched, which may allow for finer pitch, and more tracks. For example, the antenna may be laser etched (isolation technique) into a copper cladded “seed” layer (face-down side of the pre-preg) having a thickness of 17 μm, using a UV or Green nanosecond or picosecond laser with a distance between tracks dimensionally equal to the width of the laser beam, approximately 25 μm. After the laser etching of the copper seed layer, the antenna substrate AS may further be processed by one or more of sand blasting to remove residual laser ablated particles and to prepare for plating adhesion; depositing carbon to support the through-hole plating of the vertical interconnects; dry film application and photo-masking process; electroless deposition copper (Cu˜6 μm) to increase the thickness of the tracks; electroplating of nickel and nickel phosphorous (Ni/NiP˜9 μm) or nickel (Ni˜9 μm) and palladium/gold or gold/Pd/Au or Au−0.1 μm/0.03 μm or 0.2 μm) to prevent oxidization.
A first one of the layers (the bottom layer in the figure) MT1 may be double-sided, having a first antenna structure (or coil) MA1 formed or disposed on one side thereof and a contact interface with contact pads CP on the other side thereof. A second one of the layers (the top layer in the figure) MT2 may have an second antenna structure (or coil) MA2 formed on one side thereof, and an opening for receiving and positioning a chip, which may be a flip chip.
The chip CM may be connected to pads associated with interconnect traces and vias on the first (bottom) layer MT1. The first and second antenna structures MA1, MA2 may be interconnected to form the module antenna MA, such as in series with one another, and may be connected to the chip CM. A resulting dual interface (DIF) module may have six (6) contact pads CP, and may measure approximately 10.8×8.2 mm
Laser Etching of Contact Pads (CP)
The contact pads CP and antenna structures AS described herein may be formed using laser etching (isolation technique) of copper cladded “seed” layers on a module tape MT using a UV nanosecond or picosecond laser. A seed layer may have a thickness of approximately 17 μm. For the antenna structures AS, the space between tracks may be dimensionally equal to the width of the laser beam, approximately 30 μm. the tracks themselves may have a width of 30-50 μm. Perforations, such as those described above, may be formed by laser percussion drilling.
After laser etching of the copper seed layer to pattern and/or to perforate the contact pads CP or antenna structure(s) AS, the module tape MT may be further processed as follows:
By trimming or perforating the contact pads, less metal is covering the underlying coil of the module antenna. This amount of metal overlying the module antenna may be referred to as “coil coverage”. By reducing coil coverage, and conversely increasing coil exposure, the read distance may be increased. The perforations may be of various sizes and may be arranged in a pattern of a logo (such as the logo for Chase Bank or Deutsche Bank).
Double-Sided Module Tapes
The top metal layer, on the “face up” side may comprise Cu/Ni/Au, having a total thickness of approximately 36 μm. The bottom metal layer (metallization) may comprise Cu/Ni/Au, having a total thickness of approximately 38 μm, patterned to have areas (bond pads BP) for receiving wire bonds from the chip CM and the module antenna MA.
Such a module tape MT may be referred to as “double-sided”, meaning that it has metallization on both the top and bottom surfaces thereof. Conductive vias may be provided through the module tape MT, extending from portions (such as bond pads BP) of the metallization on the bottom surface to corresponding portions (such as contact pads CP) of the metallization on the top surface to establish electrical connections therebetween.
The chip CM may be connected, as illustrated, by wire bonds wb to vias associated with the contact pads CP disposed on the top surface of the module tape MT. Ends (a, b) of the module antenna MA may be connected to interconnect traces in the bottom metallization. The chip CM may also be connected by wire bonds wb to these traces to effect connection of the module antenna MA with the chip CM. For the wire bonds wb, one end of a bond wire may ultrasonically bonded (ball bond) to a chip terminal (CT) or pad on the chip CM, the other end of the bond wire may be ultrasonically bonded (wedge bond) to the bond pad or interconnect trace on the bottom metallization.
The module antenna MA is shown having several turns of wire, such as in a 3×8 configuration (3 layers, each layer having 8 turns), and having two ends (a, b). The ends (a, b) may be thermo compression (TC) bonded to exposed surfaces on the bottom metal layer. The module antenna MA may be attached to the module tape MT with Nitrile (support film 132,
In
It may be advantageous to remove metal, such as by laser ablation (or laser percussion drilling) from the contact pads CP of the antenna module AM to improve the electromagnetic coupling (read distance) with a external contact reader (
Single-Sided Module Tapes
Regarding the embodiments (
According to some embodiments (examples) of the invention, a module tape (MT) for a smart card (SC) may comprise: a module tape (MT) having a top surface and a bottom surface; metallization on the top surface, patterned to form at least one of contact pads (CP) for a contact interface (ISO-7816) and at least one connection bridge (CBR); and openings (h) extending through the module tape (MT) from the bottom surface thereof to the top surface thereof for accommodating connecting at least one of a module antenna (MA) and a chip (CM) to the underside of selected ones of the contact pads and connection bridges. In a “single-sided” tape, there may be metallization only on the top surface of the module tape (MT), the bottom surface may not have metallization.
Contact Bridges
US 20130146670 (2013; Grieshofer; “Infineon”) discloses a chip card contact array arrangement, comprising: a carrier; a plurality of contact arrays which are arranged on a first side of the carrier; an electrically conductive structure which is arranged on a second side of the carrier, which is arranged opposite the first side of the carrier; a first plated-through hole and a second plated-through hole; wherein the first plated-through hole is coupled to the electrically conductive structure; a connecting structure which is arranged on the first side of the carrier, wherein the connecting structure connects the first plated-through hole to the second plated-through hole; and the connecting structure having a longitudinal extent which runs parallel to a direction in which a contact-connection device on a reading device is moved relative to the plurality of contacts.
Connection Bridges
An RFID chip CM component is provided on the other (back; bottom as viewed) side of the module tape MT. A module antenna MA component is also provided on the other side of the module tape MT (on the same side as the RFID chip CM).
The module antenna MA comprises a wire having two ends a and b, may be wound on a dam structure (DS; or winding core WC), as described hereinabove (compare
The dam structure DS may be located on the opposite side of the module tape MT from the connection bridge CBR, and may be aligned under the connection bridge CBR. The dam structure DS (or winding core WC) has an interior portion (to the right, as viewed) and an exterior portion (to the left, as viewed). The module antenna MA is wound on the exterior of the dam structure DS. The RFID chip CM is disposed on the module tape MT in the interior of the dam structure DS.
The connection bridge CBR extends from a first position above the exterior portion of the dam structure DS to a second position above the interior portion of the dam structure DS. A first opening 20 (“h”) may be provided through the module tape MT at the first position. A second opening 22 (“h”) may be provided through the module tape MT at the second position. A first portion 30 of the connection bridge CBR is disposed over the first opening 20 A second end portion 32 of the connection bridge CBR is disposed over the second opening 22.
A first end a of the module antenna MA may be wire-bonded, through the first opening 20 to the underside of the first portion 30 of the connection bridge CBR, and that a first terminal LA of the RFID chip CM may be wire-bonded, through the second opening 22 to the underside of the second portion 32 of the connection bridge CBR.
The connection bridge CBR provides a conductive path which extends from a position which is exterior to the dam structure DS to a position which is interior to the dam structure DS. This facilitates connecting a component (such as the module antenna MA) which is disposed external to the dam structure DS to a component (such as the RFID chip CM) which is disposed internal to the dam structure DS. The connection bridge CBR serves as an interconnect between an end of the module antenna MA component and a terminal of the RFID chip CM component.
According to an embodiment of the invention, at least one of the contact pads (CP) may be modified to establish at least one connection (including two or more connections) between components on the other, opposite (back) side of the module tape MT, such as the module antenna (MA) component and the RFID chip (CM) component.
As described in some of the following examples, the connection bridge(s) CBR may be formed in various manners, including but not limited to:
The connection bridges CBR-1 and CBR-2 may be formed as tracks, such as two sinusoidal tracks, which may be chemically etched or laser etched out of contact pad C6, with both tracks running along each side of the original contact pad C6. Alternatively, the tracks could run parallel, right and left, with the original contact pad remaining in the center. It may be noted that both connection bridges CBR-1 and CBR-2 are elongated, and extend substantially parallel to the insertion direction (from right to left, as viewed, see arrow)
The connection pad C6 of a single-sided chip carrier tape could be modified to create the two connection bridges for the wire ends of a module antenna to LA and LB of the RFID chip CM.
