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The ornamental design for a hybrid integrated circuit device, as shown and described.
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FIG. 1 is a perspective view of a hybrid integrated circuit device showing an embodiment of our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
Kato, Hideki, Ito, Tetsuya, Igarashi, Tomohiro, Yoda, Hideki
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jul 24 2001 | KATO, HIDEKI | TAIYO YUDEN CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012023 | /0319 | |
Jul 24 2001 | IGARASHI, TOMOHIRO | TAIYO YUDEN CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012023 | /0319 | |
Jul 24 2001 | YODA, HIDEKI | TAIYO YUDEN CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012023 | /0319 | |
Jul 24 2001 | ITO, TETSUYA | TAIYO YUDEN CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012023 | /0319 | |
Jul 26 2001 | Taiyo Yuden Co., Ltd. | (assignment on the face of the patent) | / |
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