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Patent
D883241
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Priority
Jun 04 2018
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Filed
Nov 28 2018
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Issued
May 05 2020
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Expiry
May 05 2035
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Assg.orig
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Entity
unknown
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3
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15
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n/a
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The ornamental design for a power module, as shown and described.
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FIG. 1 is a front top perspective view of a power module.
FIG. 2 is a right side view thereof.
FIG. 3 is a left side view thereof.
FIG. 4 is a front view thereof.
FIG. 5 is a rear view thereof.
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
The broken lines in the drawing show portions of power module that do not form a part of the claimed design.
Beckedahl, Peter, Bogen, Ingo, Bulovic, Sandro, Steger, Juergen
Patent |
Priority |
Assignee |
Title |
10090774, |
May 05 2017 |
SEMIKRON ELEKTRONIK GMBH & CO KG |
Power electronic arrangement with DC voltage connection element |
10163761, |
May 15 2014 |
SEMIKRON ELEKTRONIK GMBH & CO , KG |
Power semiconductor arrangement |
10270358, |
Jul 14 2017 |
SEMIKRON ELEKTRONIK GMBH & CO KG |
Power electronics submodule having DC and AC voltage terminal elements, and assembly hereof |
20130134572, |
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20140168900, |
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20140376184, |
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20150223339, |
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20160276927, |
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D762185, |
Aug 21 2014 |
Infineon Technologies AG |
Power semiconductor module |
D798832, |
Sep 30 2015 |
Mitsubishi Electric Corporation |
Power semiconductor device |
D799439, |
May 31 2016 |
Rohm Co., Ltd. |
Power converting semiconductor module |
D814431, |
May 15 2015 |
Mitsubishi Electric Corporation |
Power semiconductor device |
D853978, |
Feb 28 2017 |
Infineon Technologies AG |
High-performance semiconductor module |
D858467, |
Jan 05 2017 |
Rohm Co., Ltd. |
Power semiconductor module |
D864132, |
Jan 05 2017 |
Rohm Co., Ltd. |
Power semiconductor module |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a