The connection bridges may be “dog bone” shaped, having wider areas at its two ends for accommodating holes through the module tape (MT). There may be a gap between the connection bridge (area) and the remainder of the contact pad (CP) to electrically isolate the connection bridge from the contact pad (CP).
The two connection bridges CBR-1 and CBR-2 may be formed so as to leave a portion, such as a middle portion of the contact pad C6 intact. Alternatively, the two connection bridges CBR-1 and CBR-2 may subsume (use up) all of the contact pad C6, leaving nothing behind.
It may be noted that the C6 contact pad, which is not used, may be used for connection bridges, or eliminated entirely, or replaced with ferrite. However, if it were removed entirely, this may adversely affect the aesthetics of the module, and may also visibly expose the chip CM and connections behind the module tape MT.
The wire ends of the module antenna can be connected to the interconnection bridges by means of a solder process, laser welding, TC bonding, inner lead bonding or using conductive glue. Alternatively, nanoparticles or nanowires with a low melting temperature could be used to facilitate the physical interconnection between the insulated copper wires of the module antenna and the underside metallization layer. To avoid dents appearing on the face-up side of the contact pads during bonding of the wire ends of the module antenna to the reverse side, the chip carrier tape can be partially heated and supported by a ceramic plate. To reduce the spacing between each bridge and the original contact pad, in this instance C6, the separation line can be laser etched.
The portion of the connection bridge CBR heading inward between contact pads C5 and C6 may be formed from the contact pad C6, as described above with respect to
It may be noted that the connection bridge CBR is elongated, having a top portion which extends substantially parallel to the insertion direction (from right to left, as viewed, see arrow), a middle portion which extends substantially perpendicular to the insertion direction (from top to bottom, as viewed), and a bottom portion which extends substantially parallel to the insertion direction.
A first connection bridge CBR-1 is elongated, having a top portion which extends substantially parallel to the insertion direction (from right to left, as viewed, see arrow), a middle portion which extends substantially perpendicular to the insertion direction (from top to bottom, as viewed), and a bottom portion which extends substantially parallel to the insertion direction.
A second connection bridge CBR-2 is elongated, having a bottom portion which extends substantially parallel to the insertion direction (from right to left, as viewed, see arrow), a middle portion which extends substantially perpendicular to the insertion direction (from top to bottom, as viewed), and a top portion which extends substantially parallel to the insertion direction.
A first connection bridge CBR-1 is shown extending adjacent the C1, C2 and C3 contact pads perpendicular the card insertion direction, then extending parallel the insertion direction along the bottom of the module and up adjacent to the C7 and C6 contact pads. CBR-1 then extends between C5 and C6 parallel the insertion direction and terminates at the right hand side of the module as illustrated. A large proportion of the area typically reserved for the C5 “L-shaped” contact pad can be used for the connection bridge CBR-1.
A second connection bridge CBR-2 is shown extending parallel the card insertion direction between C6 and C7 contact pads. Also shown open circles are potential hole positions in the module tape MT that can be used to make electrical connections to the chip CM or antenna module MA via wire bonds or other methods.
A first connection bridge CBR-1 extends above (as viewed in the figure) the contact pads C1 and C5, and to the right (as viewed) of contact pads C5, C6, C7. The first connection bridge CBR-1 may provide a connection between a pad (not shown, on the underside of the module tape MT) within the dam structure DS, for antenna connection LA on the chip CM and a pad (not shown, also on the underside of the module tape MT) for a first end MA-1 of the module antenna MA.
A second connection bridge CBR-2 may be formed at the bottom (as viewed in the figure) of (or as a bottom portion of) the contact pad C5. The second connection bridge CBR-2 may provide a connection between a pad (not shown, on the underside of the module tape MT) within the dam structure DS, for antenna connection LB on the chip CM and a pad (not shown, also on the underside of the module tape MT) for a second end MA-2 of the module antenna MA.
Some Contrasts with Infineon (US 20130146670)
Some contrasts may be drawn between at least some of the connection bridge(s) disclosed herein (
According to some embodiments (examples) of the invention, a dual interface antenna module (AM) may comprise: a chip carrier tape (MT); a contact pad array (CP) which is arrange on the face-up side of the chip carrier tape; and a module antenna (MA) which is arranged and mounted on the face-down side of the chip carrier tape; an RFID chip (CM) which is bonded to the chip carrier tape; and may be characterized in that: the chip carrier tape is a single-sided tape with only one side having a metallization layer; and at least one connection bridge (CBR) on the face-up side of the chip carrier tape being characterized by one or more of: (
According to some embodiments (examples) of the invention, a method of connecting at least one component of a dual interface (DI) antenna module (AM) to another component thereof, may comprise: providing at least one hole or opening (h, 20, 22) through a module tape (MT) so that a portion of the underside of a contact pad (CP) is exposed; and connecting the component to the underside of the contact pad. The at least one component may comprise an RFID chip (CM) or a module antenna (MA). The components may be wire bonded, through the at least one hole to the underside of the at least one hole contact pads. The at least one contact pad may be patterned to have at least one connection bridge. A selected one of the contact pads (CP) may be patterned to have two connection bridges.
According to some embodiments (examples) of the invention, a method of connecting a module antenna (MA) with a chip (CM), may comprise: providing metallization on a first (front) side of a module tape (MT), wherein the metallization comprises at least a pattern of contact pads (CP); disposing the chip (CM) on a second (back) side of the module tape (MT); and disposing the module antenna (MA) on the second side of the module tape (MT); wherein the metallization further comprises at least one connection bridge (CBR), and the chip module (CM) is connected to the connection bridge; and connecting an end of the module antenna (MA) though an opening in the module tape (MT) to the at least one connection bridges; and may be characterized by one or more of: at least a portion of the at least one connection bridge extends around an exterior of at least one of the contact pads; at least a portion of the at least one connection bridge is formed from a portion of at least one of the contact pads; and at least a portion of the at least one connection bridge extends between adjacent connection pads.
Ferrite and Metal Layers in the Card Body (CB)
U.S. Ser. No. 12/545,825 filed Aug. 22, 2009 (US 20090315320, Dec. 24, 2009) discloses secure inlays for secure documents such as a passport comprising an inlay substrate may have laser ablated recesses within which a chip module is installed. Channels for an antenna wire may be formed in a surface of the substrate. Instead of using wire, the channels may be filled with a flowable, conductive material. Patches homogenous with the substrate layer may be used to protect and seal the chip and interconnection area. The inlay substrate may include two layers, and the antenna wire may be between the two layers. A moisture-curing polyurethane hot melt adhesive may be used to laminate a cover layer and the additional inlay substrate layers. The adhesive layer may include metal nanoscale powder and ink for electro-magnetic shielding. Additional security elements may include material that is optically changeable by an electro-magnetic field. Ferrite-containing layers may be incorporated in the inlay substrate.
The cover layer 2204 is generally a planar sheet or layer of flexible, durable, often “textile-type” material, such as PVC, coated offset board, with or without optical bleacher or acrylic coated cotton. The inlay substrate 2208 (both layers 2208a and 2208b) is generally a planar layer or sheet of flexible, durable, typically “plastic-type” material, such as Teslin™, PVC, Polycarbonate (PC), polyethylene (PE) PET (doped PE), PETE (derivative of PE), and the like. The material of the inlay substrate may be referred to as “synthetic paper”. The inlay substrate, or a bottom layer thereof (particularly when the antenna is embedded on a top surface of the top layer), can also be conductive, such as a ferrite-coated or ferrite-containing substrate to reflect or absorb electromagnetic energy. This is indicated by the particles (dots) in the bottom inlay substrate layer 2208b.
A hinge gap 2206 is shown, and may simply be a gap, approximately 1 mm wide, between a left (as viewed) portion of the inlay substrate 2208 and a right (as viewed) portion of the inlay substrate 2208. The left portion of the inlay 2200 corresponds to the front of the passport cover, and the right portion of the inlay 2200 corresponds to the back portion of the passport cover. The hinge gap 2206 may not completely separate the back portion of the inlay substrate from the front portion, they may still be joined by a “web”. Typically, the gap is punched or cut after adhesive coating and pre-press lamination (to smooth the surface)
The cover layer 2204 is generally a planar sheet or layer of flexible, durable, often “textile-type” material, such as PVC, coated offset board, with or without optical bleacher or acrylic coated cotton.
