Patent
   D453746
Priority
Jul 26 2001
Filed
Jul 26 2001
Issued
Feb 19 2002
Expiry
Feb 19 2016
Assg.orig
Entity
unknown
13
7
n/a
The ornamental design for a hybrid integrated circuit device, as shown and described.

FIG. 1 is a perspective view of a hybrid integrated circuit device showing an embodiment of our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Kato, Hideki, Ito, Tetsuya, Igarashi, Tomohiro, Yoda, Hideki

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ER8907,
Patent Priority Assignee Title
5742480, Nov 02 1994 SUMITOMO ELECTRIC INDUSTRIES, LTD Optical module circuit board having flexible structure
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jul 24 2001KATO, HIDEKITAIYO YUDEN CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0120230319 pdf
Jul 24 2001IGARASHI, TOMOHIROTAIYO YUDEN CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0120230319 pdf
Jul 24 2001YODA, HIDEKITAIYO YUDEN CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0120230319 pdf
Jul 24 2001ITO, TETSUYATAIYO YUDEN CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0120230319 pdf
Jul 26 2001Taiyo Yuden Co., Ltd.(assignment on the face of the patent)
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