Patent
   D674760
Priority
Apr 01 2011
Filed
Aug 22 2011
Issued
Jan 22 2013
Expiry
Jan 22 2027
Assg.orig
Entity
unknown
38
18
n/a
The ornamental design for a semiconductor device, as shown and described.

FIG. 1 is a perspective view of front, top plan and right side of a semiconductor device showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof.

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom view thereof; and,

FIG. 8 is a cross-sectional view taken along line 8-8 in FIG. 2 view omitting interior mechanism thereof.

Mochizuki, Eiji, Yamada, Tadanori, Denta, Toshio

Patent Priority Assignee Title
9497570, Feb 06 2014 NIMBELINK CORP Embedded wireless modem
D689833, May 19 2011 Fuji Electric Co., Ltd. Semiconductor device
D693318, Oct 27 2011 SUMITOMO ELECTRIC INDUSTRIES, LTD Semiconductor module for power conversion
D703625, Dec 06 2012 SAMSUNG ELECTRO-MECHANICS CO , LTD Power semiconductor module
D705184, Jul 11 2013 Fuji Electric Co., Ltd. Semiconductor module
D717253, Oct 11 2012 SAMSUNG ELECTRO-MECHANICS CO , LTD Semiconductor device
D717254, Oct 11 2012 SAMSUNG ELECTRO-MECHANICS CO , LTD Semiconductor device
D717255, Sep 20 2012 SAMSUNG ELECTRO-MECHANICS CO , LTD Semiconductor device
D717256, Sep 20 2012 SAMSUNG ELECTRO-MECHANICS CO , LTD Semiconductor device
D719113, Sep 20 2012 SAMSUNG ELECTRO-MECHANICS CO , LTD Semiconductor device
D719537, May 08 2013 Mitsubishi Electric Corporation Semiconductor device
D719926, Sep 20 2012 SAMSUNG ELECTRO-MECHANICS CO , LTD Semiconductor device
D721048, Jun 17 2013 FUJI ELECTRIC CO , LTD Semiconductor module
D721340, Dec 21 2012 Fuji Electric Co., Ltd.; FUJI ELECTRIC CO , LTD Semiconductor module
D731491, Feb 07 2014 NIMBELINK CORP Embedded cellular modem
D748595, Feb 03 2015 Infineon Technologies AG Power semiconductor module
D754084, Aug 21 2013 Mitsubishi Electric Corporation Semiconductor device
D755741, Feb 18 2015 DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT Power device package
D755742, Feb 18 2015 DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT Power device package
D759604, Jun 17 2015 Mitsubishi Electric Corporation Semiconductor device
D761746, Nov 04 2014 Sumitomo Electric Industries, Ltd. Semiconductor module for power conversion
D762597, Aug 07 2014 Infineon Technologies AG Power semiconductor module
D769834, May 08 2013 Mitsubishi Electric Corporation Semiconductor device
D770994, Apr 02 2014 Mitsubishi Electric Corporation Power semiconductor device
D772182, Apr 02 2014 Mitsubishi Electric Corporation Power semiconductor device
D777124, Apr 02 2014 Mitsubishi Electric Corporation Power semiconductor device
D783550, Sep 29 2014 Mitsubishi Electric Corporation Power semiconductor device
D785577, Aug 21 2013 Mitsubishi Electric Corporation Semiconductor device
D805485, Aug 21 2013 Mitsubishi Electric Corporation Semiconductor device
D845906, Mar 09 2017 SENSATA TECHNOLOGIES, INC Electrical shunt
D856947, Oct 19 2017 Rohm Co., Ltd. Semiconductor device
D893439, May 07 2018 ADURA, LLC Circuit board having arrangements of light-emitting diodes
D900759, Nov 07 2018 ROHM CO , LTD Semiconductor device
D902164, Jan 24 2019 Kioxia Corporation Integrated circuit card
D903613, Jun 26 2018 Rohm Co., Ltd. Semiconductor module
D906273, Nov 07 2018 ROHM CO , LTD Semiconductor device
D913978, Jun 26 2018 Rohm Co., Ltd. Semiconductor module
D933618, Oct 31 2018 Asahi Kasei Microdevices Corporation Semiconductor module
Patent Priority Assignee Title
4994902, Nov 30 1988 Hitachi, Ltd.; Hitachi Microcomputer Engineering Ltd. Semiconductor devices and electronic system incorporating them
5444297, Jun 17 1992 Mitsubishi Denki Kabushiki Kaisha Noise resistant semiconductor power module
6521983, Aug 29 2000 Mitsubishi Denki Kabushiki Kaisha Semiconductor device for electric power
6995461, Jul 23 2001 FUJI ELECTRIC CO , LTD Semiconductor device
7425757, Dec 22 2003 FUJI ELECTRIC CO , LTD Semiconductor power module
7706146, Apr 20 2006 Semiconductor Components Industries, LLC Power system module and method of fabricating the same
7868451, May 30 2006 Mahle International GmbH Resin sealing semiconductor device and electronic device using resin sealing semiconductor device
8093692, Mar 26 2007 Mitsubishi Electric Corporation Semiconductor device packaging including a power semiconductor element
8102655, Sep 27 2007 Semiconductor Components Industries, LLC Circuit device
8107255, Sep 27 2007 Semiconductor Components Industries, LLC Circuit device and method of manufacturing the same
20010038143,
20100149774,
20110044012,
D389808, Jan 09 1996 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
D589012, Mar 17 2008 Fuji Electric Device Technology Co., Ltd. Semiconductor device
D606951, Nov 14 2008 Fuji Electric Device Technology Co, Ltd. Semiconductor device
D653633, Dec 14 2010 Fuji Electric Co., Ltd. Semiconductor
D653634, Oct 28 2010 Fuji Electric Co., Ltd. Semiconductor
////
Executed onAssignorAssigneeConveyanceFrameReelDoc
Jun 23 2011MOCHIZUKI, EIJIFUJI ELECTRIC CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0268050021 pdf
Jun 27 2011DENTA, TOSHIOFUJI ELECTRIC CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0268050021 pdf
Jun 27 2011YAMADA, TADANORIFUJI ELECTRIC CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0268050021 pdf
Aug 22 2011Fuji Electric Co., Ltd.(assignment on the face of the patent)
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule