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The ornamental design for a hybrid integrated circuit device, as shown and described.
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FIG. 1 is a perspective view of a hybrid integrated circuit device showing an embodiment of our new design;
FIG. 2 is a front elevational view thereof, which is symmetrical to a rear elevational view not shown herein;
FIG. 3 is a left side elevational view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof; and,
FIG. 7 is a cross sectional view, taken along the line A--A of FIG. 5.
Ito, Tetsuya, Wasada, Yoshiyuki, Tomaru, Naoki
Patent | Priority | Assignee | Title |
D660828, | Nov 09 2010 | GEMALTO M2M GMBH | Wireless module |
D706733, | Sep 16 2013 | AIO CORE CO , LTD | Signal conversion device |
D707193, | Sep 16 2013 | AIO CORE CO , LTD | Signal conversion device |
D712854, | Apr 26 2013 | NOK Corporation | Integrated circuit tag |
D715234, | Apr 18 2013 | SemiLEDS Optoelectronics Co., Ltd. | Flip chip |
D731990, | Apr 18 2012 | NOK Corporation | Integrated circuit tag |
D742581, | Dec 09 2013 | Kenall Manufacturing Company | Driver housing |
D770991, | Nov 05 2013 | NOK Corporation | Integrated circuit tag |
D805240, | Dec 09 2013 | Kenall Manufacturing Company | Driver housing |
D805680, | Dec 09 2013 | Kenall Manufacturing Company | Driver housing |
D844216, | Dec 09 2013 | Kenall Manufacturing Company | Driver housing |
D849570, | Mar 31 2017 | Elemental Machines, LLC; ELEMENTAL MACHINES, INC | Sensor device |
D855577, | Apr 12 2018 | Telebox Industries Corp. | Circuit board for electrical connector |
D894764, | Jun 27 2018 | SAPIENZA RESEARCH, LLC | Humidity sensor |
RE45712, | Mar 18 2013 | AIO CORE CO , LTD | Signal conversion device |
RE45741, | Mar 18 2013 | AIO CORE CO , LTD | Signal conversion device |
Patent | Priority | Assignee | Title |
5742480, | Nov 02 1994 | SUMITOMO ELECTRIC INDUSTRIES, LTD | Optical module circuit board having flexible structure |
5838546, | Apr 12 1996 | NEC Corporation | Mounting structure for a semiconductor circuit |
5905639, | Sep 29 1997 | Raytheon Company | Three-dimensional component stacking using high density multichip interconnect decals and three-bond daisy-chained wedge bonds |
6028773, | Nov 14 1997 | Apple Inc | Packaging for silicon sensors |
6201701, | Mar 11 1998 | STELLAR MICROELECTRONICS, INC | Integrated substrate with enhanced thermal characteristics |
D357671, | Sep 16 1993 | Fuji Electric Co., Ltd. | Hybrid integrated circuit for electric power control |
D396450, | Dec 24 1996 | FUJI ELECTRIC CO , LTD | Hybrid integrated circuit for electric power control |
D430856, | Aug 05 1999 | Alan W., Wilkerson | Circuit board |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
May 25 2001 | ITO, TETSUYA | TAIYO YUDEN CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 011912 | /0320 | |
May 25 2001 | TOMARU, NAOKI | TAIYO YUDEN CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 011912 | /0320 | |
May 28 2001 | WASADA, YOSHIYUKI | TAIYO YUDEN CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 011912 | /0320 | |
Jun 15 2001 | Taiyo Yuden Co., Ltd. | (assignment on the face of the patent) | / |
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