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Patent
D661261
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Priority
Dec 13 2010
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Filed
Dec 13 2010
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Issued
Jun 05 2012
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Expiry
Jun 05 2026
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Assg.orig
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Entity
unknown
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2
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13
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n/a
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The ornamental design for a heat spreader for a vcsel array and mounting support, as shown and described.
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FIG. 1 is a top perspective view of the heat spreader for a VCSEL array and mounting support;
FIG. 2 is a top elevation view thereof;
FIG. 3 is a bottom elevation view thereof;
FIG. 4 is a right side elevation view thereof;
FIG. 5 is a left side elevation view thereof;
FIG. 6 is a front elevation view thereof; and,
FIG. 7 is a rear elevation view thereof.
The broken lines illustrated in the Figures form no part of the claimed design.
Taylor, James, Kan, Jiaxi, Desnoyer, Brian
Patent |
Priority |
Assignee |
Title |
5973407, |
Jul 23 1998 |
AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD |
Integral heat spreader for semiconductor package |
6118177, |
Nov 17 1998 |
Bell Semiconductor, LLC |
Heatspreader for a flip chip device, and method for connecting the heatspreader |
6538320, |
Jun 28 2000 |
GLOBALFOUNDRIES U S INC |
Heat spreader having holes for rivet-like adhesive connections |
6631077, |
Feb 11 2002 |
Thermal Corp.; Thermal Corp |
Heat spreader with oscillating flow |
6807058, |
Nov 20 2002 |
LENOVO INTERNATIONAL LIMITED |
Heat sink and combinations |
6906413, |
May 30 2003 |
Honeywell International Inc |
Integrated heat spreader lid |
7015073, |
Apr 05 2002 |
Intel Corporation |
Method of forming heat spreader with down set leg attachment feature |
7122911, |
Nov 18 2003 |
Advanced Semiconductor Engineering, Inc. |
Heat spreader and semiconductor device package having the same |
7575956, |
Nov 24 2003 |
STATS CHIPPAC PTE LTD |
Fabrication method for semiconductor package heat spreaders |
20050072557, |
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20080283222, |
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20090101318, |
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20090166008, |
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Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a