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The ornamental design for a semi-conductor mounting substrate, as shown. |
FIG. 1 is a top perspective view of a semi-conductor mounting substrate showing our new design;
FIG. 2 is a bottom perspective view thereof;
FIG. 3 is a right side elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a rear elevational view thereof; and
FIG. 6 is a front elevational view thereof.
Hasegawa, Terutomi, Goto, Nobumichi
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Apr 22 1992 | HASEGAWA, TERUTOMI | IBIDEN CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST | 006363 | /0620 | |
Apr 22 1992 | GOTO, NOBUMICHI | IBIDEN CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST | 006363 | /0620 |
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