Conductive clip for a semiconductor package

Abstract

Description

FIG. 1 is a perspective view of a conductive clip according to our design;

FIG. 2 is another perspective view of a conductive clip according to our design, the broken lines being included for illustrative purposes and forming no part of the claimed design;

FIG. 3 is a top plan view of a conductive clip according to our design;

FIG. 4 is a bottom plan view of a conductive clip according to our design, the broken lines being included for illustration purposes and forming no part of the claimed design;

FIG. 5 is a side elevational view of a conductive clip according to our design; and,

FIG. 6 is a side elevational view of a conductive clip according to our design.

Claims

The ornamental design for a conductive clip for a semiconductor package, as shown and described.