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The ornamental design for a mounting substrate for semi-conductors, as shown. |
FIG. 1 is a top perspective view of a mounting substrate for semi-conductors showing our new design;
FIG. 2 is a bottom perspective view thereof;
FIG. 3 is a right side elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a rear elevational view thereof; and
FIG. 6 is a front elevational view thereof.
Hasegawa, Terutomi, Goto, Nobumichi
Patent | Priority | Assignee | Title |
9497570, | Feb 06 2014 | NIMBELINK CORP | Embedded wireless modem |
D608292, | Jan 13 2009 | Campagnie Deutsch GmbH | Electrical connector |
D719537, | May 08 2013 | Mitsubishi Electric Corporation | Semiconductor device |
D731491, | Feb 07 2014 | NIMBELINK CORP | Embedded cellular modem |
D769834, | May 08 2013 | Mitsubishi Electric Corporation | Semiconductor device |
Patent | Priority | Assignee | Title |
4288441, | Jul 30 1980 | Daiichi Seiyaku Co., Ltd. | Nicotinoyl pantetheine derivatives |
4338621, | Feb 04 1980 | SAMSUNG ELECTRONICS CO , LTD | Hermetic integrated circuit package for high density high power applications |
4437141, | Sep 14 1981 | Texas Instruments Incorporated | High terminal count integrated circuit device package |
4458291, | Jul 22 1981 | Fujitsu Limited | Package for enclosing semiconductor elements |
4513355, | Jun 15 1983 | Motorola, Inc. | Metallization and bonding means and method for VLSI packages |
4677526, | Mar 01 1984 | Thomas & Betts International, Inc | Plastic pin grid array chip carrier |
4698663, | Sep 17 1986 | Fujitsu Limited | Heatsink package for flip-chip IC |
EP232837, | |||
JP35653, | |||
JP48945, | |||
JP150353, | |||
JP271863, | |||
JP644662, | |||
JP647072, | |||
JP647074, | |||
JP647078, |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Apr 22 1992 | HASEGAWA, TERUTOMI | IBIDEN CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST | 006364 | /0927 | |
Apr 22 1992 | GOTO, NOBUMICHI | IBIDEN CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST | 006364 | /0927 |
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