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We claim the ornamental design for a connector for printed circuit boards, as shown and described. |
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FIG. 1 is a front view of a connector for printed circuit boards showing our new design in a first embodiment, while the rear view corresponds to the front view;
FIG. 2 is a top view of the connector for printed circuit boards;
FIG. 3 is a bottom view of the connector for printed circuit boards;
FIG. 4 is a left side view of the connector for printed circuit boards, while the right side view corresponds to the left side view;
FIG. 5 is a sectional view along the line V--V in FIG. 2;
FIG. 6 is a sectional view along the line VI--VI in FIG. 1;
FIG. 7 is a sectional view along the line VII--VII in FIG. 1;
FIG. 8 is a sectional view along the line VI--VI in FIG. 1 in a connecting condition of printed circuit boards; and,
FIG. 9 is a sectional view along the line VII--VII in FIG. 1 in a connecting condition of printed circuit boards.
The broken-line disclosure of a portion of a circuit board in the views is for illustrative purposes only and forms no part of the claimed design.
Nakashima, Terumi, Hashimoto, Narihiko, Kataoka, Yasuhiro
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| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| May 01 1997 | NAKASHIMA, TERUMI | Sony Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 008564 | /0726 | |
| May 01 1997 | NAKASHIMA, TERUMI | JAPAN SOLDERLESS TERMINAL MFG CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 008564 | /0726 | |
| May 03 1997 | HASHIMOTO, NARIHIKO | Sony Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 008564 | /0726 | |
| May 03 1997 | HASHIMOTO, NARIHIKO | JAPAN SOLDERLESS TERMINAL MFG CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 008564 | /0726 | |
| May 14 1997 | KATAOKA, YASUHIRO | Sony Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 008564 | /0726 | |
| May 14 1997 | KATAOKA, YASUHIRO | JAPAN SOLDERLESS TERMINAL MFG CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 008564 | /0726 | |
| Jun 03 1997 | Sony Corporation | (assignment on the face of the patent) | / | |||
| Jun 03 1997 | Japan Solderless Terminal Mfg. Co., Ltd. | (assignment on the face of the patent) | / |
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