The inlay substrate 2208 (both layers 2208a and 2208b) is generally a planar layer or sheet of flexible, durable, typically “plastic-type” material, such as Teslin™, PVC, Polycarbonate (PC), polyethylene (PE) PET (doped PE), PETE (derivative of PE), and the like. The material of the inlay substrate may be referred to as “synthetic paper”.
The inlay substrate 2208, or a bottom layer thereof (particularly when the antenna is embedded on a top surface of the top layer), can also be conductive, such as a ferrite-coated or ferrite-containing substrate to reflect or absorb electromagnetic energy. This is indicated by the particles (dots) in the bottom inlay substrate layer 2208b.
An antenna wire 2220 may be mounted to a top surface of the inlay substrate 2208, and an RFID chip (CM) 2210 may be disposed in a recess 2216 extending into the inlay substrate 2208 from a top surface thereof. The antenna wire 2220 may comprise 4 or 5 turns of wire, such as approximately 80 μm diameter (thick) wire. Ends of the antenna wire 2220 are connected to terminals of the chip (CM) 2210.
The recess 2216 may be a window-type recess extending completely through the inlay substrate 2208 to the bottom surface thereof. of the inlay substrate.
The chip (CM) 2210 may be a leadframe-type chip module comprising a chip mounted on a leadframe 2218 and encapsulated by a mold mass (MM) 2212. The leadframe 2218 may be approximately 80 μm thick and 8 mm wide. The mold mass 2212 may be approximately 240 μm thick and 5 mm wide. The chip (CM) 2210 may have an overall size (width dimensions) of 5.1×8.1 mm and an overall thickness of 320 μm. The width of the recess 2216 should be sufficient to accommodate the chip module (including leadframe 2218), with some clearance.
The inlay substrate 2208 may comprise two or more layers 2208a and 2208b which are laminated (adhesively attached, joined) one another with a layer (or layers) 2209 of adhesive such as 50-80 μm, which may be applied by a roller coater. In the main hereinafter, a two-layer example of an inlay substrate 2208 will be described, comprising an upper (topmost) layer 2208a and a lower (bottommost) layer 2208b.
The recess 2216 for the chip module 2210 extends into the inlay substrate 2208 from the top surface of the topmost layer 2208a, through the topmost layer 2208a, and at least partially into the bottommost layer 2208b. The recess 2216 extends fully through the entire inlay substrate 208, including fully through the bottommost layer 2208a, exiting the inlay substrate 2208 at the bottom of the bottommost layer 2208b.
The recess 2216 may be “stepped” so that it has a larger width dimension opening at the top surface of the inlay substrate 2208 than at the bottom surface of the inlay substrate 2208. For example, a top portion of the recess 2216, for accommodating the leadframe 2218 may measure 5.3 mm×8.1 mm, and a bottom portion of the recess 2216 for accommodating the mold mass 2212 may measure 5.1 mm×5.1 mm. The stepped recess 2216 may be formed by a first opening having a first width dimension in the topmost layer 2208a, second opening having a second width dimension in the next adjacent (which is the bottommost) layer 2208b. When the layers 2208a and 2208b are assembled with one another, the openings in the layers 2208a and 2208b are aligned (such as concentric) with one another. The first width dimension is different than the second width dimension. The first width dimension, for accommodating the leadframe, is shown greater than the second width dimension, for accommodating the mold mass (MM) 2212.
The openings of the recess 2216 in the layers 2208a and 2208b may be any appropriate shape, such as rectangular for a rectangular chip module or circular for a circular (round) chip module (CM). The openings may be formed by a mechanical punch operation. The chip module 2210 may be disposed in the recess 2216 in such a way that the leadframe 2218 is nearly flush with the upper surface of the top substrate layer 2208a and the mold mass of the chip module is nearly flush with a bottom side of the bottom substrate layer 2208b. However, note that the end portions of the antenna wire 2220 are connected (bonded) to the top surface of the leadframe 2218 (opposite the chip and mold mass which are on the bottom surface of the leadframe 2218. Also note that the diameter of the antenna wire 2220 is decreased where it is bonded to the leadframe 2218. For example, the 80 μm wire may be compressed to approximately 40 μm during thermo-compression bonding. The antenna wire 2220 may be embedded (disposed) in a top surface of the topmost substrate layer 2208a, and is connected with a top surface of the leadframe 2218.
In the finished inlay substrate 2208, which may be considered an “interim product”, all of the components (chip CM 2210 and antenna 2220) mounted in or to the inlay substrate 2208 should not project beyond the surface of the inlay substrate 2208.
According to some embodiments (examples) of the invention, a card body (CB) for a smart card (SC, 2200) may comprise at least two layers of a synthetic material and a recess extending through a top of the two layers and at least into a bottom of the two layers; and may be characterized by at least one of: a metallized layer (2202); a compensating loop (CL) having a gap; a compensating loop (CL) without a gap; metal foil (MF); metal foil (MF) having an opening at a location of an antenna module (AM); and ferrite (FE) in the card body. The recess may extend through the bottom layer. An antenna module (AM) may be disposed in the recess. An antenna wire may be disposed between the at least two layers, or on a top surface of the top layer. Ferrite particles may be disposed in the bottom layer.
According to some embodiments (examples) of the invention, a method of making a secure document comprising an inlay substrate may comprise: providing the inlay substrate as at least two layers of a synthetic material, such as Teslin™, laminated to one another with a layer of adhesive; and providing a recess for a chip module in the substrate; and may be characterized by at least one of: providing a metallized layer (2202); providing a compensating loop (CL) having a gap; providing a compensating loop (CL) without a gap; providing a metal foil (MF); providing a metal foil (MF) having an opening at a location of an antenna module (AM); and providing a ferrite element (FE) in the card body. The recess may extend through a top of the two layers and at least into a bottom of the two layers. Ferrite particles may be disposed in at least one of the layers. An antenna wire may be disposed on one of the layers or between the at least two layers.
Metallized Surfaces
Some smartcards, including dual interface (DI) smartcards, have a metal (or metallized) top layer, or “face plate”, substantially the size of the card body. Having a metal layer is technically disingenuous in that a it may significantly reduce coupling between the card and an external contactless reader. Nevertheless, the feature may be important for vanity purposes.
An exemplary stackup of layers for a metallized card may comprise the following layers. The layers are numbered for reference purposes only, not to indicate a particular sequence. The sequence may be as indicated, or the layers may be rearranged. Some layers may be omitted. Some layers may be applicable to either non-metallized smartcards or metallized smartcards. Some of the layers may comprise more than one layer. Some layers may be combined with other layers.
Layer 1
printed sheet, overlay anti-scratch, etc
Layer 2
separate metal layer or metallized foil
Layer 3
booster antenna BA with coupler coil CC
Layer 4
card body CB
Layer 5
compensation frame (back side of card body) on
metallized or non-metallized
Layer 6
printed sheet, underlay anti-scratch, magnetic stripe, etc
An RFID chip (CM) may be disposed in a window “W” (opening) extending into the smartcard, from the front (Layer 1), through the metallized foil (Layer 2) and into the card body (Layer 4). The chip (CM) may have contact pads (CP) on its front surface for interfacing with an external contact reader. The chip (CM) may be a dual interface (DI) antenna module (AM) having a module antenna (MA) for interfacing, via the booster antenna (BA) with coupler coil (CC), with an external contactless reader. The antenna module (AM) may fit within the inner area of the coupler coil (CC).
A window opening 2220 (“W”) may extend into the smart card from the face plate 202, through intervening layers, into the card body layer 2210. A dual interface (DI) antenna module (AM), with module antenna (MA) may be disposed in the window opening 2220. The window opening may extend completely through the layer, in which case the antenna module (AM) would be supported by the underlying layer.
The coupler coil (CC) of the booster antenna (BA) may surround the window opening 2220 so as to be closely coupled with the module antenna (MA) of the antenna module (AM). Alternatively, the coupler coil (CC) may be disposed in the card body (CB) so as to be underneath the module antenna (MA) of the antenna module (AM).
