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Patent
D980811
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Priority
May 29 2019
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Filed
Nov 02 2021
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Issued
Mar 14 2023
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Expiry
Mar 14 2038
TERM.DISCL.
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Assg.orig
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Entity
unknown
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0
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32
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n/a
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The ornamental design for a leadframe, as shown and described.
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FIG. 1 is a top perspective view of a leadframe showing a second embodiment of our new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a bottom plan view thereof;
FIG. 4 is a front elevational view thereof, the rear elevational view being a mirror image thereof; and,
FIG. 5 is a right side elevational view thereof, the left side elevational view being a mirror image thereof.
The broken lines in the figures represent unclaimed subject matter and form no part of the claimed design.
The shade lines in the figures show contours and not surface ornamentation.
Huang, Li-Ju, Zhang, Michael Yimin
Patent |
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Oct 23 2017 |
Mitsubishi Electric Corporation |
Semiconductor device |
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Nov 07 2018 |
ROHM CO , LTD |
Semiconductor device |
D906273, |
Nov 07 2018 |
ROHM CO , LTD |
Semiconductor device |
D939458, |
May 29 2019 |
DIODES INCORPORATED |
Leadframe |
D940090, |
May 29 2019 |
DIODES INCORPORATED |
Leadframe |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a