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Patent
D969764
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Priority
May 29 2019
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Filed
Oct 28 2021
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Issued
Nov 15 2022
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Expiry
Nov 15 2037
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Assg.orig
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Entity
unknown
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0
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32
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n/a
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The ornamental design for a leadframe, as shown and described.
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FIG. 1 is a top perspective view of a leadframe showing our new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a bottom plan view thereof;
FIG. 4 is a front elevational view thereof;
FIG. 5 is a rear elevational view thereof;
FIG. 6 is a right side elevational view thereof; and,
FIG. 7 is a left side elevational view thereof.
The broken lines in the figures represent unclaimed subject matter and form no part of the claimed design.
The shade lines in the figures show contours and not surface ornamentation.
Huang, Li-Ju, Zhang, Michael Yimin
Patent |
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Oct 23 2017 |
Mitsubishi Electric Corporation |
Semiconductor device |
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Nov 07 2018 |
ROHM CO , LTD |
Semiconductor device |
D906273, |
Nov 07 2018 |
ROHM CO , LTD |
Semiconductor device |
D939458, |
May 29 2019 |
DIODES INCORPORATED |
Leadframe |
D940090, |
May 29 2019 |
DIODES INCORPORATED |
Leadframe |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a