The antenna module (AM) may measure approximately 12×13 mm (and approximately 0.6 mm thick). The window opening 2220 (“W”) in the face plate 2202 may be approximately the same size as the antenna module (AM)—i.e., approximately 12×13 mm. In this “baseline” configuration, the chip activation distance may be approximately 15 mm. (Chip activation distance is similar to read distance, and represents the maximum distance at which the chip module may be activated (for reading) by an external reader. As a general proposition, more is better, 15 mm is not very good, 20 mm or 25 mm would be better. The chip activation distance in a metallized smart card is handicapped by attenuation of the electromagnetic field associated with the booster antenna attributable to the metallic face plate 202 (Layer 1).
The window opening 2220 in the face plate 2202 may be made to be significantly larger than the antenna module (AM) so as to offset shielding and enhance coupling, thereby increasing the activation distance.
The ferrite layer 2204 may also improve coupling by reducing attenuation of coupling by the face plate 2202, helping to concentrate the electromagnetic field between the booster antenna BA and the module antenna MA of the antenna module AM. It may be desirable that the ferrite layer 2204 be as close as possible to the underside of the face plate 2202. Rather than having a separate ferrite layer 2204 (and adhesive layer 2203), ferrite particles or powder may be mixed with an adhesive and sprayed or coated onto the underside of the face plate 202, thereby eliminating the intervening adhesive layer 203. Alternatively, rather than being in the form of a separate layer 2204, the ferrite material may be particles (including nanoparticles) of ferrite embedded in an underlying layer, such as the spacer layer 2208 or the card body layer 2210 (in some configurations, the spacer layer 2208 may be omitted).
The spacer layer 2208 may also improve coupling by reducing attenuation of coupling by the face plate 2202, simply by keeping the face plate 2202 as far away as practical (within the confines of the form factor for smart cards) from the booster antenna 2212.
Note in
A coupling loop (CL) (or “compensating loop”, or “compensation frame”, or variants thereof) may be disposed between some of the layers, for example between the card body layer 2210 and the underlying print layer 2214.
Compensating Loops in the Card Body (CB)
The compensating loop CL may comprise ferrite material, and may be referred to as a “frame”. The compensating loop CL on the reverse side of the booster antenna BA (away from the antenna module AM) may help with the stabilization of the resonance frequency. The compensating loop CL may be used in addition to the booster antenna BA. The booster antenna BA may be embedded into one side of an inlay substrate while the compensation frame may be inkjet printed or adhesively attached to the opposite side of the inlay substrate. The compensation loop CL can be mounted using a subtractive (etching away of material) or additive (depositing material) process.
Metal Foil Layer(s)
Metal foils, metallic coatings, segments of metal foil or metal particles may be deposited on or embedded in the inlay (or card body CB) to alter the electrical characteristics of the RFID device or smartcard. A metal foil layer in the card body construction may helps to meet the ISO and EMV communication standards for RFID devices or smart cards in terms of read write distance, baud rate, Q-factor bandwidth, etc. The metal foil can be any pure metal such as aluminum or copper or an alloy. The metal foils, metallic coatings, segments of metal foil or metal particles should have a thickness less than the skin depth of the metal or material being used in order to prevent the formation of eddy currents in the metal or metallic structure that will attenuate the RF electromagnetic field. The use of thicknesses substantially less than the skin depth of the metal or material being used will increase the electrical resistance of the structure to alternating current flows (impedance) thereby preventing unwanted or excessive attenuation of the RF electromagnetic field. Other electrical conductors such as metal nanoparticles, metal nanowires or carbon-based conductors like graphite or exfoliated graphite can be used to construct electrically conductive networks that are hereby included under the definition of a metal foil or metallic structure.
The booster antenna (BA) is normally constructed from a track of wire embedded in an inlay substrate (or card body CB) comprising one or more layers of a material such as Polyvinyl Chloride (PVC), Polycarbonate (PC), Polyethylene (PE), Poly(ethylene terephthalate) (PET), Polyetherurethane, PET-G (Polyethylene Terephalate Glycol-modified), Polyester Copolymer film, Teslin™, paper, synthetic paper and the like. Alternatively, the booster antenna (BA) can be formed on the inlay substrate by chemically or laser etching a metal coating previously deposited on the substrate. A particular design of booster antenna (BA) with coupler coil (CC), having a certain geometry and number of coil windings, will exhibit specific electrical characteristics in terms of resonance frequency and impedance.
The metallic/metallized foil in the card stackup may exhibit “capacitive coupling” with the booster antenna (BA) to broaden the bandwidth of the Gaussian curve to include the side bands and to reduce the concentration of the electromagnetic flux at the position of the coupler coil CC (i.e. to avoid overpowering the RFID chip). This may improve the communication of signals carried between the RFID device (secure document or smartcard) and the reader on the sub-carrier frequencies (the sub-carrier frequencies is typically +/−848 kHz at 12.712 MHz and 14.408 MHz for a device operating at 13.56 MHz, as per ISO/IES 14443-2).
The metal foil or metallic structure can advantageously alter (such as lower) the quality factor (Q) of the booster antenna (BA). The metal foil or metallic structure can also have a capacitive effect in the circuit. The presence of the metal foil or metallic structure in the card design can alter the electrical power delivered to the IC chip (CM). Some or all of these effects may enhance the performance of the RFID device or smartcard, improving the coupling between the antenna module AM and the coupler coil CC of the booster antenna BA. The communication between the RFID device or smartcard and the reader can thus be improved.
The metal foil MF together with the booster antenna BA generates capacitance in the resonant circuit which may result in a broadening of the resonance curve and which may improve signal communication on the sub-carrier frequencies, typically at 12.712 MHz and 14.408 MHz (i.e. +/−848 kHz for a device operating at 13.56 MHz).
A metal foil, metal coating or metal particles can be implemented in the RFID device or smartcard in a number of ways as described hereunder. A very thin continuous metal foil can be deposited directly on top of the booster inlay (card body CB), behind the booster inlay or within the booster inlay structure. The metal foil can be supported on a plastic substrate, such as Poly(ethylene terephthalate) (PET), before being incorporated into the booster antenna structure.
As an alternative to a continuous metal foil, a perforated (or otherwise segmented or discontinuous) metal foil can be used. The perforations may allow the electromagnetic flux from the RFID reader to substantially penetrate the card body (CB). The perforated foil can be deposited anywhere within the card body, as described above. The thickness of a perforated foil may be greater than the thin continuous foils described above—for example, greater than 15 nm. (A continuous metal foil may have a thickness less than 15 nm.)
As an alternative to a continuous metal foil, a metal mesh can be used. The mesh can be deposited anywhere within the card body as described above. The metal mesh can also be constructed of a porous network
Metal particles of various sizes and shapes (including spheres and flakes) can be deposited on the surface of the booster antenna (BA) or an additional inlay layer within the card body. The metal particles can be formed a range of materials including metal alloys and can be deposited within the material used to form the inlay or other layers within the card body. The metal particles can also be derived from a conventional metallic finish on the surface of the card.
The metal foil MF or metallic structure can cover the full area of the RFID device or smartcard as illustrated in
The metal foils may comprise a conductive material (such as aluminum on PVC), having a sheet resistance which is very low, on the order of only a few Ohms, which normally should block the electromagnetic field (such as between the booster antenna BA and an external reader, or between the booster antenna BA and the antenna module AM), but a mitigating factor may be the thickness of the aluminum (or other material), being thin enough to allow the electromagnetic field to pass through.
Metal foils or substrate materials having metallized coatings may be used in the production of the booster antenna (BA) for RFID devices or smartcards. The metal can be any pure metal such as aluminum or copper or an alloy. Other electrical conductors such as metal nanoparticles, metal nanowires or carbon-based conductors like graphite or exfoliated graphite may also be used.
