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Patent
D934188
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Priority
Aug 29 2019
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Filed
Feb 24 2020
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Issued
Oct 26 2021
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Expiry
Oct 26 2036
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Assg.orig
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Entity
unknown
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3
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54
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n/a
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The ornamental design for a power semiconductor module, as shown and described.
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FIG. 1 is a front, top and right side perspective view of a power semiconductor module showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is an enlarged right side view thereof; and,
FIG. 6 is an enlarged left side view thereof.
The broken lines illustrate portions of the power semiconductor module that form no part of the claimed design.
Shibata, Kotaro, Sawada, Hideki
Patent |
Priority |
Assignee |
Title |
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ROHM CO , LTD |
Power semiconductor module |
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Rohm Co., Ltd. |
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Power semiconductor module |
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Sonnax Transmission Company |
Printed circuit for an automatic transmission solenoid module |
D887998, |
Feb 17 2017 |
STAT PEEL AG |
Chip |
D887999, |
Oct 17 2018 |
OUPIIN ELECTRONIC (KUNSHAN) CO., LTD |
Circuit board with zigzag routes |
D888674, |
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OUPIIN ELECTRONIC (KUNSHAN) CO., LTD. |
Circuit board with zigzag routes |
D892754, |
Jun 04 2018 |
Semikron Elektronik GmbH & Co. KG |
Power module |
D903611, |
Mar 29 2019 |
Mitsubishi Electric Corporation |
Semiconductor device |
D903612, |
Mar 26 2019 |
Fuji Electric Co., Ltd. |
Semiconductor module |
D904325, |
Mar 20 2019 |
Sansha Electric Manufacturing Company, Limited |
Semiconductor module |
D909319, |
Jul 08 2020 |
Impact IP, LLC |
Circuit board |
JP1536191, |
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JP1536359, |
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JP1536360, |
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JP1585830, |
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JP1605558, |
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Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a