Patent
   D920937
Priority
Mar 29 2019
Filed
Mar 29 2019
Issued
Jun 01 2021
Expiry
Jun 01 2036
Assg.orig
Entity
unknown
4
27
n/a
The ornamental design for a power module device containing semiconductor elements, as shown and described.

1. Power module device containing semiconductor elements

1.1 : Front

1.2 : Back

1.3 : Top

1.4 : Bottom

1.5 : Right

1.6 : Left

1.7 : Perspective

The broken lines showing portions of the power module device containing semiconductor elements form no part of the claim.

This article is a power module device containing semiconductor elements; this product is used to control and/or supply electric power.

Umeda, Soichiro, Kyutoku, Atsushi

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ER2702,
ER7008,
ER7497,
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Mar 29 2019Shindengen Electric Manufacturing Co., Ltd.(assignment on the face of the patent)
Mar 09 2021UMEDA, SOICHIROSHINDENGEN ELECTRIC MANUFACTURING CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0556760891 pdf
Mar 09 2021KYUTOKU, ATSUSHISHINDENGEN ELECTRIC MANUFACTURING CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0556760891 pdf
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