FIG. 1 is a front, bottom and left side perspective view of a portion of a substrate for an electronic circuit, showing my new design;
FIG. 2 is a rear, top and left side perspective view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a front elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a left side elevational view thereof; and,
FIG. 8 is a rear elevational view thereof.
The uneven spaced broken lines define the bounds of the claimed design and form no part thereof. The even spaced broken line showing of the substrate for an electronic circuit is for illustrative purpose only and forms no part of the claimed design.
Patent |
Priority |
Assignee |
Title |
11333677, |
Jul 23 2018 |
CACI, Inc.—Federal |
Methods and apparatuses for detecting tamper using heuristic models |
11662698, |
Jul 23 2018 |
CACI, Inc.—Federal |
Methods and apparatuses for detecting tamper using machine learning models |
11747775, |
Jul 23 2018 |
CACI, Inc.—Federal |
Integrated tamper detection system and methods |
9497570, |
Feb 06 2014 |
NIMBELINK CORP |
Embedded wireless modem |
D691101, |
Nov 08 2011 |
Seiko Epson Corporation |
Circuit board for an ink cartridge |
D702689, |
Aug 17 2012 |
KINGSTON DIGITAL, INC. |
Memory module |
D702690, |
Oct 17 2012 |
KINGSTON DIGITAL, INC. |
Memory module |
D706733, |
Sep 16 2013 |
AIO CORE CO , LTD |
Signal conversion device |
D707193, |
Sep 16 2013 |
AIO CORE CO , LTD |
Signal conversion device |
D712854, |
Apr 26 2013 |
NOK Corporation |
Integrated circuit tag |
D715234, |
Apr 18 2013 |
SemiLEDS Optoelectronics Co., Ltd. |
Flip chip |
D729249, |
Dec 25 2013 |
SILICON POWER COMPUTER & COMMUNICATIONS INC. |
Memory access device |
D731491, |
Feb 07 2014 |
NIMBELINK CORP |
Embedded cellular modem |
D733145, |
Mar 14 2014 |
KINGSTON DIGITAL, INC. |
Memory module |
D733713, |
Jan 04 2013 |
Samsung Electronics Co., Ltd. |
SSD storage device |
D742338, |
Aug 27 2014 |
Apple Inc |
MLB module for electronic device |
D757666, |
Oct 16 2014 |
Japan Aviation Electronics Industry, Limited |
Flexible printed circuit |
D787456, |
Jan 14 2015 |
Kioxia Corporation |
Substrate for an electronic circuit |
D787457, |
Jan 14 2015 |
Kioxia Corporation |
Substrate for an electronic circuit |
D793973, |
Jan 14 2015 |
Kioxia Corporation |
Substrate for an electronic circuit |
D794034, |
Jan 07 2009 |
Samsung Electronics Co., Ltd. |
Memory device |
D794641, |
Jan 07 2009 |
Samsung Electronics Co., Ltd. |
Memory device |
D794642, |
Jan 07 2009 |
Samsung Electronics Co., Ltd. |
Memory device |
D794643, |
Jan 07 2009 |
Samsung Electronics Co., Ltd. |
Memory device |
D794644, |
Jan 07 2009 |
Samsung Electronics Co., Ltd. |
Memory device |
D795261, |
Jan 07 2009 |
Samsung Electronics Co., Ltd. |
Memory device |
D795262, |
Jan 07 2009 |
Samsung Electronics Co., Ltd. |
Memory device |
D819037, |
Jan 22 2016 |
Shenzhen Longsys Electronics Co., Ltd. |
SSD storage module |
D848432, |
Feb 17 2017 |
Samsung Electronics Co., Ltd. |
SSD storage device |
D855577, |
Apr 12 2018 |
Telebox Industries Corp. |
