Patent
   D719537
Priority
May 08 2013
Filed
Aug 16 2013
Issued
Dec 16 2014
Expiry
Dec 16 2028
Assg.orig
Entity
unknown
36
38
n/a
The ornamental design for a semiconductor device, as shown and described.

FIG. 1 is a front, top and right side perspective view of a semiconductor device, showing our new design;

FIG. 2 is a rear, top and left side perspective view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a right side elevational view thereof;

FIG. 7 is a top plan view thereof;

FIG. 8 is a bottom plan view thereof;

FIG. 9 is a perspective view shown in a used condition with a device shown in broken lines; and,

FIG. 10 is a front view shown in a used condition with a device shown in broken lines.

The broken lines shown in the drawings represent portions of the semiconductor device that form no part of the claimed design.

Miyamoto, Noboru, Ishihara, Mikio, Kawase, Tatsuya

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Executed onAssignorAssigneeConveyanceFrameReelDoc
Aug 16 2013Mitsubishi Electric Corporation(assignment on the face of the patent)
Aug 20 2013KAWASE, TATSUYAMitsubishi Electric CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0312340172 pdf
Aug 20 2013MIYAMOTO, NOBORUMitsubishi Electric CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0312340172 pdf
Aug 20 2013ISHIHARA, MIKIOMitsubishi Electric CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0312340172 pdf
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