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Patent
D879729
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Priority
Jun 30 2017
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Filed
Jun 30 2017
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Issued
Mar 31 2020
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Expiry
Mar 31 2035
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Assg.orig
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Entity
unknown
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0
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36
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n/a
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The ornamental design for an electrical module, as shown and described.
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FIG. 1 is a front perspective view of an electrical module, showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a back view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a top view thereof;
FIG. 7 is a bottom view thereof; and,
FIG. 8 is a back perspective view thereof.
Hu, Jian, Li, Xi, Feng, Bin, Pan, Kejia, Wang, Zhenshan
| Patent |
Priority |
Assignee |
Title |
| Patent |
Priority |
Assignee |
Title |
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Mitsubishi Electric Corporation |
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| D810706, |
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FUJI ELECTRIC CO., LTD |
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| D814431, |
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Mitsubishi Electric Corporation |
Power semiconductor device |
| D814433, |
Nov 28 2014 |
FUJI ELECTRIC CO., LTD |
Semiconductor module |
| D851612, |
Jun 30 2017 |
MICRODUINO INC.; MEIKE TECHNOLOGY (BEIJING) LTD. |
Electrical module |
| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Jun 27 2017 | FENG, BIN | MEIKE TECHNOLOGY BEIJING LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 042878 | /0314 |
pdf |
| Jun 27 2017 | LI, XI | MEIKE TECHNOLOGY BEIJING LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 042878 | /0314 |
pdf |
| Jun 27 2017 | PAN, KEJIA | MEIKE TECHNOLOGY BEIJING LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 042878 | /0314 |
pdf |
| Jun 27 2017 | HU, JIAN | MEIKE TECHNOLOGY BEIJING LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 042878 | /0314 |
pdf |
| Jun 27 2017 | WANG, ZHENSHAN | MEIKE TECHNOLOGY BEIJING LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 042878 | /0314 |
pdf |
| Jun 27 2017 | FENG, BIN | MICRODUINO INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 042878 | /0314 |
pdf |
| Jun 27 2017 | LI, XI | MICRODUINO INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 042878 | /0314 |
pdf |
| Jun 27 2017 | PAN, KEJIA | MICRODUINO INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 042878 | /0314 |
pdf |
| Jun 27 2017 | HU, JIAN | MICRODUINO INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 042878 | /0314 |
pdf |
| Jun 27 2017 | WANG, ZHENSHAN | MICRODUINO INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 042878 | /0314 |
pdf |
| Jun 30 2017 | | MEIKE TECHNOLOGY (BEIJING) LTD. | (assignment on the face of the patent) | | / |
| Jun 30 2017 | | MICRODUINO INC. | (assignment on the face of the patent) | | / |
| Date |
Maintenance Fee Events |
n/a
| Date |
Maintenance Schedule |
n/a