The booster antenna (BA) is normally constructed from a track of wire embedded in an inlay substrate comprising one or more layers of a material such as Polyvinyl Chloride (PVC), Polycarbonate (PC), Polyethylene (PE), Poly(ethylene terephthalate) (PET), Polyetherurethane, PET-G (Polyethylene Terephalate Glycol-modified), Polyester Copolymer film, Teslin™, paper, synthetic paper and the like. Alternatively the booster antenna (BA) can be formed on the inlay substrate by chemically or laser etching a metal coating previously deposited on the substrate. A particular design of booster antenna (BA) with coupler coil (CC), having a certain geometry and number of coil windings, will exhibit specific electrical characteristics in terms of say resonance frequency and impedance. Metal foils, metallic coatings, segments of metal foil or metal particles may be deposited on or embedded in the inlay substrate or card body to alter the electrical characteristics of the RFID device or smartcard.
The effect of the metal or metallic structures can be to dampen the booster antenna (BA) resulting in a widening of the resonance curve of the booster antenna (BA) and lowering the quality factor (Q). The metal or metallic structure can also have a capacitive effect in the circuit.
These effects can enhance the performance of the RFID device or smartcard. The communication between the RFID device or smartcard and the reader can thus be improved.
The metal foil, metal coating or metal particles can be implemented in the device in a number of ways, for example, but not limited to:
Metal particles of various sizes and shapes (including spheres and flakes) can be deposited on the surface of the booster antenna (BA) or an additional inlay within the card body. The metal particles can be formed a range of materials including metal alloys and can be deposited within the material used to form the inlay or other layers within the card body. The metal particles can also be derived from a conventional metallic finish on the surface of the card.
According to some embodiments (examples) of the invention, a card body (CB) for a smart card (SC) may comprise: a metal foil (MF) layer incorporated into the card body (CB); and may be characterized in that: the metal foil (MF) comprises a material selected from the group consisting of pure metals, alloys, aluminum, copper, metal nanoparticles, metal nanowires, carbon-based conductors, graphite, and exfoliated graphite; and the metal foil may be characterized by one or more of: the metal foil comprises a very thin continuous layer deposited on the card body (CB); the metal foil has a size matching an area of the card body (CB), or only a portion thereof; the metal foil overlaps only the booster antenna (BA) or portions or components of the booster antenna; the metal foil comprises multiple areas of foils which are deposited on or in the card body (CB); the metal foil is perforated, segmented or discontinuous; the metal foil is continuous, and has a thickness less than 15 nm; the metal foil is discontinuous, and has a thickness greater than 15 nm; the metal foil comprises a mesh; the metal foil comprises metal particles of various sizes and shapes; the metal foil partially covers the smartcard area, leaving exposed metal-free region at a coupling coil (CC) of the booster antenna (BA); the metal foil reduces the quality (Q) of the booster antenna without having destructive effects on the coupling between the booster antenna (BA) and the antenna module (AM); the metal foil comprises (
on the Use of Ferrite, Generally
Ferrite layers may be laminated together, and in combination with a copper compensating loop CL on the reverse side of a booster antenna BA may stabilize the resonance frequency of the booster antenna BA. The track may be broken (have a gap) at some position.
Lamination and temperature may be used to sinter ferrite particles together to be a continuous path. Laminating ferrite particles under temperature and very high pressure to produce a thin card material film such as PC PVC PETG to produce a ferrite inlay with antenna. The inlay may consist of several layers of ferrite. The applied temperature and pressure may cause the particles to sinter and form an insulating layer of ferrite.
Depositing ferrite nanoparticles or powder onto an inlay substrate to bend the magnetic flux lines and to compensate for the effect of shielding caused by metallization of the printed layer(s) in a smart card body or any metal layer in close proximity to an RFID antenna in card body; and forming a pre-laminated inlay with a booster antenna or transponder with one or several underlying layers of ferrite which have been laminated together with the RFID components to form a composite inlay layer
Ferrite nanoparticles or powder can be applied to a substrate layer by means of wet or dry spraying. In the case of wet spraying the ferrite is suspended in a liquid phase dispersion which is prepared through sonication of the particles in a solvent or aqueous/surfactant liquid. The particles may also have a steric wrap to support the suspension of the particles in the liquid. The mean crystal particle size of the ferrite spheres can be determined by filtering and by the degree of sonication over time. (Sonication is the act of applying sound, usually ultrasound energy to agitate particles in a sample.)
The sintering of the nano-sized ferrite particles occurs during hot lamination of the synthetic layers which make up the inlay. The lamination process includes heating and cooling under high pressure. Several layers of ferrite coated substrates or foils can be used to enhance the ferromagnetic properties. Unlike bulk ferrite granules, nanoparticles have a much lower sintering temperature, matching the glass transition temperature of the synthetic substrate. Additional heat treatment after lamination may be required.
Ferrite in the Antenna Module (AM)
Ferrite material may be incorporated in the antenna module (AM) such as between the contact pads (CP) and the module antenna (MA).
The Antenna Module (AM) is mounted to a card body (CB) 2360 having a card antenna (CA) 2362. In the contactless mode, the module antenna (MA) 2352 interacts with the card antenna (CA) 2362 which, in turn interacts with the antenna (not shown) of an external reader (not shown). Some particulars may include . . . .
The contact pads CP on the top side of the DIF module are metallic, and therefore may attenuate RF signals passing between the module antenna MA and the card antenna CA. In order to alleviate the attenuation, and to enhance coupling between the module antenna and the card antenna (and ultimately between the chip module and an external reader), a ferrite element (FE) 156 may be disposed (interposed, inserted) between the chip module and the module antenna—or, in other words, between the contact pads (CP) 2344 and the module antenna (MA) 2352.
The ferrite element FE may cover an area which is at least 50% of the area defined by the chip and antenna, or by the contact pads and represents a passive magnetic element that may increase electromagnetic coupling between the module antenna MA and the card antenna CA, providing for example at least a +3 dB increase in signal strength (for signals passing between the module antenna MA and the card antenna CA, in either direction) and a consequent increase in the effective distance between the smartcard 140 and an external contactless card reader (
The ferrite element 2356 may be a separate layer of material, such from TDK or Kitagawa (see http://www.kitagawa.de/index.php?id=8&L=1). The ferrite element 2356 may be sprayed onto the bottom surface of the chip module prior to installing the module antenna. The ferrite element 156 may be continuous (or contiguous, except for openings permitting connecting the antenna module through the ferrite element to the chip module), or may be discontinuous (for example, a grid or screen). As illustrated, an opening 2358 in the ferrite element/layer 2356 may be provided for the chip module CM to be mounted to the substrate 2342. The ferrite element 2356 may have a smooth surface, or may be rippled, or formed with a pattern of “corner reflectors” for enhancing coupling between the module antenna MA and the card antenna CA. The ferrite element 2356 may comprise nanostructures such as nanoparticles, nanowires or nanotubes. The ferrite (or other) element 2356 may be located other than between the module antenna MA and the chip module CM (contact pads CP), so long as the desired effect is achieved. Materials other than ferrite may be used for the “ferrite element”. Any material, such as materials with high electromagnetic permeability, increasing the coupling (efficiency of energy transfer) between the module antenna MA and the card antenna CA may be substituted for ferrite.
The antenna module AM may be implanted in a card body CB which may comprise a die attached and wire bonded to an epoxy glass tape and the connections encapsulated by a dam filled with a transparent UV-casting compound (epoxy resin) having a thickness above the tape of approximately 400 μm. The shape of the “Dam & Fill” area protecting the silicon die is round, having approximately a diameter of 6 mm. A ferrite element FE is mounted over the surface of the dam and surrounding area to act as a shield against the attenuation of the electromagnetic field. The wire module antenna MA is mounted onto the ferrite layer and the wire ends are connected by means of thermo compression bonding to the terminal areas on the epoxy glass tape.
In an alternative construction, the antenna module AM may comprise a chip CM having its own antenna (such as in U.S. Pat. No. 6,373,447), either directly coupled with the card antenna CA (without a module antenna MA) or coupled with the module antenna (AM) which is coupled with the card antenna.
Channels can be formed in a substrate such as the card body CB for accepting a wire (or conductive material) laid therein. (for example, U.S. Pat. No. 7,028,910—Schlumberger). A recess can be formed for accepting the antenna module AM. Channels and recesses can be formed in a substrate using laser ablation.
“Flyer” Coil Winding
US 20130062419 discloses techniques for flyer winding of coils which may serve as module antennas MAs of antenna modules AMs, and represents one of various suitable coil winding techniques that may be used to form the module antennas MAs.