Circuit board for electrical connector |
D868069, |
Jun 29 2017 |
V-COLOR TECHNOLOGY INC. |
Memory device |
D869469, |
Apr 09 2018 |
Samsung Electronics Co., Ltd. |
SSD storage device |
D869470, |
Apr 09 2018 |
Samsung Electronics Co., Ltd. |
SSD storage device |
D897345, |
Dec 07 2018 |
|
Double-data-rate SDRAM card |
D930601, |
Sep 09 2019 |
The Noco Company |
Circuit board |
D937792, |
Sep 09 2019 |
The Noco Company |
Circuit board |
D937793, |
Sep 09 2019 |
The Noco Company |
Circuit board |
D938374, |
Sep 09 2019 |
The Noco Company |
Circuit board |
D944219, |
Sep 09 2019 |
The Noco Company |
Circuit board |
D947800, |
Jul 16 2019 |
CACI, Inc.—Federal |
Integrated module |
D949117, |
Sep 09 2019 |
The Noco Company |
Circuit board |
D954006, |
Nov 03 2020 |
|
Microcircuit for smart card |
D954061, |
Dec 07 2018 |
|
Double-data-rate SDRAM card |
D956707, |
Sep 26 2019 |
LAPIS SEMICONDUCTOR CO , LTD |
Circuit board |
D958762, |
Sep 09 2019 |
The Noco Company |
Circuit board |
D989014, |
Sep 09 2019 |
The Noco Company |
Circuit board |
ER1044, |
|
|
|
ER1698, |
|
|
|
ER1824, |
|
|
|
ER1952, |
|
|
|
ER3431, |
|
|
|
ER4226, |
|
|
|
ER428, |
|
|
|
ER522, |
|
|
|
ER5681, |
|
|
|
ER686, |
|
|
|
ER792, |
|
|
|
ER8298, |
|
|
|
ER9526, |
|
|
|
RE45712, |
Mar 18 2013 |
AIO CORE CO , LTD |
Signal conversion device |
RE45741, |
Mar 18 2013 |
AIO CORE CO , LTD |
Signal conversion device |
Patent |
Priority |
Assignee |
Title |
5973399, |
Feb 17 1998 |
Intel Corporation |
Tamper resistant attach mechanism between plastic cover and thermal plate assembly for processor cartridges |
6101096, |
Jun 10 1999 |
Intel Corporation |
Heat sink clip for an electronic assembly |
6930889, |
Mar 16 2001 |
Intel Corporation |
Circuit board and slot connector assembly |
7315454, |
Oct 31 2005 |
Polaris Innovations Limited |
Semiconductor memory module |
7473991, |
Dec 22 2005 |
Kabushiki Kaisha Toshiba |
Semiconductor device and electric apparatus |
7489025, |
Nov 16 2004 |
GLOBALFOUNDRIES U S INC |
Device and method for fabricating double-sided SOI wafer scale package with optical through via connections |
7502231, |
Jul 16 2003 |
Samsung Electronics Co., Ltd. |
Thin printed circuit board for manufacturing chip scale package |
7685337, |
May 24 2007 |
SanDisk Technologies, Inc |
Solid state storage subsystem for embedded applications |
8040680, |
Dec 27 2007 |
TOSHIBA CLIENT SOLUTIONS CO , LTD |
Information processing apparatus and nonvolatile semiconductor storage device |
8189328, |
Oct 23 2006 |
SanDisk Technologies, Inc |
Methods and apparatus of dual inline memory modules for flash memory |
8199521, |
Oct 31 2006 |
Polaris Innovations Limited |
Memory module and method for operating a memory module |
20030006064, |
|
|
|
20030094628, |
|
|
|
20060186520, |
|
|
|
20070274032, |
|
|
|
20080089020, |
|
|
|
20080123318, |
|
|
|
20080137278, |
|
|
|
20080200041, |
|
|
|
20090279243, |
|
|
|
20100296236, |
|
|
|
20110051351, |
|
|
|
20110063790, |
|
|
|
D432096, |
Nov 24 1999 |
Samsung Electronics Co., Ltd. |
Semiconductor module |
JP1384320, |
|
|
|