Patent
   D927437
Priority
Aug 29 2019
Filed
Feb 24 2020
Issued
Aug 10 2021
Expiry
Aug 10 2036
Assg.orig
Entity
unknown
4
42
n/a
The ornamental design for a power semiconductor module, as shown and described.

FIG. 1 is a front, top and right side perspective view of a power semiconductor module showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a right side view thereof; and,

FIG. 6 is a left side view thereof.

The broken lines illustrate portions of the power semiconductor module that form no part of the claimed design.

Shibata, Kotaro, Sawada, Hideki

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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jan 29 2020SHIBATA, KOTAROROHM CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0519070502 pdf
Jan 29 2020SAWADA, HIDEKIROHM CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0519070502 pdf
Feb 24 2020Rohm Co., Ltd.(assignment on the face of the patent)
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