Patent
   D317300
Priority
Jul 04 1987
Filed
Jan 04 1988
Issued
Jun 04 1991
Expiry
Jun 04 2005

TERM.DISCL.
Assg.orig
Entity
unknown
13
11
n/a
The ornamental design for a semi-conductor mounting substrate, as shown.

FIG. 1 is a top perspective view of a semi-conductor mounting substrate showing our new design;

FIG. 2 is a bottom perspective view thereof;

FIG. 3 is a right side elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a rear elevational view thereof; and

FIG. 6 is a front elevational view thereof.

Hasegawa, Terutomi, Goto, Nobumichi

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Patent Priority Assignee Title
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Apr 22 1992HASEGAWA, TERUTOMIIBIDEN CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST 0063630620 pdf
Apr 22 1992GOTO, NOBUMICHIIBIDEN CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST 0063630620 pdf
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