Generally, to form a given module antenna MA, the nozzle may first wrap a first end of the wire around a first of the pair of pins, securing (anchoring, “fixing”) the first end of the wire to the first pin. The nozzle then moves towards the winding core WC, a first end portion of the wire extending (passing) over (across) a first of two bond pads BP on the module tape MT. Then the nozzle “flies” (orbits) around the winding core WC, a number (such as twenty) of times, winding the wire around the winding core WC—hence, the nomenclature “flyer” winding technique. After completing the designated number (such as twenty) of turns, the nozzle heads away from the winding core WC, a second end portion of the wire passing over a second of the two bond pads for the module antenna MA, to secure (tie off) the second end of the wire on the second of the pair of pins. Then the end portions of the wire passing over the two bond pads BP for the module antenna MA may be bonded to the respective bond pads.
It may be convenient to first form a plurality of module antennas MA, before bonding the end portions of the module antennas BP. Note in the figure that several/(six) module antennas MA have already been formed, with their two end portions extending over bond pads BP and tied off to a corresponding pairs of pins. Then, in a subsequent step, the end portions of the module antennas MA can be bonded (such as using a thermode) to the respective bond pads BP. After completing formation of the module antennas MA, residual portions (between the bond pads BP and associated pins) of the ends of the wire may be cut, the pins retracted, and “waste” wire removed such a with a suction system.
The formation of the module antenna MAs and bonding of their end portions to respective bond pads BP may be performed prior to inserting the chip CM onto module tape MT. By completing these steps before wire bonding of the chip CM (see, for example,
The flyer winding technique illustrated in
The following patent relating to flyer winding are incorporated by reference herein:
According to an embodiment of the invention, a plurality (sequence) of antenna modules AMs (or sites for antenna modules) are provided, one after the other, on a continuous tape (such as 35 mm). Two antenna connection pads (ACPs) are provided per module (or site), and these two pads may be on the same side of the antenna module AM, external to the winding core WC (compare
Generally, to form a given module antenna (MA), the coil winding nozzle (CWN) may first wrap an end of the coil wire around an external pin, securing (anchoring, “fixing”) the end of the coil wire to the external pin. By movement of the chip carrier tape (MT) (or the coil winding nozzle (CWN) or both), the coil winding nozzle (CWN) is positioned towards a dam structure (DS) of the first site in a row of module sites, an end portion of the coil wire extending (passing) over (across) a first of two antenna connection pads ACP, or bond pads BP on the module tape (MT).
Then, the coil winding nozzle (CWN) “flies” (orbits) around the dam structure (DS), a number (such as fifteen) of times, winding the wire around the dam structure (DS) of the first module position—hence, the nomenclature “flyer” winding technique. After completing the designated number (such as fifteen) of turns, the coil winding nozzle (CWN) heads away from the dam structure (DS) of the first module position, a second end portion of the coil wire passing over a second of the two bond pads ACP (BP) for the module antenna (MA). The coil winding nozzle (CWN) then proceeds towards the next dam structure (DS) of the second module site by the incremental movement of the tape (or movement of the coil winding nozzle (CWN) or both). The dots on the antenna connection pads ACPs indicate that the wire may be bonded to the ACPs, such as after a number (plurality, sequence) of module antennas MAs are wound.
The dashed line (in
The end portions of the coil wire pass over the two antenna connection pads ACP, or bond pads BP for the first module antenna (MA) and may be bonded to the respective antenna connection pad ACP or bond pad BP at a later stage in the process. By a further incremental movement of the tape (or movement of the coil winding nozzle (CWN) or both), the coil wire may be drawn over the a first antenna connection pad ACP or bond pad BP of a next (second) antenna module (site), and after winding the coil wire around the dam structure (DS) of the second antenna module, the coil wire may be drawn over a second antenna connection pad ACP or bond pad BP of the second antenna module site. This process may be repeated for each antenna module (site) in a row: upon completion of a module antenna (MA), the coil wire may be drawn from one position (site) in a row to the next position by the step movement of the tape. In addition, the coil wire may be drawn and placed over the antenna connection pad ACP or bond pad BP positions on the module tape, for later interconnecting of the wire ends (WE) of each module antenna (MA) to the module tape (MT). After interconnecting the wire ends (WE) of each module antenna (MA), the remaining wires spanning across one position to the next position may be cut and removed using a suction system.
The module tape (MT) may be designed such that the antenna connection pads (ACPs) are aligned along axes parallel the tape edges. The two antenna connection pads (ACP) for a given module antenna (MA) may both be disposed on one side edge of the antenna module (AM)—which, for a row of antenna modules (AM) may also be along one edge of the module tape (MT). Conventionally, the antenna connection pads (ACP) would be located on opposite sides of the antenna module (AM), but with the six contact module there is not sufficient space to do this. The two antenna connection pads (ACP) may be disposed on the same side (rather than opposite sides) thereof.
A continuous length of wire may form the module antennas (MAs) for all of the antenna modules (AMs) in a given row of sites on the module tape (MT). (There may be one row of sites across the top half of the tape, and a second row of sites across the bottom half of the tape.) This continuity of coil windings can extend across an indefinite series of antenna modules (AMs) on the module tape (MT). This is facilitated by the linear alignment of the antenna connection pads (ACPs) along axes parallel the tape edges. The wire overlaps the antenna contact pads (ACPs), ready for thermo-compression (or equivalent) bonding and excess wire trimming. In the case of support structures (SS) employing a lid (LD) or cover plate (CP; e.g.,
In summary, coils for module antennas (MAs) may be wound upon support structures (SS, DS, WC) on a module tape (MT), each support structure associated with a given antenna module (AM), and progressing (moving, going) from one antenna module site to another (subsequent support structure/antenna module site) on the module tape, with all the coils remaining attached (by the wire) until the antenna modules (AMs) are separated (singulated from one another).
Remote Coil Winding
In the flyer winding techniques described above, the coil for the module antenna MA is wound, in situ, on a support structure (SS, DS, WC) on the module tape MT.
A plurality of coil winding forms (CWFs) may be arranged in sequence on a conveying mechanism, such as a wheel W (as illustrated), and presented sequentially to a remotely-located coil winding mechanism CWM (having a winding head) that winds coils on the coil winding forms CWFs. This may be in a manner similar to the in situ coil winding techniques described above, but is performed “remote” from the module tape MT.
Eight (8) coil winding forms CWF, labeled “1”-“8” are shown on wheel which can be rotated (angularly incremented) to present each of the coil winding forms, sequentially, to the coil winding mechanism which is located above the wheel (as illustrated). After completing winding of a coil on given coil winding form, the wheel W may be rotated, such as 45° to present the next CWF to the CWM. The module antennas MAs thus produced (remotely), are linked to each other by wire, rather than being separated from each other. Also, a MA thus produced remains supported by the respective CWF upon which it is wound, until the moment before it is transferred to the module tape MT.
In the figure, CWFs #1, #2, #3, #4 have already had coils for module antennas MAs wound upon them, CWF #5 is having a coil for a module antenna MA wound upon it, and CWFs #6, #7, #8 are queued up to have coils for modules MAs wound upon them. Note that the wheel W is positioned so that CWF #1 is directly above a given antenna module AM (or, more aptly, a site on a module tape MT for an antenna module) that is ready to receive a coil for module antenna MA. Five antenna module sites 1, 2, 3, 4, 5 are illustrated on a linear conveyor to be positioned under the a given CWF (in this illustration, CWF #1) that has had a coil for a module antenna MA wound upon it. With the wheel and the conveyor thus positioned, the module antenna MA on the relevant CWF (CWF #1) is ready to be transferred to the AM. Transfer of the coil from the coil winding form CWF to the module tape MT may be achieved by retracting the coil winding form CWF, thereby releasing the coil (MA), or by another means suitable for ejecting the coils. It can be noted that the several coils (MA) may remain connected with one another (by a wire) after being transferred to the module tape MT, thereafter to be separated (or singulated) from one another.
As was shown above (
According to some embodiments (examples) of the invention, a method of winding coils for antenna modules (AM) may comprise: providing a plurality of coil winding forms (CWFs); winding coils for module antennas (MAs) on the coil winding forms; and transferring the module antennas to positions on a module tape (MT) corresponding to antenna modules. The coil winding forms may be disposed on a wheel, and a position of the wheel may be incremented to present the coil winding forms sequentially to a coil winding mechanism. The coils may remain interconnected with one another during the process of manufacturing several antenna modules AMs, later to be singulated from one another.
