Patent
   D877103
Priority
Mar 28 2014
Filed
Feb 13 2019
Issued
Mar 03 2020
Expiry
Mar 03 2035
Assg.orig
Entity
unknown
0
10
n/a
The ornamental design for a conductor pad, as shown and described.

FIG. 1 is a top plan view of a first embodiment of a conductor pad showing our new design, the bottom plan view being a mirror image thereof.

FIG. 2 is a top plan view of a second embodiment of a conductor pad showing our new design, the bottom plan view being a mirror image thereof.

FIG. 3 is a top plan view of a third embodiment of a conductor pad showing our new design, the bottom plan view being a mirror image thereof.

FIG. 4 is a top plan view of a fourth embodiment of a conductor pad showing our new design, the bottom plan view being a mirror image thereof.

FIG. 5 is a top plan view of a fifth embodiment of a conductor pad showing our new design, the bottom plan view being a mirror image thereof.

FIG. 6 is a top plan view of a sixth embodiment of a conductor pad showing our new design, the bottom plan view being a mirror image thereof.

FIG. 7 is a top plan view of a seventh embodiment of a conductor pad showing our new design, the bottom plan view being a mirror image thereof.

FIG. 8 is a top plan view of an eighth embodiment of a conductor pad showing our new design, the bottom plan view being a mirror image thereof.

FIG. 9 is a top plan view of a ninth embodiment of a conductor pad showing our new design, the bottom plan view being a mirror image thereof.

FIG. 10 is a top plan view of a tenth embodiment of a conductor pad showing our new design, the bottom plan view being a mirror image thereof.

FIG. 11 is a top plan view of an eleventh embodiment of a conductor pad showing our new design, the bottom plan view being a mirror image thereof; and,

FIG. 12 is a top plan view of a twelfth embodiment of a conductor pad showing our new design, the bottom plan view being a mirror image thereof.

The broken-line disclosure in the views is understood to represent portions of the article in which the claimed design is embodied, but which form no part of the claimed design.

All surfaces not shown form no part of the claimed design.

Garner, Richard, Venk, Sridharan, Picard, Jr., Earl Alfred, Dai, Qi

Patent Priority Assignee Title
Patent Priority Assignee Title
6803582, Nov 29 2002 Oregon Health & Science University One dimensional beam blanker array
8791560, Jan 10 2006 Infineon Technologies Americas Corp Interdigitated conductive support for GaN semiconductor die
9082626, Jul 26 2013 Infineon Technologies AG Conductive pads and methods of formation thereof
D327883, Feb 09 1990 Gemplus Card International Connecting terminal for chip cards
D328599, Apr 10 1990 Gemplus Card International Connecting terminal for chip cards
D503691, Mar 28 2001 International Rectifier Corporation Conductive clip for a semiconductor package
D598380, May 09 2008 FUJIFILM Corporation Conductive sheet
D613690, Dec 09 2008 FUJIFILM Corporation Conductive sheet
D615927, May 09 2008 FUJIFILM Corporation Conductive sheet
D774477, Mar 28 2014 ABL IP Holding LLC Conductor pads
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Mar 28 2014VENK, SRIDHARANOSRAM SYLVANIA IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0483290039 pdf
Mar 28 2014PICARD, EARL ALFRED, JROSRAM SYLVANIA IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0483290039 pdf
Mar 28 2014DAI, QIOSRAM SYLVANIA IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0483290039 pdf
Mar 28 2014GARNER, RICHARDOSRAM SYLVANIA IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0483290039 pdf
Feb 13 2019Osram Sylvania Inc.(assignment on the face of the patent)
Jul 01 2021OSRAM SYLVANIA IncACUITY BRANDS LIGHTING, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0580810267 pdf
Feb 14 2022ACUITY BRANDS LIGHTING, INC ABL IP Holding LLCASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0592200139 pdf
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