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Patent
D825463
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Priority
Jul 18 2016
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Filed
Dec 05 2017
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Issued
Aug 14 2018
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Expiry
Aug 14 2033
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Assg.orig
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Entity
unknown
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2
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10
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n/a
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The ornamental design for a heat spreader, as shown and described.
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FIG. 1 is a perspective view of a heat spreader depicting our new design;
FIG. 2 is a top view thereof;
FIG. 3 is a bottom view thereof;
FIG. 4 is an end view thereof;
FIG. 5 is an opposite end view thereof;
FIG. 6 is a side view thereof;
FIG. 7 is an opposite side view thereof; and,
FIG. 8 is an additional perspective view thereof.
The broken lines shown in the figures illustrate the portions of the design that form no part of the claimed design.
Krivonak, Andrew Louis, Perlaguri, Shreenath Shekar, Yammanuru, Rajendra, Radhakrishnan, Arunpandi
Patent |
Priority |
Assignee |
Title |
6118177, |
Nov 17 1998 |
Bell Semiconductor, LLC |
Heatspreader for a flip chip device, and method for connecting the heatspreader |
6538320, |
Jun 28 2000 |
GLOBALFOUNDRIES U S INC |
Heat spreader having holes for rivet-like adhesive connections |
6807058, |
Nov 20 2002 |
LENOVO INTERNATIONAL LIMITED |
Heat sink and combinations |
7005738, |
Jan 30 2001 |
Thermal Corp. |
Semiconductor package with lid heat spreader |
7575956, |
Nov 24 2003 |
STATS CHIPPAC PTE LTD |
Fabrication method for semiconductor package heat spreaders |
9353996, |
Jul 21 2010 |
Asia Vital Components Co., Ltd. |
Pressure difference driven heat spreader |
D411509, |
Nov 12 1998 |
HUBBELL LENOIR CITY, INC |
Transformer mounting pad |
D503691, |
Mar 28 2001 |
International Rectifier Corporation |
Conductive clip for a semiconductor package |
D661261, |
Dec 13 2010 |
Emcore Corporation |
Heat spreader for a VCSEL array and mounting support |
D773409, |
Sep 16 2015 |
|
Multi-chamber heat sink module |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a