While the invention(s) has/have been described with respect to a limited number of embodiments, these should not be construed as limitations on the scope of the invention(s), but rather as examples of some of the embodiments. Those skilled in the art may envision other possible variations, modifications, and implementations that are also within the scope of the invention(s), and claims, based on the disclosure(s) set forth herein.
Lotya, Mustafa, Finn, David, Ummenhofer, Klaus, Czornack, Jan Thomas, Fendt, Theodor
| Patent | Priority | Assignee | Title |
| 10014249, | Feb 02 2016 | PARLEX PACIFIC LIMITED | Circuit board and smart card module and smart card utilizing the same |
| 10248902, | Nov 06 2017 | AmaTech Group Limited | Coupling frames for RFID devices |
| 10518518, | Jan 18 2013 | AmaTech Group Limited | Smart cards with metal layer(s) and methods of manufacture |
| 10552722, | Aug 10 2014 | AmaTech Group Limited | Smartcard with coupling frame antenna |
| 10599972, | Jan 18 2013 | AmaTech Group Limited | Smartcard constructions and methods |
| 10733494, | Aug 10 2014 | AmaTech Group Limited | Contactless metal card constructions |
| 10824931, | Aug 30 2012 | AmaTech Group Limited | Contactless smartcards with multiple coupling frames |
| 10977542, | Jan 18 2013 | AmaTech Group Limited | Smart cards with metal layer(s) and methods of manufacture |
| 11030513, | Nov 23 2018 | Infineon Technologies AG | Chip card |
| 11037044, | Jan 18 2013 | AmaTech Group Limited | Smartcard constructions and methods |
| 11055597, | Oct 13 2017 | MAGNUM MAGNETICS CORPORATION | RFID magnet and method of making |
| 11066296, | Aug 21 2018 | Iowa State University Research Foundation, Inc. | Methods, apparatus, and systems for fabricating solution-based conductive 2D and 3D electronic circuits |
| 11167375, | Aug 10 2018 | The Research Foundation for The State University of New York | Additive manufacturing processes and additively manufactured products |
| 11354558, | Jan 18 2013 | AmaTech Group Limited | Contactless smartcards with coupling frames |
| 11354560, | Jan 18 2013 | AmaTech Group Limited | Smartcards with multiple coupling frames |
| 11361204, | Mar 07 2018 | X-Card Holdings, LLC | Metal card |
| 11416728, | Aug 15 2019 | Federal Card Services, LLC | Durable dual interface metal transaction cards |
| 11426818, | Aug 10 2018 | The Research Foundation for The State University; The Research Foundation for The State University of New York | Additive manufacturing processes and additively manufactured products |
| 11455507, | Oct 13 2019 | Federal Card Services, LLC | Metal transaction cards containing ceramic having selected coloring and texture |
| 11551051, | Jan 18 2013 | AmaTech Group Limited | Coupling frames for smartcards with various module opening shapes |
| 11568195, | Jan 18 2013 | AmaTech Group Limited | Smart cards with metal layer(s) and methods of manufacture |
| 11836565, | Jan 18 2013 | AmaTech Group Limited | Smartcards with multiple coupling frames |
| 11853824, | Mar 07 2018 | X-Card Holdings, LLC | Metal card |
| 11907787, | Mar 01 2022 | ANOMATIC CORPORATION | Dual interface metallic transaction cards and methods of manufacturing the same |
| 9390364, | Aug 08 2011 | AmaTech Group Limited | Transponder chip module with coupling frame on a common substrate for secure and non-secure smartcards and tags |
| 9475086, | Jan 18 2013 | AmaTech Group Limited | Smartcard with coupling frame and method of increasing activation distance of a transponder chip module |
| 9489613, | Aug 08 2011 | AmaTech Group Limited | RFID transponder chip modules with a band of the antenna extending inward |
| 9622359, | Aug 08 2011 | AmaTech Group Limited | RFID transponder chip modules |
| 9634391, | Aug 08 2011 | AmaTech Group Limited | RFID transponder chip modules |
| 9697459, | Aug 10 2014 | AmaTech Group Limited | Passive smart cards, metal cards, payment objects and smart jewelry |
| 9798968, | Jan 18 2013 | AmaTech Group Limited | Smartcard with coupling frame and method of increasing activation distance of a transponder chip module |
| 9812782, | Aug 08 2011 | AmaTech Group Limited | Coupling frames for RFID devices |
| 9836684, | Aug 10 2014 | AmaTech Group Limited | Smart cards, payment objects and methods |
| 9941591, | Mar 03 2016 | Microsoft Technology Licensing, LLC | Antenna arrangement |
| D942538, | Jul 30 2020 | AmaTech Group Limited; Federal Card Services, LLC | Asymmetrical arrangement of contact pads and connection bridges of a transponder chip module |
| D943024, | Jul 30 2020 | AmaTech Group Limited; Federal Card Services, LLC | Asymmetrical arrangement of contact pads and connection bridges of a transponder chip module |
| Patent | Priority | Assignee | Title |
| 5012236, | May 26 1989 | ALGERNON PROMOTIONS,INC ; ALGERNON PROMOTIONS INC | Electromagnetic energy transmission and detection apparatus |
| 5084699, | May 26 1989 | ALGERNON PROMOTIONS,INC ; ALGERNON PROMOTIONS INC | Impedance matching coil assembly for an inductively coupled transponder |
| 5261615, | Jul 03 1989 | ASSA ABLOY AB | Process for manufacturing electronic components comprising a fine-wire winding, and device for holding the winding wire permitting manufacture according to this process |
| 5270717, | Mar 26 1992 | Texas Instruments Deutschland GmbH | Extended range RF-ID transponder |
| 5572410, | Feb 25 1991 | ASSA ABLOY AB | Integrated circuit device having a winding connected to an integrated circuit solely by a wire |
| 5773812, | Feb 08 1994 | Angewandte Digital Elektronik GmbH | Chip card capable of both contact and contactless operation including a contact block |
| 5955723, | Nov 03 1997 | Infineon Technologies AG | Contactless chip card |
| 6008993, | Dec 11 1994 | Angeuandte Digital Electronik GmbH | Chip card with chip support element and coil support element |
| 6095423, | Aug 14 1996 | Siemens Aktiengesellschaft | Method of producing a smart card module, a smart card module produced by the method, and a combination smart card containing the smart card module |
| 6142381, | Mar 15 1996 | SMARTRAC IP B V | Contact or contactless chip card with brace |
| 6190942, | Oct 09 1996 | PAV Card GmbH; Siemens AG; EVC Rigid Film GmbH | Method and connection arrangement for producing a smart card |
| 6233818, | Feb 12 1996 | SMARTRAC IP B V | Method and device for bonding a wire conductor |
| 6295720, | Aug 28 1996 | SMARTRAC IP B V | Device for producing a coil arrangement |
| 6310778, | Sep 18 1995 | SMARTRAC IP B V | IC board module for producing an IC board and process for producing an IC board |
| 6375083, | Jan 15 1997 | Siemens Aktiengesellschaft | Smart card |
| 6378774, | Nov 14 1997 | Toppan Printing Co., Ltd. | IC module and smart card |
