Patent
   D465463
Priority
Jun 15 2001
Filed
Feb 19 2002
Issued
Nov 12 2002
Expiry
Nov 12 2016
Assg.orig
Entity
unknown
14
8
n/a
The ornamental design for a hybrid integrated circuit device, as shown and described.

FIG. 1 is a perspective view of a hybird integrated circuit device showing an embodiment of our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof; and,

FIG. 8 is a cross sectional view, taken along the line A--A of FIG. 6.

Ito, Tetsuya, Wasada, Yoshiyuki, Tomaru, Naoki

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Patent Priority Assignee Title
5742480, Nov 02 1994 SUMITOMO ELECTRIC INDUSTRIES, LTD Optical module circuit board having flexible structure
5838546, Apr 12 1996 NEC Corporation Mounting structure for a semiconductor circuit
5905639, Sep 29 1997 Raytheon Company Three-dimensional component stacking using high density multichip interconnect decals and three-bond daisy-chained wedge bonds
6028773, Nov 14 1997 Apple Inc Packaging for silicon sensors
6201701, Mar 11 1998 STELLAR MICROELECTRONICS, INC Integrated substrate with enhanced thermal characteristics
D357671, Sep 16 1993 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
D396450, Dec 24 1996 FUJI ELECTRIC CO , LTD Hybrid integrated circuit for electric power control
D430856, Aug 05 1999 Alan W., Wilkerson Circuit board
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Feb 19 2002Taiyo Yuden Co., Ltd.(assignment on the face of the patent)
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