Patent
   D949807
Priority
Mar 13 2020
Filed
Sep 03 2020
Issued
Apr 26 2022
Expiry
Apr 26 2037
Assg.orig
Entity
unknown
5
15
n/a
I claim the ornamental design for a semiconductor module, as shown and described.

FIG. 1 is a front view of a semiconductor module according to the present invention.

FIG. 2 is a top view of the semiconductor module of FIG. 1.

FIG. 3 is a left side view of the semiconductor module of FIG. 1.

FIG. 4 is a rear side view of the semiconductor module of FIG. 1.

FIG. 5 is a bottom view of the semiconductor module of FIG. 1.

FIG. 6 is a right side view of the semiconductor module of FIG. 1; and,

FIG. 7 is a front, top and right side perspective view of the semiconductor module of FIG. 1.

Wada, Norimasa

Patent Priority Assignee Title
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Aug 18 2020WADA, NORIMASASansha Electric Manufacturing Company, LimitedASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0536830920 pdf
Sep 03 2020Sansha Electric Manufacturing Company, Limited(assignment on the face of the patent)
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