FIG. 1 is a top perspective view of an adjustable fixture for aligning column grid array substrates, showing our new design;
FIG. 2 is a bottom perspective view thereof;
FIG. 3 is a top view thereof;
FIG. 4 is a bottom view thereof;
FIG. 5 is a left side view thereof;
FIG. 6 is a right side view thereof;
FIG. 7 is a front view thereof; and,
FIG. 8 is a rear view thereof.
The broken lines in the drawings represent portions of the adjustable fixture for aligning column grid array substrates that form not part of the claimed design.
Patent |
Priority |
Assignee |
Title |
3838984, |
|
|
|
4664309, |
Jun 30 1983 |
TYCO ELECTRONICS CORPORATION, A CORPORATION OF PENNSYLVANIA |
Chip mounting device |
4705205, |
Jun 30 1983 |
TYCO ELECTRONICS CORPORATION, A CORPORATION OF PENNSYLVANIA |
Chip carrier mounting device |
4712721, |
Mar 17 1986 |
TYCO ELECTRONICS CORPORATION, A CORPORATION OF PENNSYLVANIA |
Solder delivery systems |
4842184, |
Jun 23 1988 |
Lockheed Martin Corp |
Method and apparatus for applying solder preforms |
5029748, |
Jul 10 1987 |
AMP Incorporated |
Solder preforms in a cast array |
5040717, |
Mar 27 1990 |
DOVER TECHNOLOGIES INTERNATIONAL, INC ; Delaware Capital Formation, Inc |
Solder delivery system |
5323947, |
May 03 1993 |
Freescale Semiconductor, Inc |
Method and apparatus for use in forming pre-positioned solder bumps on a pad arrangement |
5497938, |
Sep 01 1994 |
Intel Corporation |
Tape with solder forms and methods for transferring solder to chip assemblies |
5626278, |
Apr 15 1994 |
|
Solder delivery and array apparatus |
5695109, |
Nov 22 1995 |
Transpacific IP Ltd |
Solder paste inter-layer alignment apparatus for area-array on-board rework |
6136128, |
Jun 23 1998 |
AMERASIA INTERNATIONAL TECHNOLOGY, INC |
Method of making an adhesive preform lid for electronic devices |
6204678, |
Mar 17 1997 |
U S BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT |
Direct connect interconnect for testing semiconductor dice and wafers |
6251767, |
Jan 14 1997 |
Texas Instruments Incorporated |
Ball grid assembly with solder columns |
6276596, |
Aug 28 2000 |
International Business Machines Corporation |
Low temperature solder column attach by injection molded solder and structure formed |
6296173, |
Jul 17 1996 |
International Business Machines Corporation |
Method and apparatus for soldering ball grid array modules to substrates |
6412685, |
Jan 28 1997 |
GALAHAD, CO , A CORPORATION OF FLORIDA |
Method and apparatus for release and optional inspection for conductive preforms placement apparatus |
6955285, |
Dec 17 2002 |
Senju Metal Industry Co., Ltd. |
Apparatus for aligning and dispensing solder columns in an array |
7569474, |
Jan 07 2004 |
Infineon Technologies AG |
Method and apparatus for soldering modules to substrates |
8277255, |
Dec 10 2010 |
Tyco Electronics Corporation |
Interconnect member for an electronic module with embedded components |
8739392, |
Jun 30 2009 |
Intel Corporation |
Cast grid array (CGA) package and socket |
9108262, |
Apr 17 2014 |
TopLine Corporation |
Disposable apparatus for aligning and dispensing solder columns in an array |
9629259, |
Aug 16 2016 |
TopLine Corporation |
Refillable apparatus for aligning and depositing solder columns in a column grid array |
20020102767, |
|
|
|
20040144834, |
|
|
|
20090223710, |
|
|
|
20090267227, |
|
|
|
20140262498, |
|
|
|
D402273, |
Dec 26 1996 |
Sony Corporation; Japan Solderless Terminal Mfg. Co., Ltd. |
Connector for printed circuit boards |
D402274, |
Apr 01 1997 |
Sony Corporation; Japan Solderless Terminal Mfg. Co., Ltd. |
Connector for printed circuit boards |
D407383, |
Dec 11 1996 |
Sony Corporation; Japan Solderless Terminal Mfg. Co., Ltd. |
Connector for printed circuit boards |
D421968, |
Apr 21 1998 |
Advantest Corporation |
Contactor for semiconductor IC testers |
D426522, |
Apr 21 1998 |
Advantest Corporation |
Contactor for semiconductor IC testers |
D432504, |
Apr 21 1998 |
Advantest Corporation |
Contactor for semiconductor IC testers |
D503691, |
Mar 28 2001 |
International Rectifier Corporation |
Conductive clip for a semiconductor package |
D808350, |
Mar 06 2017 |
TopLine Corporation |
Fixture for delivering interconnect members onto a substrate |
D874413, |
Nov 02 2018 |
TopLine Corporation |
Fixture for delivering 1752 solder columns onto a substrate |