PTO
Wrapper
PDF
|
Dossier
Espace
Google
|
|
Patent
D674760
|
Priority
Apr 01 2011
|
Filed
Aug 22 2011
|
Issued
Jan 22 2013
|
Expiry
Jan 22 2027
|
|
Assg.orig
|
|
Entity
unknown
|
38
|
18
|
n/a
|
|
|
The ornamental design for a semiconductor device, as shown and described.
|
FIG. 1 is a perspective view of front, top plan and right side of a semiconductor device showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof.
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom view thereof; and,
FIG. 8 is a cross-sectional view taken along line 8-8 in FIG. 2 view omitting interior mechanism thereof.
Mochizuki, Eiji, Yamada, Tadanori, Denta, Toshio
Patent |
Priority |
Assignee |
Title |
9497570, |
Feb 06 2014 |
NIMBELINK CORP |
Embedded wireless modem |
D689833, |
May 19 2011 |
Fuji Electric Co., Ltd. |
Semiconductor device |
D693318, |
Oct 27 2011 |
SUMITOMO ELECTRIC INDUSTRIES, LTD |
Semiconductor module for power conversion |
D703625, |
Dec 06 2012 |
SAMSUNG ELECTRO-MECHANICS CO , LTD |
Power semiconductor module |
D705184, |
Jul 11 2013 |
Fuji Electric Co., Ltd. |
Semiconductor module |
D717253, |
Oct 11 2012 |
SAMSUNG ELECTRO-MECHANICS CO , LTD |
Semiconductor device |
D717254, |
Oct 11 2012 |
SAMSUNG ELECTRO-MECHANICS CO , LTD |
Semiconductor device |
D717255, |
Sep 20 2012 |
SAMSUNG ELECTRO-MECHANICS CO , LTD |
Semiconductor device |
D717256, |
Sep 20 2012 |
SAMSUNG ELECTRO-MECHANICS CO , LTD |
Semiconductor device |
D719113, |
Sep 20 2012 |
SAMSUNG ELECTRO-MECHANICS CO , LTD |
Semiconductor device |
D719537, |
May 08 2013 |
Mitsubishi Electric Corporation |
Semiconductor device |
D719926, |
Sep 20 2012 |
SAMSUNG ELECTRO-MECHANICS CO , LTD |
Semiconductor device |
D721048, |
Jun 17 2013 |
FUJI ELECTRIC CO , LTD |
Semiconductor module |
D721340, |
Dec 21 2012 |
Fuji Electric Co., Ltd.; FUJI ELECTRIC CO , LTD |
Semiconductor module |
D731491, |
Feb 07 2014 |
NIMBELINK CORP |
Embedded cellular modem |
D748595, |
Feb 03 2015 |
Infineon Technologies AG |
Power semiconductor module |
D754084, |
Aug 21 2013 |
Mitsubishi Electric Corporation |
Semiconductor device |
D755741, |
Feb 18 2015 |
DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT |
Power device package |
D755742, |
Feb 18 2015 |
DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT |
Power device package |
D759604, |
Jun 17 2015 |
Mitsubishi Electric Corporation |
Semiconductor device |
D761746, |
Nov 04 2014 |
Sumitomo Electric Industries, Ltd. |
Semiconductor module for power conversion |
D762597, |
Aug 07 2014 |
Infineon Technologies AG |
Power semiconductor module |
D769834, |
May 08 2013 |
Mitsubishi Electric Corporation |
Semiconductor device |
D770994, |
Apr 02 2014 |
Mitsubishi Electric Corporation |
Power semiconductor device |
D772182, |
Apr 02 2014 |
Mitsubishi Electric Corporation |
Power semiconductor device |
D777124, |
Apr 02 2014 |
Mitsubishi Electric Corporation |
Power semiconductor device |
D783550, |
Sep 29 2014 |
Mitsubishi Electric Corporation |
Power semiconductor device |
D785577, |
Aug 21 2013 |
Mitsubishi Electric Corporation |
Semiconductor device |
D805485, |
Aug 21 2013 |
Mitsubishi Electric Corporation |
Semiconductor device |
D845906, |
Mar 09 2017 |
SENSATA TECHNOLOGIES, INC |
Electrical shunt |
D856947, |
Oct 19 2017 |
Rohm Co., Ltd. |
Semiconductor device |
D893439, |
May 07 2018 |
ADURA, LLC |
Circuit board having arrangements of light-emitting diodes |
D900759, |
Nov 07 2018 |
ROHM CO , LTD |
Semiconductor device |
D902164, |
Jan 24 2019 |
Kioxia Corporation |
Integrated circuit card |
D903613, |
Jun 26 2018 |
Rohm Co., Ltd. |
Semiconductor module |
D906273, |
Nov 07 2018 |
ROHM CO , LTD |
Semiconductor device |
D913978, |
Jun 26 2018 |
Rohm Co., Ltd. |
Semiconductor module |
D933618, |
Oct 31 2018 |
Asahi Kasei Microdevices Corporation |
Semiconductor module |
Patent |
Priority |
Assignee |
Title |
4994902, |
Nov 30 1988 |
Hitachi, Ltd.; Hitachi Microcomputer Engineering Ltd. |
Semiconductor devices and electronic system incorporating them |
5444297, |
Jun 17 1992 |
Mitsubishi Denki Kabushiki Kaisha |
Noise resistant semiconductor power module |
6521983, |
Aug 29 2000 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device for electric power |
6995461, |
Jul 23 2001 |
FUJI ELECTRIC CO , LTD |
Semiconductor device |
7425757, |
Dec 22 2003 |
FUJI ELECTRIC CO , LTD |
Semiconductor power module |
7706146, |
Apr 20 2006 |
Semiconductor Components Industries, LLC |
Power system module and method of fabricating the same |
7868451, |
May 30 2006 |
Mahle International GmbH |
Resin sealing semiconductor device and electronic device using resin sealing semiconductor device |
8093692, |
Mar 26 2007 |
Mitsubishi Electric Corporation |
Semiconductor device packaging including a power semiconductor element |
8102655, |
Sep 27 2007 |
Semiconductor Components Industries, LLC |
Circuit device |
8107255, |
Sep 27 2007 |
Semiconductor Components Industries, LLC |
Circuit device and method of manufacturing the same |
20010038143, |
|
|
|
20100149774, |
|
|
|
20110044012, |
|
|
|
D389808, |
Jan 09 1996 |
Fuji Electric Co., Ltd. |
Hybrid integrated circuit for electric power control |
D589012, |
Mar 17 2008 |
Fuji Electric Device Technology Co., Ltd. |
Semiconductor device |
D606951, |
Nov 14 2008 |
Fuji Electric Device Technology Co, Ltd. |
Semiconductor device |
D653633, |
Dec 14 2010 |
Fuji Electric Co., Ltd. |
Semiconductor |
D653634, |
Oct 28 2010 |
Fuji Electric Co., Ltd. |
Semiconductor |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a