| 6406935, | Nov 29 1999 | ASK S A | Manufacturing process of a hybrid contact-contactless smart card with an antenna support made of fibrous material |
| 6424301, | Mar 01 2000 | Siemens VDO Automotive Corporation | Combination battery holder and antenna for keyfob |
| 6698089, | Feb 12 1996 | SMARTRAC IP B V | Device for bonding a wire conductor |
| 6719206, | Nov 09 1998 | On Track Innovations Ltd. | Data transaction card and method of manufacture thereof |
| 7320738, | Apr 18 2002 | Microconnections SAS | Method for encapsulation of a chip card and module obtained thus |
| 7928918, | Sep 02 2005 | THALES DIS FRANCE SAS | Adjusting resonance frequency by adjusting distributed inter-turn capacity |
| 7980477, | May 17 2007 | Feinics Amatech Teoranta | Dual interface inlays |
| 8100337, | Aug 30 2005 | SMART PACKAGING SOLUTIONS SPS | Double interface communication electronic module, in particular for a chip card |
| 8130166, | Oct 03 2007 | ASSA ABLOY AB | Coupling device for transponder and smart card with such device |
| 8261997, | Sep 17 2009 | MORGAN STANLEY SENIOR FUNDING, INC | Surface-tolerant RFID transponder device |
| 8474726, | Aug 12 2010 | AmaTech Group Limited | RFID antenna modules and increasing coupling |
| 8789762, | Aug 12 2010 | AmaTech Group Limited | RFID antenna modules and methods of making |
| 8870080, | Aug 12 2010 | AmaTech Group Limited | RFID antenna modules and methods |
| 20010011012, | |||
| 20020020903, | |||
| 20020105232, | |||
| 20070171074, | |||
| 20080245879, | |||
| 20080246614, | |||
| 20080283615, | |||
| 20080308641, | |||
| 20080314990, | |||
| 20090057414, | |||
| 20090152362, | |||
| 20090169776, | |||
| 20100176205, | |||
| 20100283690, | |||
| 20110155811, | |||
| 20110163167, | |||
| 20110189620, | |||
| 20120038445, | |||
| 20120055013, | |||
| 20120061473, | |||
| 20120064307, | |||
| 20120074233, | |||
| 20130075477, | |||
| 20130146670, | |||
| 20130146671, | |||
| CA2279176, | |||
| DE102006024247, | |||
| DE19632115, | |||
| DE3935364, | |||
| DE4311493, | |||
| DE69706577, | |||
| EP782214, | |||
| EP875039, | |||
| EP931295, | |||
| EP977145, | |||
| EP1031939, | |||
| EP1325468, | |||
| EP2120190, | |||
| NL9100347, | |||
| WO2006125916, | |||
| WO2007025934, | |||
| WO2007026077, | |||
| WO2013034426, |
| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Nov 13 2013 | Feinics Amatech Teoranta | (assignment on the face of the patent) | / | |||
| Nov 14 2013 | UMMENHOFER, KLAUS | FÉINICS AMATECH TEORANTA | CORRECTIVE ASSIGNMENT TO CORRECT THE THE ASSIGNMENT IS FOR 14078527, AND WAS PREVIOUSLY RECORDED TO 14087527 PREVIOUSLY RECORDED ON REEL 032571 FRAME 0621 ASSIGNOR S HEREBY CONFIRMS THE ASSIGNMENT | 041270 | /0838 | |
| Nov 14 2013 | FENDT, THEODOR | FÉINICS AMATECH TEORANTA | CORRECTIVE ASSIGNMENT TO CORRECT THE THE ASSIGNMENT IS FOR 14078527, AND WAS PREVIOUSLY RECORDED TO 14087527 PREVIOUSLY RECORDED ON REEL 032571 FRAME 0621 ASSIGNOR S HEREBY CONFIRMS THE ASSIGNMENT | 041270 | /0838 | |
| Nov 14 2013 | CZORNACK, JAN-THOMAS | FÉINICS AMATECH TEORANTA | CORRECTIVE ASSIGNMENT TO CORRECT THE THE ASSIGNMENT IS FOR 14078527, AND WAS PREVIOUSLY RECORDED TO 14087527 PREVIOUSLY RECORDED ON REEL 032571 FRAME 0621 ASSIGNOR S HEREBY CONFIRMS THE ASSIGNMENT | 041270 | /0838 | |
| Nov 14 2013 | LOTYA, MUSTAFA | FÉINICS AMATECH TEORANTA | CORRECTIVE ASSIGNMENT TO CORRECT THE THE ASSIGNMENT IS FOR 14078527, AND WAS PREVIOUSLY RECORDED TO 14087527 PREVIOUSLY RECORDED ON REEL 032571 FRAME 0621 ASSIGNOR S HEREBY CONFIRMS THE ASSIGNMENT | 041270 | /0838 | |
| Nov 14 2013 | FINN, DAVID | FÉINICS AMATECH TEORANTA | CORRECTIVE ASSIGNMENT TO CORRECT THE THE ASSIGNMENT IS FOR 14078527, AND WAS PREVIOUSLY RECORDED TO 14087527 PREVIOUSLY RECORDED ON REEL 032571 FRAME 0621 ASSIGNOR S HEREBY CONFIRMS THE ASSIGNMENT | 041270 | /0838 | |
| Nov 14 2013 | UMMENHOFER, KLAUS | FÉINICS AMATECH TEORANTA | CORRECTIVE ASSIGNMENT TO CORRECT THE 14087527 PREVIOUSLY RECORDED ON REEL 032571 FRAME 0621 ASSIGNOR S HEREBY CONFIRMS THE ASSIGNMENT | 041269 | /0370 | |
| Nov 14 2013 | FENDT, THEODOR | FÉINICS AMATECH TEORANTA | CORRECTIVE ASSIGNMENT TO CORRECT THE 14087527 PREVIOUSLY RECORDED ON REEL 032571 FRAME 0621 ASSIGNOR S HEREBY CONFIRMS THE ASSIGNMENT | 041269 | /0370 | |
| Nov 14 2013 | CZORNACK, JAN-THOMAS | FÉINICS AMATECH TEORANTA | CORRECTIVE ASSIGNMENT TO CORRECT THE 14087527 PREVIOUSLY RECORDED ON REEL 032571 FRAME 0621 ASSIGNOR S HEREBY CONFIRMS THE ASSIGNMENT | 041269 | /0370 | |
| Nov 14 2013 | LOTYA, MUSTAFA | FÉINICS AMATECH TEORANTA | CORRECTIVE ASSIGNMENT TO CORRECT THE 14087527 PREVIOUSLY RECORDED ON REEL 032571 FRAME 0621 ASSIGNOR S HEREBY CONFIRMS THE ASSIGNMENT | 041269 | /0370 | |
| Nov 14 2013 | FINN, DAVID | FÉINICS AMATECH TEORANTA | CORRECTIVE ASSIGNMENT TO CORRECT THE 14087527 PREVIOUSLY RECORDED ON REEL 032571 FRAME 0621 ASSIGNOR S HEREBY CONFIRMS THE ASSIGNMENT | 041269 | /0370 | |
| Nov 14 2013 | UMMENHOFER, KLAUS | FÉINICS AMATECH TEORANTA | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 032571 | /0621 | |
| Nov 14 2013 | FENDT, THEODOR | FÉINICS AMATECH TEORANTA | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 032571 | /0621 | |
| Nov 14 2013 | CZORNACK, JAN THOMAS | FÉINICS AMATECH TEORANTA | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 032571 | /0621 | |
| Nov 14 2013 | LOTYA, MUSTAFA | FÉINICS AMATECH TEORANTA | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 032571 | /0621 | |
| Nov 14 2013 | FINN, DAVID | FÉINICS AMATECH TEORANTA | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 032571 | /0621 | |
| Nov 14 2013 | CZORNACK, JAN-THOMAS | FÉINICS AMATECH TEORANTA | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 040867 | /0593 | |
| Dec 14 2021 | FÉINICS AMATECH TEORANTA | AmaTech Group Limited | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 058960 | /0347 |
| Date | Maintenance Fee Events |
| Aug 13 2018 | BIG: Entity status set to Undiscounted (note the period is included in the code). |
| Apr 08 2019 | REM: Maintenance Fee Reminder Mailed. |
| Sep 23 2019 | EXP: Patent Expired for Failure to Pay Maintenance Fees. |
| Date | Maintenance Schedule |
| Aug 18 2018 | 4 years fee payment window open |
| Feb 18 2019 | 6 months grace period start (w surcharge) |
| Aug 18 2019 | patent expiry (for year 4) |
| Aug 18 2021 | 2 years to revive unintentionally abandoned end. (for year 4) |
| Aug 18 2022 | 8 years fee payment window open |
| Feb 18 2023 | 6 months grace period start (w surcharge) |
| Aug 18 2023 | patent expiry (for year 8) |
| Aug 18 2025 | 2 years to revive unintentionally abandoned end. (for year 8) |
| Aug 18 2026 | 12 years fee payment window open |
| Feb 18 2027 | 6 months grace period start (w surcharge) |
| Aug 18 2027 | patent expiry (for year 12) |
| Aug 18 2029 | 2 years to revive unintentionally abandoned end. (for year 12) |