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Patent
D939458
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Priority
May 29 2019
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Filed
May 29 2019
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Issued
Dec 28 2021
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Expiry
Dec 28 2036
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Assg.orig
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Entity
unknown
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5
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23
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n/a
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The ornamental design for a leadframe, as shown and described.
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FIG. 1 is a top perspective view of a leadframe showing a first embodiment of our new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a bottom plan view thereof;
FIG. 4 is a front elevational view thereof;
FIG. 5 is a rear elevational view thereof;
FIG. 6 is a right side elevational view thereof; and,
FIG. 7 is a left side elevational view thereof.
The broken lines in the figures represent unclaimed subject matter and form no part of the claimed design.
The shade lines in the figures show contours and not surface ornamentation.
Huang, Li-Ju, Zhang, Michael Yimin
Patent |
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Semiconductor device |
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Semiconductor device |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a