Patent
   D981354
Priority
Aug 29 2019
Filed
Feb 25 2020
Issued
Mar 21 2023
Expiry
Mar 21 2038
Assg.orig
Entity
unknown
1
68
n/a
The ornamental design for a power semiconductor module, as shown and described.

FIG. 1 is a front, top and left side perspective view of a power semiconductor module showing our new design;

FIG. 2 is a front, bottom and left side perspective view thereof;

FIG. 3 is a front view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof; and,

FIG. 6 is a left side view thereof.

The even broken lines illustrate portions of the power semiconductor module that form no part of the claimed design. The dash-dotted lines denote the boundary of the claim and form no part of the claimed design.

Shibata, Kotaro, Sawada, Hideki

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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jan 29 2020SHIBATA, KOTAROROHM CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0520190071 pdf
Jan 29 2020SAWADA, HIDEKIROHM CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0520190071 pdf
Feb 25 2020Rohm Co., Ltd.(assignment on the face of the patent)
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