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Patent
D940090
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Priority
May 29 2019
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Filed
Jul 30 2019
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Issued
Jan 04 2022
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Expiry
Jan 04 2037
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Assg.orig
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Entity
unknown
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6
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25
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n/a
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The ornamental design for a leadframe, as shown and described.
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FIG. 1 is a top perspective view of a leadframe showing our new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a bottom plan view thereof;
FIG. 4 is a front elevational view thereof, the rear elevational view being a mirror image thereof; and,
FIG. 5 is a right side elevational view thereof, the left side elevational view being a mirror image thereof.
The broken lines in the figures represent unclaimed subject matter and form no part of the claimed design.
The shade lines in the figures show contours and not surface ornamentation.
Huang, Li-Ju, Zhang, Michael Yimin
Patent |
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Semiconductor device |
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Nov 07 2018 |
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Semiconductor device |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a