Patent
   D761746
Priority
Nov 04 2014
Filed
May 01 2015
Issued
Jul 19 2016
Expiry
Jul 19 2030
Assg.orig
Entity
unknown
7
30
n/a
The ornamental design for a semiconductor module for power conversion, as shown and described.

FIG. 1 is a front view of a semiconductor module for power conversion showing my new design.

FIG. 2 is a rear view of the semiconductor module for power conversion of FIG. 1.

FIG. 3 is a top plan view of the semiconductor module for power conversion of FIG. 1.

FIG. 4 is a bottom plan view of the semiconductor module for power conversion of FIG. 1.

FIG. 5 is a right side view of the semiconductor module for power conversion of FIG. 1.

FIG. 6 is a left side view of the semiconductor module for power conversion of FIG. 1; and,

FIG. 7 is a perspective view of the semiconductor module for power conversion of FIG. 1.

The dashed-dot-dashed lines represent the boundary lines of the claimed design. The even dashed lines represent unclaimed environment that form no part of the claimed design.

Toyoshima, Shigenori

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Patent Priority Assignee Title
5408128, Sep 15 1993 International Rectifier Corporation High power semiconductor device module with low thermal resistance and simplified manufacturing
5410450, Dec 10 1991 Fuji Electric Co., Ltd. Internal wiring structure of a semiconductor device
5512782, Oct 13 1993 FUJI ELECTRIC CO , LTD Semiconductor device for DC/AC converter
6521983, Aug 29 2000 Mitsubishi Denki Kabushiki Kaisha Semiconductor device for electric power
8093692, Mar 26 2007 Mitsubishi Electric Corporation Semiconductor device packaging including a power semiconductor element
8941228, Mar 16 2011 FUJI ELECTRIC CO , LTD Semiconductor module and manufacturing method thereof
D357672, Sep 16 1993 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
D364383, May 11 1994 Fuji Electric Co., Ltd. Semi-conductor element with terminal casing
D364384, May 23 1994 Fuji Electric Co., Ltd. Semi-conductor element with terminal casing
D364385, May 11 1994 Fuji Electric Co., Ltd. Semi-conductor element with terminal casing
D441726, Jul 14 1999 Kabushiki Kaisha Toyoda Jidoshokki Seisakusho Semiconductor element
D464618, Apr 23 2001 Kabushiki Kaisha Toshiba Power converter
D587662, Dec 20 2007 Fuji Electric Device Technology Co., Ltd. Semiconductor device
D589012, Mar 17 2008 Fuji Electric Device Technology Co., Ltd. Semiconductor device
D606951, Nov 14 2008 Fuji Electric Device Technology Co, Ltd. Semiconductor device
D653633, Dec 14 2010 Fuji Electric Co., Ltd. Semiconductor
D653634, Oct 28 2010 Fuji Electric Co., Ltd. Semiconductor
D674760, Apr 01 2011 Fuji Electric Co., Ltd. Semiconductor device
D686174, Aug 12 2011 FUJI ELECTRIC CO., LTD Semiconductor device
D689446, Oct 28 2010 Fuji Electric Co., Ltd. Semiconductor
D703625, Dec 06 2012 SAMSUNG ELECTRO-MECHANICS CO , LTD Power semiconductor module
D704670, Jan 24 2013 Fuji Electric Co., Ltd. Semiconductor device
D704671, Jan 24 2013 Fuji Electric Co., Ltd. Semiconductor device
D705184, Jul 11 2013 Fuji Electric Co., Ltd. Semiconductor module
D706232, Dec 21 2012 Fuji Electric Co., Ltd.; FUJI ELECTRIC CO , LTD Semiconductor device
D710317, Jan 24 2013 Fuji Electric Co., Inc. Semiconductor device
D710318, Jan 24 2013 Fuji Electric Co., Ltd. Semiconductor device
D710319, Jan 24 2013 Fuji Electric Co., Ltd. Semiconductor device
D742338, Aug 27 2014 Apple Inc MLB module for electronic device
D748595, Feb 03 2015 Infineon Technologies AG Power semiconductor module
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Mar 17 2015TOYOSHIMA, SHIGENORISUMITOMO ELECTRIC INDUSTRIES, LTDASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0355490049 pdf
May 01 2015Sumitomo Electric Industries, Ltd.(assignment on the face of the patent)
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