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Patent
D927437
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Priority
Aug 29 2019
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Filed
Feb 24 2020
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Issued
Aug 10 2021
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Expiry
Aug 10 2036
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Assg.orig
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Entity
unknown
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4
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42
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n/a
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The ornamental design for a power semiconductor module, as shown and described.
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FIG. 1 is a front, top and right side perspective view of a power semiconductor module showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a right side view thereof; and,
FIG. 6 is a left side view thereof.
The broken lines illustrate portions of the power semiconductor module that form no part of the claimed design.
Shibata, Kotaro, Sawada, Hideki
Patent |
Priority |
Assignee |
Title |
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Infineon Technologies AG |
Power semiconductor module |
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Mitsubishi Electric Corporation |
Semiconductor device |
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Infineon Technologies AG |
Power semiconductor module |
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Infineon Technologies AG |
Power semiconductor module |
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Feb 04 2015 |
Mitsubishi Electric Corporation |
Semiconductor device |
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Fuji Electric Co., Ltd. |
Semiconductor module |
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Fuji Electric Co., Ltd. |
Semiconductor module |
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Power semiconductor module |
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Infineon Technologies AG |
Power semiconductor module |
D776071, |
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Infineon Technologies AG |
Power semiconductor module |
D785577, |
Aug 21 2013 |
Mitsubishi Electric Corporation |
Semiconductor device |
D790491, |
Sep 30 2015 |
Mitsubishi Electric Corporation |
Power semiconductor device |
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Sep 30 2015 |
Mitsubishi Electric Corporation |
Power semiconductor device |
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Mitsubishi Electric Corporation |
Semiconductor device |
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FUJI ELECTRIC CO., LTD |
Semiconductor module |
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ROHM CO , LTD |
Power semiconductor module |
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ROHM CO , LTD |
Power semiconductor module |
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Rohm Co., Ltd. |
Power semiconductor module |
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Rohm Co., Ltd. |
Power semiconductor module |
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Rohm Co., Ltd. |
Power semiconductor module |
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Mitsubishi Electric Corporation |
Semiconductor device |
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Fuji Electric Co., Ltd. |
Semiconductor module |
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JP1605558, |
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Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a